IP Library Granted Patent US 7,342,416
Granted Patent B2
US 7,342,416 · App. 11/561,705 · Granted Mar 11, 2008

Tileable field-programmable gate array architecture

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Quick Facts
Patent No.
US 7,342,416
App. No.
11/561,705
Granted
Mar 11, 2008
Kind
B2
Abstract

An apparatus includes an FPGA, which includes a first FPGA tile including a plurality of FGs, a first, second, and third set of routing conductors, and a plurality of IGs. The FGs are arranged in rows and columns with each FG being configured to receive tertiary and regular input signals, perform a logic operation, and generate regular output signals. The third set of routing conductors is coupled to the first set of output ports of the FGs and configured to receive signals, route signals within the FPGA tile, and provide input signals to the third set of input ports of the FGs. The IGs surround the FGs such that one IG is positioned at each end of each row and column. Each IG is coupled to the third set of routing conductors and configured to transfer signals from the third set of routing conductors to outside the first FPGA tile.

Claims (27)

1. A system on a chip comprising:

a microprocessor;

a read-only-memory block;

a random-access memory block;

an FPGA section including at least one FPGA tile comprising:

a plurality of functional groups (FGs) arranged in rows and columns, each configurable to perform Boolean functions, each (FG) having a first, second and third set of input ports and a first and second set of output ports;

a first set of routing conductors disposed within said at least one FPGA tile programmmably coupled to said first set of output ports of said logic components and configured to receive signals, route signals within said at least one FPGA tile, and provide said signals to said first set of input ports of said logic components;

a second set of routing conductors disposed across said at least one FPGA tile and at least one other FPGA tile, independent of said first set of routing conductors coupled to said second set of output ports and that is configured to receive, select and route signals around said at least one FPGA tile and within said at least one FPGA tile, and provide said signals to said second set of input ports of said logic components: and

a third set of routing conductors disposed across said at least one FPGA tile, independent of said first and second set of routing conductors coupled to at least one of said first output ports of said logic components, and employing a plurality of tracks and a plurality of switches to receive signals, route signals around said at least one FPGA tile and within said at least one FPGA tile, and provide said signals to said third set of input ports of said logic components when said first set of routing conductors cannot be used.

2. The system on a chip of claim 1 wherein said plurality of tracks intersect at a plurality of routing interconnect areas.

3. The system on a chip of claim 2 wherein at least one of said plurality of routing interconnect areas is fully populated with said plurality of switches.

4. The system on a chip of claim 2 wherein at least one of said plurality of routing interconnect areas is not fully populated with said plurality of switches.

5. A system on a chip comprising:

a microprocessor;

a read-only-memory block;

a random-access memory block;

an FPGA section including at least one FPGA tile comprising:

a plurality of functional groups (FGs) arranged in rows and columns, each of the FGs having a first,second and third set of input ports and first and second set of output ports, and configured to receive input signals through designated ports, perform logic operations and generate output signals;

a third set of routing conductors independent of a first and a second set of routing conductors, coupled to said first set of output ports of said FGs, and employing a plurality of tracks and a plurality of switches to receive said output signals, select and route said signals around said at least one FPGA tile and within said at least one FPGA tile, and provide said signals to said first set of input ports when said first set of routing conductors cannot be used; and

a plurality of interface groups (IGs) surrounding the plurality of FGs such that one IG is positioned at each end of each row and column, each of the IGs having a first, second and third set of input ports and first and second set of output ports and coupled to said third set of routing conductors and configured to transfer signals from said third set of routing conductors to outside of said at least one FPGA tile.

6. The system on a chip of claim 5 , wherein said plurality of tracks intersect at a plurality of routing interconnect areas.

7. The system on a chip of claim 6 , wherein at least one of said plurality of routing interconnect areas is fully populated with said plurality of switches.

8. The system on a chip of claim 6 wherein at least one of said plurality of routing interconnect areas is not fully populated with said plurality of switches.

9. The system on a chip of claim 5 , wherein said FPGA section further comprises:

a second FPGA tile that includes a plurality of FGs, a third set of routing conductors, and a plurality of IGs arranged in the same manner as the at least one FPGA tile, wherein at least one IG of said at least one FPGA tile is coupled to at least one IG of said second FPGA tile by said third set of routing conductors.

10. The system of claim 5 , wherein said FPGA further comprises:

a second FPGA tile that includes a plurality of FGs, a third set of routing conductors, and a plurality of IGs arranged in a manner substantially similar to said first FPGA tile, wherein at least one IG of said first FPGA tile is coupled to at least one IG of said second FPGA tile.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
CHANGE OF NAME Recorded Dec 28, 2015
From: ACTEL CORPORATION
To: MICROSEMI SOC CORP.
Reel/Frame 037393/0562 →
NOTICE OF SUCCESSION OF AGENCY Recorded Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2011
From: WHITE ELECTRONIC DESIGNS CORP.; ACTEL CORPORATION; MICROSEMI CORPORATION
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 025783/0613 →