Integrated circuit package system with lead support

1. A method of manufacturing an integrated circuit package system comprising:

forming a paddle, having an integrated circuit die thereover and a paddle overhang, an outer lead, and an inner lead between the paddle and the outer lead, the inner lead having an inner body overhang;

placing a lead support, over only the paddle overhang and over only the inner body overhang or only over an inner lead transition, to encircle the paddle without traversing to an inner body bottom side of the inner lead;

connecting the integrated circuit die and the inner lead

encapsulating the inner lead having the lead support protruding, the paddle, the outer lead, and the integrated circuit die including exposing the inner body bottom side from the encapsulation; and

wherein placing the lead support over only the paddle overhang and over only the inner body overhang includes bridging the inner lead and the paddle with the lead support.

2. The method as claimed in claim 1 wherein placing the lead support includes bridging the inner lead and the outer lead without traversing to an outer body bottom side of the outer lead.

3. The method as claimed in claim 1 wherein placing the lead support includes placing a protrusion of the lead support over the inner lead.

4. The method as claimed in claim 1 wherein placing the lead support includes placing a protrusion of the lead support over the inner lead and the outer lead without surrounding the outer lead.

5. A method of manufacturing an integrated circuit package system comprising:

forming a paddle, having an integrated circuit die thereover and a paddle overhang, an outer lead, and an inner lead between the paddle and the outer lead with a paddle bottom side coplanar with an inner body bottom side of the inner lead, the inner lead having an inner lead body overhang;

placing a lead support, over only the paddle overhang and over only the inner body overhang or only over an inner lead transition, to encircle the paddle without traversing to the inner body bottom side of the inner lead;

connecting the integrated circuit die with the inner lead and the outer lead; and

encapsulating the inner lead having the lead support protruding, the paddle, the outer lead, and the integrated circuit die including exposing the inner body bottom side and an outer body bottom side, of the outer lead, from the encapsulation; and

wherein placing the lead support over only the paddle overhang and over only the inner body overhang includes bridging the inner lead and the paddle with the lead support.

6. The method as claimed in claim 5 wherein placing the lead support includes bridging the inner lead, the paddle, and the outer lead with the lead support with the paddle bottom side and the outer body bottom side exposed.

7. The method as claimed in claim 5 wherein placing the lead support includes placing a protrusion of the lead support over the inner lead and the lead support over the paddle.

8. The method as claimed in claim 5 wherein placing the lead support includes dispensing the lead support comprised of an epoxy.

9. The method as claimed in claim 5 wherein placing the lead support includes taping the lead support comprised of an adhesive.

10. An integrated circuit package system comprising:

a paddle having a paddle overhang;

an integrated circuit die over the paddle;

an outer lead adjacent the paddle;

an inner lead having an inner body overhang and an inner body bottom side between the paddle and the outer lead;

a lead support encircling the paddle, and over only the paddle overhang and over only the inner body overhang or only over an inner lead transition, without traversing to the inner body bottom side;

an interconnect between the integrated circuit die and the inner lead; and

an encapsulation on the inner lead having the lead support thereon, the paddle, the outer lead, and the integrated circuit die includes the inner body bottom side exposed from the encapsulation; and

wherein the lead support, over only the paddle overhang and over only the inner body overhang, bridges the inner lead and the paddle.

11. The system as claimed in claim 10 wherein the lead support includes the lead support between the inner lead and the outer lead without traversing to an outer body bottom side of the outer lead.

12. The system as claimed in claim 10 wherein the lead support includes a protrusion of the lead support over the inner lead.

13. The system as claimed in claim 10 wherein the lead support includes a protrusion of the lead support over the inner lead and the outer lead without traversing to an outer body bottom side of the outer lead.

14. The system as claimed in claim 10 wherein:

the paddle is a die-attach paddle with a paddle bottom side;

the outer lead includes an outer lead tip and an outer lead body;

the inner lead, having an inner lead tip and an inner lead body, has the inner body bottom side coplanar with the paddle bottom side;

the lead support is over an inner lead topside of the inner lead;

the integrated circuit die is mounted over the paddle with an adhesive;

the interconnect is a bond wire; and

the encapsulation is over the outer lead with an outer body bottom side of the outer lead exposed.

15. The system as claimed in claim 14 wherein the lead support includes the lead support between the inner lead, the paddle, and the outer lead with the paddle bottom side and the outer body bottom side exposed.

16. The system as claimed in claim 14 wherein the lead support includes a protrusion of the lead support over the inner lead and the lead support over the paddle.

17. The system as claimed in claim 14 wherein the lead support includes an epoxy.

18. The system as claimed in claim 14 wherein the lead support includes an adhesive.