Integrated circuit package system with overhanging connection stack

1. A method for manufacturing an integrated circuit package system comprising:

providing a first conductive line adjacent to a second conductive line;

forming a first connection stack over the first conductive line with the first connection stack overhanging the second conductive line including:

forming a first bottom structure over the first conductive line with the first bottom structure overhanging a space between the first conductive line and the second conductive line;

forming a first top structure over the first bottom structure with the first top structure overhanging the space and at least a portion of the second conductive line;

connecting an integrated circuit device and the first connection stack; and

encapsulating the integrated circuit device and the first connection stack.

2. The method as claimed in claim 1 further comprising:

forming a second connection stack over the second conductive line with the second connection stack overhanging the first conductive line in a staggered configuration to the first connection stack; and

connecting the integrated circuit device and the second connection stack.

3. The method as claimed in claim 1 wherein forming the first connection stack over the first conductive line includes at least partially covering sides of the first conductive line.

4. The method system as claimed in claim 1 wherein forming the first connection stack is centered over the first conductive line.

5. A method for manufacturing an integrated circuit package system comprising:

providing a first conductive line adjacent to a second conductive line, the first conductive line having a first line width and the second conductive line with a space in between line;

forming a first connection stack centered over the first conductive line with the first connection stack overhanging the second conductive line, a first bottom structure over the first conductive line with the first bottom structure overhanging the space and not overhanging the second conductive line;

forming a second connection stack centered over the second conductive line with the second connection stack overhanging the first conductive line, the first connection stack and the second connection stack are in an overhanging staggered configuration;

connecting an integrated circuit device and the first connection stack;

connecting the integrated circuit device and the second connection stack; and

encapsulating the integrated circuit device, the first connection stack, and the second connection stack.

6. The method as claimed in claim 5 wherein connecting the integrated circuit device and the first connection stack includes forming a stitch bond on the first connection stack.

7. The method as claimed in claim 5 wherein:

providing the first conductive line and the second conductive line includes:

providing the first conductive line having a first line width and the second conductive line with a space in between; and

forming the first connection stack centered over the first conductive line includes:

forming the first connection stack having a first top width, the first top width is greater than the first line width and the space.

8. The method as claimed in claim 5 wherein:

providing the first conductive line and the second conductive line includes:

providing the first conductive line having a first line width and the second conductive line with a pitch in between; and

forming the first connection stack centered over the first conductive line includes:

forming the first connection stack having a first top width, the first top width is greater than the first line width and the pitch.

9. An integrated circuit package system comprising:

a first conductive line;

a second conductive line adjacent to the first conductive line;

a first connection stack over the first conductive line with the first connection stack overhanging the second conductive line including:

a first bottom structure over the first conductive line with the first bottom structure overhanging a space between the first conductive line and the second conductive line;

a first top structure over the first bottom structure with the first top structure overhanging the space and at least a portion of the second conductive line;

an integrated circuit device connected with the first connection stack; and

an encapsulation over the integrated circuit device and the first connection stack.

10. The system as claimed in claim 9 further comprising a second connection stack over the second conductive line with the second connection stack overhanging the first conductive line in a staggered configuration to the first connection stack and connected with the integrated circuit device.

11. The system as claimed in claim 9 wherein the first connection stack over the first conductive line includes at least partially over sides of the first conductive line.

12. The system as claimed in claim 9 wherein the first connection stack is centered over the first conductive line.

13. The system as claimed in claim 9 further comprising:

a second connection stack centered over the second conductive line and connected with the integrated circuit device;

wherein:

the first connection stack is centered over the first conductive line; and

the encapsulation is over the second connection stack.

14. The system as claimed in claim 13 wherein the integrated circuit device connected with the first connection stack includes a stitch bond on the first connection stack.

15. The system as claimed in claim 13 wherein:

the first conductive line adjacent to the second conductive line includes:

the first conductive line having a first line width and the second conductive line with a space in between; and

the first connection stack centered over the first conductive line includes:

the first connection stack having a first top width, the first top width is greater than the first line width and the space.

16. The system as claimed in claim 13 wherein:

the first conductive line adjacent to the second conductive line includes:

the first conductive line having a first line width and the second conductive line with a pitch in between; and

the first connection stack centered over the first conductive line includes:

the first connection stack having a first top width, the first top width is greater than the first line width and the pitch.

17. The system as claimed in claim 13 wherein:

the first conductive line adjacent to the second conductive line includes:

the first conductive line having a first line width and the second conductive line with a space in between; and

the first connection stack centered over the first conductive line includes:

a first bottom structure over the first conductive line with the first bottom structure overhanging the space and not overhanging the second conductive line.