Integrated circuit package with sputtered heat sink for improved thermal performance
View Patent ↗An integrated circuit package includes an integrated circuit die having a circuit surface and a back surface opposite the circuit surface. A layer of ductile material is deposited on the back surface of the integrated circuit die.
1. An integrated circuit package comprising:
an integrated circuit die having a circuit surface and a back surface opposite the circuit surface; and
a layer of ductile material deposited on the back surface of the integrated circuit die, the layer of ductile material having a thickness of from one to five microns; and
solder bumps formed on the circuit surface of the integrated circuit die to electrically connect the integrated circuit die to a package substrate.
2. An integrated circuit package comprising:
an integrated circuit die having a circuit surface and a back surface opposite the circuit surface;
a layer of ductile material deposited on the back surface of the integrated circuit die, the layer of ductile material having a thickness of from one to five microns; and
an identification mark on the layer of ductile material.
3. An integrated circuit package comprising:
an integrated circuit die having a circuit surface and a back surface opposite the circuit surface; and
a layer of ductile material deposited on the back surface of the integrated circuit die, the layer of ductile material having a thickness of from one to five microns and comprising one of titanium, aluminum, copper, and gold.
4. An integrated circuit package comprising:
an integrated circuit die having a circuit surface and a back surface opposite the circuit surface; and
a layer of ductile material deposited on the back surface of the integrated circuit die, the layer of ductile material having a thickness of from one to five microns and formed to conduct heat from the integrated circuit die.
5. An integrated circuit package comprising:
an integrated circuit die having a circuit surface and a back surface opposite the circuit surface; and
a layer of ductile material deposited on the back surface of the integrated circuit die, the layer of ductile material having a thickness of from one to five microns and formed to relieve tensile stress from the integrated circuit die.
6. A method of making an integrated circuit package comprising steps of:
providing an integrated circuit die having a circuit surface and a back surface opposite the circuit surface;
depositing a layer of ductile material on the back surface of the integrated circuit die, the layer of ductile material deposited to a thickness of from one to five microns; and
forming solder bumps on the circuit surface of the integrated circuit die to electrically connect the integrated circuit die to a package substrate.
7. A method of making an integrated circuit package comprising steps of:
providing an integrated circuit die having a circuit surface and a back surface opposite the circuit surface;
depositing a layer of ductile material on the back surface of the integrated circuit die, the layer of ductile material deposited to a thickness of from one to five microns; and
making an identification mark on the layer of ductile material.
8. The method of claim 6 further comprising a step of depositing the layer of ductile material comprising one of titanium, aluminum, copper, and gold.
9. The method of claim 6 further comprising a step of forming the layer of ductile material to conduct heat from the integrated circuit die.
10. The method of claim 6 further comprising a step of forming the layer of ductile material to relieve tensile stress from the integrated circuit die.
11. An integrated circuit die comprising:
a circuit surface and a back surface opposite the circuit surface;
a layer of ductile material deposited on the back surface; and
an identification mark on the layer of ductile material.