Method for immobilizing ligands and organometallic compounds on silica surface, and their application in chemical mechanical planarization

1. A composition comprising:

abrasive particles having a surface;

a stabilizer compound bound to said surface of the abrasive particles and comprising one or more of boron, aluminum, and tungsten, said stabilizer compound having a composition different than the abrasive particle; and

an organic chelating compound bound to said stabilizer compound and having a capacity to chelate a metal ion in an aqueous solution;

wherein the organic chelating compound is not a polyvinylpyridine and wherein the abrasive particles comprise silica and the organic chelating compound comprises a nitrogen-containing moiety and between one and five other polar groups capable of forming a complexation bond with a metal ion.

2. The composition of claim 1 wherein the organic chelating compound comprises an amino acid or salt thereof.

3. The composition of claim 1 wherein the organic chelating compound comprises one or more of tricine, bicine, 2-phenylglycine, guanidine acetic acid, ethylenediaminetetraacetic acid or salts thereof, diethylenetriaminopenta-acetic acid, L-lysine, propylenediaminetetraacetic acid or salts thereof, nitrilotriacetic acid, or salts thereof.

4. A composition comprising:

abrasive particles having a surface;

a stabilizer compound bound to said surface of the abrasive particles and comprising one or more of boron, aluminum, and tungsten, said stabilizer compound having a composition different than the abrasive particle; and

an organic chelating compound bound to said stabilizer compound and having a capacity to chelate a metal ion in an aqueous solution, wherein the organic chelating compound is not a polyvinylpyridine;

wherein the abrasive particles comprise silica and the organic chelating compound comprises between two and five carboxylic acid groups or salts thereof and wherein the organic chelating compound comprises citric acid or salts thereof.

5. A composition comprising:

abrasive particles having a surface;

a stabilizer compound bound to said surface of the abrasive particles and comprising one or more of boron, aluminum, and tungsten, said stabilizer compound having a composition different than the abrasive particle; and

an organic chelating compound bound to said stabilizer compound and having a capacity to chelate a metal ion in an aqueous solution, wherein the organic chelating compound is not a polyvinylpyridine;

wherein the abrasive particles comprise silica and the organic chelating compound comprises a sulfur-containing moiety and between one and five other polar groups capable of forming a complexation bond with a metal ion.

6. The composition of claim 5 wherein the organic chelating compound comprises thiosalicylic acid or salts thereof.

7. A composition comprising:

abrasive particles having a surface;

a stabilizer compound bound to said surface of the abrasive particles and comprising one or more of boron, aluminum, and tungsten, said stabilizer compound having a composition different than the abrasive particle; and

an organic chelating compound bound to said stabilizer compound and having a capacity to chelate a metal ion in an aqueous solution;

wherein the organic chelating compound is not a polyvinylpyridine, wherein the abrasive particles comprise silica and the organic chelating compound comprises between two and five polar groups selected from carboxylic acid groups or salts thereof and hydroxyl groups, and wherein the organic chelating compound comprises guanidine acetic acid or salts thereof.

8. A composition comprising:

abrasive particles having a surface;

a stabilizer compound bound to said surface of the abrasive particles and comprising one or more of boron, aluminum, and tungsten, said stabilizer compound having a composition different than the abrasive particle; and

an organic chelating compound bound to said stabilizer compound and having a capacity to chelate a metal ion in an aqueous solution;

wherein the organic chelating compound is not a polyvinylpyridine, wherein the abrasive particles comprise silica, the stabilizer compound comprises a salt of aluminum, and the organic chelating compound comprises: 1) a nitrogen-containing moiety and between one and five other polar groups; 2) a sulfur-containing moiety and between one and five other polar groups; or 3) between two and five polar groups selected from carboxylic acid groups or salts thereof and hydroxyl groups, and wherein said composition is a chemical mechanical polishing slurry further comprising water and an oxidizer, wherein said abrasive particles have an average diameter between 5 nanometers and 500 nanometers.

9. A composition comprising:

abrasive particles having a surface;

a stabilizer compound bound to said surface of the abrasive particles and comprising one or more of boron, aluminum, and tungsten, said stabilizer compound having a composition different than the abrasive particle; and

an organic chelating compound bound to said stabilizer compound and having a capacity to chelate a metal ion in an aqueous solution;

wherein the organic chelating compound is not a polyvinylpyridine and wherein said composition is a chemical mechanical polishing slurry further comprising water and an oxidizer, wherein said abrasive particles comprise silica and have an average diameter between 5 nanometers and 500 nanometers, wherein the stabilizer compound comprises a salt of aluminum and boric acid or salt thereof, and wherein said organic chelating compound comprises: 1) a nitrogen-containing moiety and between one and five other polar groups; 2) a sulfur-containing moiety and between one and five other polar groups; or 3) between two and five polar groups selected from carboxylic acid groups or salts thereof and hydroxyl groups.

10. A method of polishing comprising movably contacting a substrate having a metallic surface to be polished with the composition of claim 8 .

11. The method of claim 10 wherein the metallic surface to be polished comprises tungsten, copper, or both.

12. A method of polishing comprising the steps of: A) placing a substrate having a surface to be polished in contact with a polishing pad; B) delivering to said surface to be polished a polishing composition comprising an oxidizing agent and abrasive particles having a surface, said surface of the abrasive particles being at least partially modified with 1) at least one stabilizer compound comprising aluminum, boron, or both, said stabilizer compound being bound via a covalent bond to said abrasive particles, and 2) a chelating compound, said chelating compound being bound via a covalent bond to said stabilizer compound; and C) polishing the substrate with the polishing composition.