Exposed metal bezel for use in sensor devices and method therefor
View Patent ↗A sensor package has a substrate. A sensor die having an inactive surface is bonded to the substrate. An active surface of the sensor die is exposed. A portion of the active surface of the sensor die has an active imaging area. A metal bezel is formed on the active surface of the sensor die and separate from the imaging area.
1. A sensor package comprising:
a substrate;
a sensor die having an inactive surface bonded to the substrate and an active surface which is exposed, a portion of the active surface having an active imaging area;
a metal bezel formed on the active surface of the sensor die and separate from the imaging area, wherein a portion of the metal bezel is exposed.
2. A sensor package in accordance with claim 1 further comprising a passivation layer formed on the active surface, wherein the passivation layer separates the active imaging area from the metal bezel.
3. A sensor package in accordance with claim 1 wherein the metal bezel comprises:
a patterned area formed on the active surface on a non-imaging area of the sensor die;
a plurality of metal layers formed in the patterned area; and
a protective coating formed around the plurality of metal layers, a section of a top metal layer being exposed.
4. A sensor package in accordance with claim 1 further comprising a wirebond area formed on the metal bezel.
5. A sensor package in accordance with claim 4 wherein the wirebond area is formed of gold.
6. A sensor package in accordance with claim 3 wherein a top layer of the plurality of metal layers is nickel.
7. A sensor package in accordance with claim 3 wherein the protective coating is a polyimide.
8. A sensor package comprising:
a substrate;
a sensor die having an inactive surface bonded to the substrate and an active surface which is exposed, a portion of the active surface having an active imaging area;
means formed on the active surface of the sensor die and separate from the imaging area for absorbing electrostatic discharge, wherein a portion of the means for absorbing electrostatic discharge is exposed.
9. A sensor package in accordance with claim 8 further comprising means formed on the active surface of the sensor die for separating the active imaging area from the means for absorbing electrostatic discharge.
10. A sensor package in accordance with claim 8 wherein the absorbing means comprises:
a patterned area formed on the active surface on a non-imaging area of the sensor die;
a plurality of metal layers formed in the patterned area; and
means formed around the plurality of metal layers for protecting, a section of a top metal layer being exposed.
11. A sensor package in accordance with claim 10 further comprising a wirebond area formed on the absorbing means.
12. A sensor package in accordance with claim 11 wherein the wirebond area is formed of gold.
13. A sensor package in accordance with claim 10 wherein a top layer of the plurality of metal layers is nickel.
14. A sensor package in accordance with claim 10 wherein the protecting means is a polyimide.
15. A sensor package comprising:
a substrate;
a sensor die having an inactive surface bonded to the substrate and an active surface which is exposed, a portion of the active surface having an active imaging area; and
a metal bezel formed on a portion of the active surface having inactive pixels, a section of the metal bezel being exposed.
16. A sensor package in accordance with claim 15 further comprising a passivation layer formed on the active surface, wherein the passivation layer separates the active imaging area from the metal bezel.
17. A sensor package in accordance with claim 15 wherein the metal bezel comprises:
a patterned area formed on a portion of the active surface of the sensor die having inactive pixels;
a plurality of metal layers formed in the patterned area; and
a protective coating formed around the plurality of metal layers, a section of a top metal layer being exposed.
18. A sensor package in accordance with claim 15 further comprising a wirebond area formed on the metal bezel.
19. A sensor package in accordance with claim 15 further comprising:
a first set of bond pads formed on an outer perimeter of the sensor die;
a second set of bond pads formed on an outer perimeter of the substrate; and
wirebonds coupled to the first set of bond pads and to the second set of bond pads.
20. A sensor package in accordance with claim 15 further comprising an encapsulant placed over the wirebonds.