Memory card fabricated using SiP/SMT hybrid technology
A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.
1. A portable memory package, comprising:
a printed circuit board;
a first semiconductor package electrically coupled to a first section of the printed circuit board, the first package being a land grid array package, the land grid array package including a plurality of contact fingers for establishing contact with a host device;
a second semiconductor package electrically coupled to a second section of the printed circuit board; and
a standard size portable memory lid enclosing the land grid array package, the printed circuit board and the second semiconductor package.
2. The portable memory as recited in claim 1 , wherein the land grid array package includes a plurality of test pads for testing the operation of the land grid array package, the test pads electrically coupling the land grid array package to the printed circuit board after testing of the land grid array package using the test pads.
3. The portable memory as recited in claim 1 , further comprising a third section of the printed circuit board between the first and second sections of the printed circuit board, the third section being less stiff than the first and second sections, the reduced stiffness allowing flexing of the first section relative to the second section.
4. The portable memory as recited in claim 3 , wherein the third section has a smaller diameter than the first and second sections of the printed circuit board.
5. The portable memory as recited in claim 1 , wherein the second semiconductor package is a surface mounted package.
6. The portable memory as recited in claim 1 , wherein the second semiconductor package is a TSOP package.
7. A portable memory as recited in claim 1 , wherein the second semiconductor package is a ball grid array package.
8. A portable memory as recited in claim 1 , wherein the second semiconductor package is a second land grid array package.
9. The portable memory as recited in claim 1 , wherein the standard size portable memory lid is a standard secure digital portable memory lid.
10. The portable memory as recited in claim 1 , wherein the land grid array package is an SIP package including at least one memory die and a controller die.
11. The portable memory as recited in claim 10 , wherein the second semiconductor package includes at least one memory die.
12. The portable memory as recited in claim 1 , wherein the land grid array package includes one or more flash memory die.
13. The portable memory as recited in claim 12 , wherein the second semiconductor package includes one or more flash memory die.
14. The portable memory as recited in claim 13 , wherein the land grid array package and the second semiconductor package together include one or more controller die.
15. The portable memory as recited in claim 14 , wherein the one or more controller die include an ASIC.
16. A portable memory package, comprising:
a printed circuit board including first and second sections;
a first semiconductor package, the first semiconductor package being a land grid array package including a plurality of contact fingers for establishing contact with a host device and including a plurality of test pads electrically coupled to the first section of the printed circuit board;
a second semiconductor package electrically coupled to a second section of the printed circuit board; and
a portable memory lid enclosing the land grid array package, the printed circuit board and the second semiconductor package.
17. The portable memory as recited in claim 16 , wherein the second semiconductor package is a TSOP package.
18. A portable memory as recited in claim 16 , wherein the second semiconductor package is a ball grid array package.
19. A portable memory as recited in claim 16 , wherein the second semiconductor package is a second land grid array package.
20. The portable memory as recited in claim 16 , wherein the portable memory lid is a standard secure digital portable memory lid.
21. The portable memory as recited in claim 16 , wherein the land grid array package is an SIP package including at least one memory die and a controller die.
22. A portable memory package, comprising:
a printed circuit board including first and second sections, and a third section between the first and second sections having a smaller diameter than the first and second sections for providing a degree of flexibility of the first section relative to the second section;
a first semiconductor package, the first semiconductor package being a land grid array package including a plurality of contact fingers for establishing contact with a host device and including a plurality of test pads electrically coupled to the first section of the printed circuit board;
a second semiconductor package electrically coupled to a second section of the printed circuit board; and
a standard, secure digital portable memory lid enclosing the land grid array package, the printed circuit board and the second semiconductor package.
23. The portable memory as recited in claim 22 , wherein the second semiconductor package is a surface mounted package.
24. The portable memory as recited in claim 22 , wherein the second semiconductor package is a TSOP package.
25. A portable memory as recited in claim 22 , wherein the second semiconductor package is a ball grid array package.
26. A portable memory as recited in claim 22 , wherein the second semiconductor package is a second land grid array package.
27. The portable memory as recited in claim 22 , wherein the land grid array package is an SIP package including at least one memory die and a controller die.
28. The portable memory as recited in claim 27 , wherein the second semiconductor package includes one or more flash memory die.