Dressing a wafer polishing pad
View Patent ↗A dressing apparatus for dressing a polishing pad includes a dressing member engageable with the polishing pad. The dressing apparatus is adapted to change the amount of force exerted by the dressing member on the polishing pad as the dressing member moves radially along the polishing pad. A controller for controlling the dressing apparatus has pre-programmed recipes that are selectable based on the radial profile of a measured polished wafer.
1. A method of dressing a polishing surface of a polishing pad used in polishing of wafers, the method comprising:
obtaining a radial profile of a wafer polished with the polishing pad,
categorizing the polished wafer into one of a plurality of profile categories based on the radial profile of the wafer,
selecting a recipe, from a plurality of recipes, corresponding to the profile category in which the polished wafer was categorized, wherein each of the plurality of recipes corresponds to one of the plurality of profile categories,
dressing the polishing surface of the pad according to the selected recipe using a dressing apparatus.
2. The method of claim 1 wherein the recipe is a pre-programmed set of instructions for a microcontroller, and whereby the microcontroller dresses the pad according to the recipe using the dressing apparatus.
3. The method of claim 2 wherein said categorizing includes manual analysis of the radial profile of the wafer and wherein said selecting includes manual selection of the recipe for the microcontroller.
4. The method of claim 2 wherein said categorizing includes automatic analysis of the radial profile of the wafer by the microcontroller and wherein said selecting includes automatic selection of the recipe by the microcontroller based on its analysis of the radial profile.
5. The method of claim 2 wherein said pre-programmed set of instructions instructs the microcontroller to adjust an amount of force exerted by the dressing apparatus on individual radial zones of the polishing pad during dressing of the polishing pad.
6. A method of dressing a polishing surface of a polishing pad used in polishing of wafers, the method comprising:
obtaining an average radial two-dimensional profile of a wafer polished with the polishing pad,
categorizing the polished wafer into one of a plurality of profile categories based on the average radial two-dimensional profile of the wafer,
selecting a recipe, from a plurality of recipes, corresponding to the category in which the polished wafer was categorized, wherein each of the plurality of recipes corresponds to one of the plurality of profile categories, and
dressing the polishing surface of the pad according to the selected recipe using a dressing apparatus.
7. The method of claim 6 wherein the recipe is a pre-programmed set of instructions for a microcontroller, and whereby the microcontroller dresses the pad according to the recipe using the dressing apparatus.
8. The method of claim 7 wherein said categorizing includes automatic analysis of the radial profile of the wafer by the microcontroller and wherein said selecting includes automatic selection of the recipe by the microcontroller based on its analysis of the radial profile.
9. The method of claim 7 wherein said pre-programmed set of instructions instructs the microcontroller to adjust an amount of force exerted by the dressing apparatus on individual radial zones of the polishing pad during dressing of the polishing pad.
10. A method of dressing a polishing surface of a polishing pad used in polishing of wafers, the method comprising:
obtaining a radial profile of a wafer polished with the polishing pad,
categorizing the polished wafer into a profile category based on the radial profile of the wafer,
selecting a recipe corresponding to the selected category, wherein the recipe is a pre-programmed set of instructions for a microcontroller of a dressing apparatus, and wherein said recipe instructs the microcontroller to adjust an amount of force to be exerted by the dressing apparatus on individual radial zones of the polishing pad, and
dressing the polishing surface of the pad according to the selected recipe using the dressing apparatus.
11. The method of claim 10 wherein said categorizing includes manual analysis of the radial profile of the wafer and wherein said selecting includes manual selection of the recipe for the microcontroller.
12. The method of claim 10 wherein said categorizing includes automatic analysis of the radial profile of the wafer by the microcontroller and wherein said selecting includes automatic selection of the recipe by the microcontroller based on its analysis of the radial profile.