Same size die stacked package having through-hole vias formed in organic material
View Patent ↗A semiconductor package includes a substrate or leadframe structure. A plurality of interconnected dies, each incorporating a plurality of through-hole vias (THVs) disposed along peripheral surfaces of the plurality of dies, are disposed over the substrate or leadframe structure. The plurality of THVs are coupled to a plurality of bond pads through a plurality of a metal traces. A top surface of a first THV is coupled to a bottom surface of a second THV. An encapsulant is formed over a portion of the substrate or leadframe structure and the plurality of dies.
1. A semiconductor package, comprising:
a substrate or leadframe structure;
a plurality of stacked same-size interconnected dies disposed over the substrate or leadframe structure, each die having a top surface, side surface, and bottom surface, the top surface of a first die of the stacked same-size interconnected dies directly contacting the bottom surface of a second die of the stacked same-size interconnect dies, the side surface of each die being surrounded by an organic material having a plurality of conductive through-hole vias (THVs) formed in the organic material extending from a top surface of the organic material to a bottom surface of the organic material, the conductive THVs being exposed from a side surface of the organic material;
a plurality of bond pads formed on the top surface of each of the stacked same-size interconnected dies;
a plurality of conductive traces formed on the top surface of each of the stacked same-size interconnected dies between the bond pads and the conductive THVs; and
an encapsulant formed over a portion of the substrate or leadframe structure and the plurality of stacked same-size interconnected dies.
2. The semiconductor package of claim 1 , wherein the first die of the plurality of stacked same-size interconnected dies is wire-bonded to the substrate or leadframe structure.
3. The semiconductor package of claim 2 , further including a wire coupled between the substrate or leadframe structure and a terminal land.
4. The semiconductor package of claim 1 , further including a conductive lid disposed over a surface of the substrate or leadframe structure.
5. The semiconductor package of claim 4 , wherein the first die of the plurality of stacked same-size interconnected dies is attached to the conductive lid using a die attach adhesive material.
6. The semiconductor package of claim 1 , wherein the substrate or leadframe structure is bumped to facilitate electrical connectivity.
7. The semiconductor package of claim 1 wherein the plurality of conductive THVs surround the periphery of each die.
8. A semiconductor package, comprising:
a substrate or leadframe structure having an integrated cavity;
a plurality of stacked same-size interconnected dies disposed within the integrated cavity, each die having a top surface, side surface, and bottom surface, the top surface of a first die of the stacked same-size interconnected dies directly contacting the bottom surface of a second die of the stacked same-size interconnect dies, the side surface of each die being surrounded by an organic material having a plurality of conductive through-hole vias (THVs) formed in the organic material extending from a top surface of the organic material to a bottom surface of the organic material, the conductive THVs being exposed from a side surface of the organic material;
a plurality of bond pads formed on the top surface of each of the stacked same-size interconnected dies;
a plurality of conductive traces formed on the top surface of each of the stacked same-size interconnected dies between the bond pads and the conductive THVs;
a bond wire coupled between the second die of the stacked same-size interconnected dies and substrate or leadframe structure; and
an encapsulant formed over a portion of the substrate or leadframe structure and the stacked same-size interconnected dies.
9. The semiconductor package of claim 8 , further including a conductive lid disposed over a surface of the substrate or leadframe structure.
10. The semiconductor package of claim 9 , wherein the first die of the plurality of stacked same-size interconnected dies is attached to the conductive lid using a die attach adhesive material.
11. The semiconductor package of claim 8 , wherein the substrate or leadframe structure is bumped to facilitate electrical connectivity.
12. The semiconductor package of claim 8 wherein the plurality of conductive THVs surround the periphery of each die.
13. A method of manufacturing a semiconductor package, comprising:
providing a substrate or leadframe structure;
providing a plurality of stacked same-size interconnected dies disposed over the substrate or leadframe structure, each die having a top surface, side surface, and bottom surface, the top surface of a first die of the stacked same-size interconnected dies directly contacting the bottom surface of a second die of the stacked same-size interconnect dies, the side surface of each die being surrounded by an organic material having a plurality of conductive through-hole vias (THVs) formed in the organic material extending from a top surface of the organic material to a bottom surface of the organic material, the conductive THVs being exposed from a side surface of the organic material;
forming a plurality of bond pads on the top surface of each of the stacked same-size interconnected dies;
forming a plurality of conductive traces on the top surface of each of the stacked same-size interconnected dies between the bond pads and the conductive THVs; and
depositing an encapsulant formed over a portion of the substrate or leadframe structure and the plurality of dies.
14. The method of manufacture of claim 13 , wherein the first die of the plurality of stacked same-size interconnected dies is wire-bonded to the substrate or leadframe structure.
15. The method of manufacture of claim 14 , further including forming a wire between the substrate or leadframe structure and a terminal land.
16. The method of manufacture of claim 13 , further including disposing a conductive lid over a surface of the substrate or leadframe structure.
17. The method of manufacture of claim 16 , further including attaching the first die of the plurality of stacked same-size interconnected dies to the conductive lid using a die attach adhesive material.
18. The method of manufacture of claim 13 , wherein the substrate or leadframe structure is bumped to facilitate electrical connectivity.
19. The method of manufacture of claim 13 , wherein each of the plurality of stacked same-size interconnected dies has a substantially similar dimensional footprint.
20. The method of claim 13 wherein the plurality of conductive THVs surround the periphery of each die.
21. A method of manufacturing a semiconductor package, comprising:
providing a substrate or leadframe structure having an integrated cavity;
providing a plurality of stacked same-size interconnected dies disposed within the integrated cavity, each die having a top surface, side surface, and bottom surface, the top surface of a first die of the stacked same-size interconnected dies directly contacting the bottom surface of a second die of the stacked same-size interconnect dies, the side surface of each die being surrounded by an organic material having a plurality of conductive through-hole vias (THVs) formed in the organic material extending from a top surface of the organic material to a bottom surface of the organic material, the conductive THVs being exposed from a side surface of the organic material;
forming a plurality of bond pads on the top surface of each of the stacked same-size interconnected dies;
forming a plurality of conductive traces on the top surface of each of the stacked same-size interconnected dies between the bond pads and the conductive THVs;
forming a bond wire between the second die of the stacked same-size interconnected dies and substrate or leadframe structure; and
depositing an encapsulant formed over a portion of the substrate or leadframe structure and the plurality of dies.
22. The method of manufacture of claim 21 , further including disposing a conductive lid over a surface of the substrate or leadframe structure.
23. The method of manufacture of claim 22 , further including attaching the first die of the plurality of interconnected dies to the conductive lid using a die attach adhesive material.
24. The method of manufacture of claim 21 , wherein the substrate or leadframe structure is bumped to facilitate electrical connectivity.
25. The method of claim 21 wherein the plurality of conductive THVs surround the periphery of each die.