Method and structure for dispensing chip underfill through an opening in the chip
View Patent ↗A method of making an integrated circuit package includes forming a through hole in an integrated circuit and assembling a die containing the integrated circuit on a carrier so that the die is mechanically and electrically connected to the carrier. Thereafter, an underfill material is dispensed between the die and the carrier via the through hole.
1. The method of making an integrated circuit package, said method comprising:
forming a through hole in an integrated circuit;
assembling a die containing said integrated circuit on a carrier, wherein said assembling comprises mechanically and electrically connecting the die to the carrier; and
thereafter, dispensing an underfill material between the die and the carrier via the through hole, wherein the die is a first die,
said assembling include assembling the first die and a second die in vertical stack on the carrier, wherein the second die is electrically and mechanically nonelected to first die and has a through hole formed therein; and
said dispensing includes dispensing the underfill material between the second die and the first die via through hole in the second die.
2. The method of claim 1 , wherein the vertical stack includes a third die.
3. The method of claim 1 , wherein the through hole in the first die and the through hole in the second die are unaligned along a vertical axis of the vertical stack.
4. The method of claim 1 , wherein said dispensing includes dispensing said underfill material while a vacuum is applied to the die.
5. The method of claim 1 , wherein said forming includes lasing the through hole.
6. The method of claim 1 , wherein:
the die is a first die;
the assembling includes assembling a second die on the carrier adjacent the first die; and
the dispensing includes dispensing the underfill material between the second die and the carrier via the through hole.