IP Library Granted Patent US 8,541,310
Granted Patent B2
US 8,541,310 · App. 11/800,188 · Granted Sep 24, 2013

CMP compositions containing a soluble peroxometalate complex and methods of use thereof

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Quick Facts
Patent No.
US 8,541,310
App. No.
11/800,188
Granted
Sep 24, 2013
Kind
B2
Abstract

The present invention provides a chemical-mechanical polishing (CMP) composition for polishing a ruthenium-containing substrate in the presence of hydrogen peroxide without forming a toxic level of ruthenium tetroxide during the polishing process. The composition comprises (a) a catalytic oxidant comprising a water-soluble peroxometalate complex, an oxidizable precursor of a peroxometalate complex, or a combination thereof, (b) a particulate abrasive; and (c) an aqueous carrier. The peroxometalate complex and the precursor thereof each have a reduced form that is oxidizable by hydrogen peroxide to regenerate the peroxometalate complex during chemical-mechanical polishing. CMP methods for polishing ruthenium-containing surfaces with the CMP composition are also provided.

Claims (14)

1. A chemical-mechanical polishing (CMP) method for polishing a ruthenium-containing substrate in the presence of hydrogen peroxide without forming a toxic level of ruthenium tetroxide, comprising the steps of:

(a) contacting a surface of the ruthenium-containing substrate with a polishing pad and an aqueous CMP composition in the presence of hydrogen peroxide; and

(b) causing relative motion between the polishing pad and the substrate while maintaining a portion of the CMP composition and hydrogen peroxide in contact with the surface between the pad and the substrate for a time period sufficient to abrade at least a portion of the ruthenium present in the substrate from the surface;

wherein the CMP composition comprises (i) a catalytic oxidant comprising a water-soluble peroxometalate complex and an oxidizable precursor of a peroxometalate complex, the peroxometalate complex and the precursor thereof each having a reduced form that is oxidizable by hydrogen peroxide to generate the peroxometalate complex during chemical-mechanical polishing, wherein the water soluble peroxometalate complex is selected from the group consisting of an isoperoxotungstate compound, a peroxotitanate compound and a titanium hydroperoxosilicate compound, and wherein the oxidizable precursor of the peroxometalate complex is selected from the group consisting of an acidic tungsten-containing compound and a titanate compound; (ii) a particulate abrasive; and (iii) an aqueous carrier.

2. The method of claim 1 wherein the particulate abrasive is present in the composition in an amount in the range of about 0.5 to about 10 percent by weight.

3. The method of claim 1 wherein the particulate abrasive has a mean particle size in the range of about 5 to about 50 nm.

4. The method of claim 1 wherein the catalytic oxidant is present in the composition in an amount in the range of about 0.05 to about 1 percent by weight.

5. The method of claim 1 wherein the peroxometalate complex comprises an isoperoxotungstate compound.

6. The method of claim 1 wherein the peroxometalate complex comprises a peroxotitanate compound.

7. The method of claim 1 wherein peroxometalate complex comprises a titanium hydroperoxosilicate compound.

8. The method of claim 1 wherein the oxidizable precursor of the peroxometalate complex comprises an acidic tungsten-containing compound.

9. The method of claim 8 wherein the acidic tungsten-containing compound is selected from the group consisting of tungstic acid, polytungstic acid, phosphotungstic acid, and a combination of two or more of the foregoing.

10. The method of claim 1 wherein the oxidizable precursor of the peroxometalate complex comprises a titanate compound.

11. The method of claim 10 wherein the titanate compound is selected from the group consisting of a titanium(IV) citrate complex, a titanium(IV) lactate complex, and a combination thereof.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; KMG-BERNUTH, INC.; MPOWER SPECIALTY CHEMICALS LLC; SEALWELD (USA), INC.; INTERNATIONAL TEST SOLUTIONS, LLC; CMC MATERIALS, INC.
Reel/Frame 060592/0260 →
CHANGE OF NAME Recorded Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
RELEASE OF SECURITY INTEREST Recorded Nov 16, 2018
From: BANK OF AMERICA, N.A.
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 047587/0119 →
SECURITY AGREEMENT Recorded Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; MPOWER SPECIALTY CHEMICALS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
NOTICE OF SECURITY INTEREST IN PATENTS Recorded Feb 16, 2012
From: CABOT MICROELECTRONICS CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 027727/0275 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 7, 2007
From: WHITE, DANIELA; PARKER, JOHN
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 019659/0335 →