Apparatus for fixed-form multi-planar extension of electrical conductors beyond the margins of a substrate
View Patent ↗An apparatus, suitable for coupling a pads of integrated circuits on wafer to the pogo pins of a pogo tower in a test system without the need of a probe card, includes a body having a first surface and a second surface, the body having a substantially circular central portion, and a plurality of bendable arms extending outwardly from the central portion, each bendable arm having a connector tab disposed at the distal end thereof; a first plurality of contact terminals disposed on the second surface of the central portion of the body, the first plurality of contact terminals arranged in pattern to match the layout of pads on a wafer to be contacted; at least one contact terminal disposed on the first surface of the plurality of connector tabs; and a plurality of electrically conductive pathways disposed in the body such that each of the first plurality of contact terminals is electrically connected to a corresponding one of the contact terminals on the first surface of the connector tabs.
1. An apparatus, comprising:
a body having a first surface and a second surface, the body having a substantially circular central portion, and a plurality of bendable arms extending radially outwardly from the central portion, each bendable arm having a connector tab disposed at the distal end thereof;
a first plurality of contact terminals disposed on the second surface of the central portion of the body, the first plurality of contact terminals arranged in a pattern to match the layout of a first plurality of pads across a wafer to be contacted, and operable to simultaneously provide electrical connection to each of the first plurality of pads;
at least one contact terminal disposed on the first surface of the plurality of connector tabs;
a plurality of electrically conductive pathways disposed in the body such that each of the first plurality of contact terminals is electrically connected to a corresponding one of the contact terminals on the first surface of the connector tabs; and
a groove for receiving an O-ring on the second surface of the central portion;
wherein the substantially circular central portion of the body is removably attachable to the wafer; wherein the substantially circular central portion of the body has an area that substantially matches the area of the wafer; and wherein the plurality of bendable arms extending radially outwardly from the central portion provide electrical pathways that extend beyond the circumferential edge of the wafer.
2. The apparatus of claim 1 , wherein the connector tabs each have at least one perforation therein.
3. The apparatus of claim 1 , wherein the body is a unitary structure.
4. The apparatus of claim 1 , further comprising an O-ring disposed in the groove.
5. The apparatus of claim 1 , wherein the connector tabs of the bendable arms are disposed in a plane that is different from the plane in which the central portion is disposed.
6. The apparatus of claim 5 , further comprising:
a fixture adapted to receive and mechanically couple with a pogo tower;
wherein at least a portion of the fixture is mechanically coupled to the plurality of bendable arms.
7. The apparatus of claim 6 , wherein the pogo tower includes a plurality of pogo pins; and wherein each contact terminal disposed on the first surface of the connector tabs is in electrical contact with a corresponding pogo pin.
8. The apparatus of claim 1 , wherein at least one perforation is provided in at least one of the connector tabs.
9. The apparatus of claim 1 , wherein the plurality of bendable arms includes at least three bendable arms extending radially outwardly from the circular central portion.
10. An apparatus, comprising:
a body having a first surface and a second surface, the body having a substantially circular central portion, and at least three independently bendable arms extending radially from the central portion, each one of the bendable arms having a connector tab disposed at the distal end thereof;
a first plurality of contact terminals disposed on the second surface of the central portion of the body, the first plurality of contact terminals arranged in a pattern to match the layout of a first plurality of pads across a wafer to be contacted, and operable to simultaneously provide electrical connection to each of the first plurality of pads;
at least one contact terminal disposed on the first surface of the plurality of connector tabs;
a groove for receiving an O-ring on the second surface of the central portion;
a plurality of electrically conductive pathways disposed in the body such that each of the first plurality of contact terminals is electrically connected to a corresponding one of the contact terminals on the first surface of the connector tabs; and
a fixture adapted to receive and mechanically couple with a pogo tower;
wherein at least a portion of the fixture is mechanically coupled to at least one of the bendable arms; wherein the substantially circular central portion of the body is removably attachable to the wafer; wherein the substantially circular central portion of the body has an area that substantially matches the area of the wafer; and wherein the bendable arms extending radially from the central portion provide electrical pathways that extend beyond the circumferential edge of the wafer.
11. The apparatus of claim 10 , wherein the connector tabs of the bendable arms are disposed in a plane that is different from the plane in which the central portion is disposed.