Patent Assignment
Reel/Frame 050064/0702
Change of Name
Recorded: 2019-08-13
Pages: 8
Assignor
K.K. PANGEA
Executed: 2018-08-01
Assignee
TOSHIBA MEMORY CORPORATION
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Properties
(2)
Semiconductor Device and Manufacturing Method Thereof
Semiconductor Device with via Hole of Uneven Width
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 16, 2005
From: OKAYAMA, YOSHIO; SUZUKI, AKIRA; KAMEYAMA, KOUJIRO; UMEMOTO, MITSUO
To: SANYO ELECTRIC CO., LTD.; KABUSHIKI KAISHA TOSHIBA; FUJITSU LIMITED; NEC CORPORATION
Reel/Frame 016573/0015 →
Assignment of Assignor's Interest
Feb 13, 2009
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 022248/0521 →
Change of Name
Dec 5, 2011
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 027327/0143 →
Assignment of Assignor's Interest
May 28, 2015
From: NEC CORPORATION
To: SANYO ELECTRIC CO., LTD.; KABUSHIKI KAISHA TOSHIBA; FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 035727/0186 →
Demerger
Aug 6, 2019
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 049969/0220 →
Merger
Aug 8, 2019
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 049999/0375 →
Change of Name and Address
Jun 23, 2020
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 053010/0842 →