Semiconductor device with via hole of uneven width
View Patent ↗A semiconductor device with improved reliability and its manufacturing method is offered. The semiconductor device of this invention includes a semiconductor substrate, a pad electrode formed on the semiconductor substrate through an insulation layer made of silicon oxide, silicon nitride or the like, a supporting plate bonded to a top surface of the semiconductor substrate to cover the pad electrode and a via hole formed in the semiconductor substrate and extending from a back surface of the semiconductor substrate to the pad electrode, wherein an aperture of the via hole at a portion close to the pad electrode is larger than an aperture of the via hole at a portion close to the back surface of the semiconductor substrate.
1. A semiconductor device comprising:
a monolithic silicon substrate comprising a front surface and a back surface and having a via hole connecting the front and back surfaces;
a pad electrode disposed on the front surface to cover the via hole;
a first insulation layer disposed between the pad electrode and the front surface of the substrate;
a supporting member disposed on the front surface to cover the pad electrode and the first insulation layer;
a second insulation layer disposed on a sidewall of the via hole; and
a metal layer disposed in the via hole and on the second insulation layer,
wherein the via hole comprises a first via hole portion extending from the front surface and a second via hole portion extending from the back surface, and a sidewall of the first via hole portion recedes from a point where the first and second insulation layers and the substrate meet so as to form a semicircular recess in the sidewall of the first via hole portion in a cross-sectional view of the semiconductor device.
2. The semiconductor device of claim 1 , wherein the second insulation layer is curved to follow the substantially semicircular recess in the sidewall of the first via hole portion.
3. The semiconductor device of claim 2 , wherein the metal layer is curved to follow the curved second insulation layer.
4. The semiconductor device of claim 1 , wherein the metal layer in the via hole engages with the substantially semicircular recess to achieve an adhesion between the metal layer and the substrate.
5. The semiconductor device of claim 1 , wherein the sidewall of the first via hole portion curves so as to reduce stresses generated in the metal layer.
6. A semiconductor device comprising:
a monolithic silicon substrate comprising a front surface and a back surface and having a via hole connecting the front and back surfaces;
a pad electrode disposed on the front surface to cover the via hole;
a first insulation layer disposed between the pad electrode and the front surface of the substrate;
a second insulation layer disposed on a sidewall of the via hole; and
a metal layer disposed in the via hole and on the second insulation layer,
wherein the via hole comprises a first via hole portion extending from the front surface and a second via hole portion extending from the back surface, and a sidewall of the first via hole portion recedes from a point where the first and second insulation layers and the substrate meet so as to form a semicircular recess in the sidewall of the first via hole portion in a cross-sectional view of the semiconductor device.
7. The semiconductor device of claim 1 , wherein the second insulation layer and the metal layer follow the substantially semicircular recess in the sidewall of the first via hole portion so as not fill the via hole fully and to form a receding portion corresponding to the substantially semicircular recess in the sidewall of the first via hole portion.
8. The semiconductor device of claim 6 , wherein the second insulation layer and the metal layer follow the substantially semicircular recess in the sidewall of the first via hole portion so as not fill the via hole fully and to form a receding portion corresponding to the substantially semicircular recess in the sidewall of the first via hole portion.
9. The semiconductor device of claim 1 , wherein a sidewall of the second via hole portion is substantially perpendicular to the front and back surfaces of the substrate.
10. The semiconductor device of claim 6 , wherein a sidewall of the second via hole portion is substantially perpendicular to the front and back surfaces of the substrate.