IP Library Granted Patent US 7,629,859
Granted Patent B2
US 7,629,859 · App. 11/798,917 · Granted Dec 8, 2009

Integrated resonance circuit

Assignee: Atmel Duisburg GmbH
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Quick Facts
Patent No.
US 7,629,859
App. No.
11/798,917
Granted
Dec 8, 2009
Kind
B2
Abstract

An integrated resonance circuit is provided for providing a high-frequency output signal, comprising a first output for providing a first high-frequency output signal with a first frequency and a first amplitude, a first inductive unit connected to the first output, and a first capacitive unit connected to the first output. According to the invention, a second output for providing a second high-frequency output signal with a second frequency and a second amplitude is provided, whereby the second frequency matches the first frequency and the second amplitude differs from the first amplitude, and a second inductive unit, connected to the first output and to the second output, and a second capacitive unit, connected to the second output, are provided. The invention relates furthermore to a voltage-controlled oscillator and to an integrated circuit.

Claims (34)

1. An integrated resonance circuit for providing a high-frequency output signal, the integrated resonance circuit comprising:

a first output for providing a first high-frequency output signal with a first frequency and a first amplitude;

a first inductive unit connected to the first output;

a first capacitive unit connected to the first output;

a second output for providing a second high-frequency output signal with a second frequency and a second amplitude, wherein the second frequency matches the first frequency and the second amplitude differs from the first amplitude;

a second inductive unit connected to the first output and to the second output; and

a second capacitive unit connected to the second output wherein the first and second outputs are provided to an external circuit.

2. The resonance circuit according to claim 1 , wherein a series connection of the second inductive unit and the second capacitive unit is connected parallel to the first capacitive unit.

3. The resonance circuit according to claim 1 , wherein the second inductive unit has two inductive subelements, each of which is connected to the first output and to the second output.

4. The resonance circuit according to claim 1 , wherein the second amplitude is greater than the first amplitude.

5. The resonance circuit according to claim 1 , further comprising:

a third output for providing a third high-frequency output signal with a third frequency and a third amplitude, wherein the third frequency matches the first frequency and the third amplitude differs from the first amplitude and the second amplitude;

a third inductive unit connected to the second output and to the third output; and

a third capacitive unit connected to the third output.

6. The resonance circuit according to claim 5 , wherein a series connection of the third inductive unit and the third capacitive unit is connected parallel to the second capacitive unit.

7. The resonance circuit according to claim 5 , wherein the third inductive unit has two inductive subelements, each of which is connected to the second output and to the third output.

8. The resonance circuit according to claim 5 , wherein the third amplitude is greater than the second amplitude.

9. The resonance circuit according to claim 1 wherein at least one of the inductive units has at least one conductor loop.

10. The resonance circuit according to claim 1 , wherein at least one of the inductive units has at least one bond wire, a solder ball, or a flip-chip junction.

11. The resonance circuit according to any claim 1 , wherein at least one of the capacitive units has a settable capacitance value and the resonance circuit is designed to set the settable capacitance value as a function of at least one control signal.

12. The resonance circuit according to claim 1 , wherein at least one of the capacitive units has at least a metal-insulator-metal capacitor, a varactor, a switched MIM capacitor, or a switched capacitor bank.

13. The resonance circuit according to claim 1 , wherein at least one of the capacitive units is a parasitic capacitor.

14. The resonance circuit according to claim 1 , wherein the first inductive unit is designed as a conductor loop with one or more turns.

15. A voltage-controlled oscillator comprising at least one resonance circuit according to claim 1 .

16. An integrated circuit having at least one resonance circuit according to claim 1 .

17. The integrated circuit according to claim 16 , wherein the integrated circuit is designed as a monolithically integrated circuit, as a hybrid circuit, or as a multilayer-ceramic circuit.

18. The resonance circuit according to claim 1 , wherein the first and second outputs are directly connected to the external circuit.

19. An integrated resonance circuit for providing a high-frequency output signal, the integrated resonance circuit comprising:

a first output for providing a first high-frequency output signal with a first frequency and a first amplitude;

a first inductive unit connected to the first output;

a first capacitive unit connected to the first output;

a second output for providing a second high-frequency output signal with a second frequency and a second amplitude, wherein the second frequency matches the first frequency and the second amplitude differs from the first amplitude;

a second inductive unit connected to the first output and to the second output; and

a second capacitive unit connected to the second output, wherein the first and second outputs are provided to output buffers.

Assignments (11)
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: ATMEL CORPORATION
Reel/Frame 059262/0105 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: ATMEL CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041715/0747 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL Recorded Apr 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: ATMEL CORPORATION
Reel/Frame 038376/0001 →
PATENT SECURITY AGREEMENT Recorded Jan 3, 2014
From: ATMEL CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 031912/0173 →
MERGER Recorded Apr 25, 2011
From: ATMEL DUISBURG GMBH
To: ATMEL AUTOMOTIVE GMBH
Reel/Frame 026176/0240 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 4, 2011
From: ATMEL AUTOMOTIVE GMBH
To: ATMEL CORPORATION
Reel/Frame 025899/0710 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 20, 2007
From: EL RAI, SAMIR
To: ATMEL DUISBURG GMBH
Reel/Frame 019720/0864 →
Priority Claims (1)
DE 10 2006 023 353 · May 17, 2006 · national
Continuity (1)
Related Publication 20080001680A1 · Jan 3, 2008