Straight conductor blind via capture pad structure and fabrication method

1. A capture pad structure comprising:

an integral first dielectric layer;

a trace embedded within the first dielectric layer;

a capture pad embedded within the first dielectric layer, the capture pad comprising:

an end portion of the trace;

a first surface coplanar with a lower surface of the first dielectric layer;

a second surface within the first dielectric layer; and

a first sidewall extending between the first surface of the capture pad and the second surface of the capture pad; and

a second sidewall extending between the first surface of the capture pad and the second surface of the capture pad;

laser-ablated artifacts in the first dielectric layer, the laser-ablated artifacts comprising:

a blind via aperture extending partially through the first dielectric layer from a planar principal surface of the first dielectric layer to the capture pad, wherein a first portion of the first sidewall and a first portion of the second sidewall of the capture pad are exposed by the blind via aperture, and wherein a second portion of the first sidewall and a second portion of the second sidewall of the capture pad are embedded within and in direct contact with the first dielectric layer; and

a channel comprising a channel base and a channel sidewall, the channel sidewall extending between the channel base and the principal surface of the first dielectric layer; and

a partially embedded trace in the channel, wherein the partially embedded trace is partially embedded within the first dielectric layer and partially exposed from the first dielectric layer, wherein the partially embedded trace comprises a trace sidewall in contact with and extending outward beyond the channel sidewall, the trace sidewall extending both inward and outward from the principal surface of the first dielectric layer; and

an exposed trace on the principal surface of the first dielectric layer.

2. The capture pad structure of claim 1 wherein the blind via aperture is defined by a blind via aperture sidewall.

3. The capture pad structure of claim 1 further comprising an electrically conductive blind via within the blind via aperture, the blind via contacting the first portion of the first sidewall and the first portion of the second sidewall.

4. The capture pad structure of claim 1 wherein the blind via aperture extends into the first dielectric layer around the capture pad.

5. The capture pad structure of claim 1 further comprising an electrically conductive blind via within the blind via aperture.

6. The capture pad structure of claim 1 further comprising a second dielectric layer mounted to the first dielectric layer.

7. The capture pad structure of claim 6 wherein a first surface of the second dielectric layer is mounted to the lower surface of the first dielectric layer.

8. The capture pad structure of claim 1 wherein the channel base is recessed below the principal surface of the first dielectric layer such that the channel base is between a plane defined by the principal surface and a plane defined by the lower surface of the first dielectric layer.

9. A capture pad structure comprising:

an integral first dielectric layer comprising a planar principal surface and a lower surface;

a trace embedded within the first dielectric layer at the lower surface;

a capture pad embedded within the first dielectric layer at the lower surface, the capture pad comprising an end portion of the trace;

a blind via aperture extend partially through the first dielectric layer from the principal surface of the first dielectric layer to the capture pad, wherein a first portion of a first sidewall and a first portion of a second sidewall of the capture pad are exposed by the blind via aperture, and wherein a second portion of the first sidewall and a second portion of the second sidewall of the capture pad are embedded within and in direct contact with the first dielectric layer;

an electrically conductive blind via within the blind via aperture, an interlocking structure of the blind via contacting the first portion of the first sidewall and the first portion of the second sidewall;

a partially embedded trace partially embedded within the first dielectric layer and partially exposed from the first dielectric layer, wherein the partially embedded trace comprises a trace sidewall extending both inward and outward from the principal surface of the first dielectric layer; and

an exposed trace on the principal surface of the first dielectric layer.

10. A capture pad structure comprising:

a linear channel formed in a lower surface of an integral first dielectric layer;

a capture pad embedded within the first dielectric layer at the lower surface comprising an electrically conductive material filling the linear channel;

laser-ablated artifacts in a planar principal surface of the first dielectric layer, the laser-ablated artifacts comprising a blind via aperture extending from the principal surface of the first dielectric layer to the capture pad, the laser-ablated artifacts further comprising a channel;

a circuit pattern, the circuit pattern comprising:

a blind via in the blind via aperture, the blind via being electrically coupled to the capture pad, wherein the blind via comprises an interlocking structure extending around a first portion of a first sidewall and a first portion of a second sidewall of the capture pad, and wherein a second portion of the first sidewall and a second portion of the second sidewall of the capture pad are embedded within and in direct contact with the first dielectric layer;

a partially embedded trace within the channel, wherein the partially embedded trace is partially embedded within the first dielectric layer and partially exposed from the first dielectric layer, wherein the partially embedded trace comprises a trace sidewall extending both inward and outward from the principal surface of the first dielectric layer; and

an exposed trace on the principal surface of the first dielectric layer.

11. The capture pad structure of claim 1 wherein the partially embedded trace comprises an in plane out of plane trace.