IP Library Patent Application 11834717
Patent Application
App. No. 11/834,717

THIN-FILM DISPOSITION APPARATUS

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Quick Facts
Patent No.
US None
App. No.
11/834,717
Abstract

A dividing plate for a thin-film deposition apparatus divides the interior of the vacuum reaction chamber into a plasma discharge space and a film deposition process space, by fixing or connecting a plurality of laminated plates together by securely bonding them over the entire area of their interfacial surfaces, or a large portion thereof.

Claims (27)

1 . A plasma apparatus comprising:

a chamber comprising a first inside-space, the first inside space including a first sub-space and a second sub-space;

means for evacuating the first inside-space of the chamber;

a member for separating the first sub-space from the second sub-space, wherein said member comprises a first sub-member facing the side of said first sub-space and a second sub-member facing the side of said second sub-space;

the chamber further including a second inside-space between said first sub-member and said second sub-member;

said member has a first though-hole which communicates said first sub-space and said second sub-space in a non-contacting manner with the second inside-space;

said member has a second through-hole which communicates the second inside-space and the second sub-space in a non-contacting manner with the first inside-space;

a first gas inlet for introducing a first gas into the first sub-space;

a second gas inlet for introducing a second gas into the second inside-space; and

means for supplying a high frequency power in the first sub-space.

2 . The plasma apparatus as claimed in claim 1 , wherein said member comprises two plates spaced from each other and a column structure between the two plates and said first through-hole is pierced through the column structure.

3 . The plasma apparatus as claimed in claim 1 , wherein said means for supplying a high frequency power in the first sub-space comprises an electrode having a hole.

4 . The plasma apparatus as claimed in claim 1 , wherein the means for supplying a high frequency power in the first sub-space comprises an electrode not having a hole.

5 . The plasma apparatus as claimed in claim 1 , wherein said means for supplying a high frequency power in the first sub-space comprises an electrode for supplying a high-frequency power.

6 . The plasma apparatus as claimed in claim 1 , wherein said first gas comprises oxygen gas and said second gas comprises a precursor gas.

7 . An apparatus for making a thin-film comprising:

a chamber comprising a first inside-space having a first sub-space and a second sub-space;

means for evacuating the first inside-space of the chamber;

a member for separating the first sub-space from the second sub-space, wherein said member comprises a first sub-member facing the side of said first sub-space and a second sub-member facing the side of said second sub-space;

The chamber further including a second inside-space between said first sub-member and said second sub-member;

said member has a first though-hole which communicates said first sub-space and said second sub-space in a non-contacting manner with the second inside-space;

said member has a second through-hole which communicates the second inside-space and the second sub-space in a non-contacting manner with the first inside-space;

a first gas inlet for introducing a first gas into the first sub-space;

a second gas inlet for introducing a second gas into the second inside-space; and

means for providing a plasma in the first sub-space.

8 . A method for treating a substrate using said plasma apparatus of claim 1 .

9 . A method for making a thin-film using said apparatus of claim 7.

Assignments (2)
CHANGE OF NAME Recorded Oct 20, 2008
From: ANELVA CORPORATION
To: CANON ANELVA CORPORATION
Reel/Frame 021701/0140 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 7, 2007
From: TANAKA, MASAHIKO; IKEMOTO, MANABU; YOKOGAWA, NAOAKI
To: ANELVA CORPORATION
Reel/Frame 019655/0493 →