IP Library Granted Patent US 7,843,309
Granted Patent B2
US 7,843,309 · App. 11/862,572 · Granted Nov 30, 2010

Power resistor

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Quick Facts
Patent No.
US 7,843,309
App. No.
11/862,572
Granted
Nov 30, 2010
Kind
B2
Abstract

A resistor includes first and second opposite terminations, a resistive element formed from a plurality of resistive element segments between the first and second opposite terminations, at least one segmenting conductive strip separating two of the resistive element segments, and at least one open area between the first and second opposite terminations and separating at least two resistive element segments. Separation of the plurality of resistive element segments assists in spreading heat throughout the resistor. The resistor or other electronic component may be packaged by bonding to a heat sink tab with a thermally conductive and electrically insulative material. The resistive element may be a metal strip, a foil, or film material.

Claims (26)

1. A resistor, comprising:

first and second opposite terminations;

a resistive element formed from a plurality of resistive element segments between the first and second opposite terminations;

at least one segmenting conductive strip separating two of the resistive element segments;

at least one open area between the first and second opposite terminations and separating at least two resistive element segments;

wherein separation of the plurality of resistive element segments assists in spreading heat throughout the power resistor.

2. The resistor of claim 1 wherein the first termination is formed from a first outer metal strip, the resistive element is formed from a middle strip, and the second opposite termination is from a second opposite outer metal strip, the three strips joined together.

3. The resistor of claim 2 wherein the middle strip comprises a resistive material clad with a conductive material, with a portion of the conductive material etched away.

4. The resistor of claim 1 further comprising:

a heat sink tab, the resistive element bonded to the heat sink tab with a thermally conductive and electrically insulative material to thereby mechanically connect the heat sink tab and the resistive element without short circuiting the heat sink tab to the resistive element; and

a molded body encasing the resistive element.

5. The resistor of claim 1 wherein the resistive element is a thin film resistive element.

6. The resistor of claim 1 wherein the plurality of resistive element segments comprises at least four resistive element segments.

7. The resistor of claim 1 wherein the resistive element is a metal strip resistive element.

8. A method of manufacturing a power resistor, comprising:

forming a joined metal strip providing first and second opposite terminations and a resistive element between the first and second opposite terminations wherein the first termination is formed from a first outer metal strip, the resistive element is formed from a middle strip, and the second opposite termination is formed from a second opposite outer metal strip, the three strips joined together to form the joined metal strip;

segmenting the resistive element into a plurality of resistive element segments between the first and second opposite terminations by providing at least one segmenting conductive strip separating two of the resistive element segments and at least one open area between the first and second opposite terminations and separating at least two resistive element segments;

wherein separation of the plurality of resistive element segments assists in spreading heat throughout the power resistor.

9. The method of claim 8 further comprising bonding the resistive element to a heat sink tab with a thermally conductive and electrically insulative material to thereby mechanically connect the heat sink tab and the resistive element without short circuiting the heat sink tab to the resistive element.

10. The method of claim 9 further comprising connecting at least two terminals to the resistive element.

11. The method of claim 10 further comprising encasing the resistive element within a molded body.

12. A method of manufacturing a power resistor, comprising: forming a joined metal strip providing first and second opposite terminations and a resistive element between the first and second opposite terminations wherein the first termination is formed from a first outer metal strip, the resistive element is formed from a middle strip, and the second opposite termination is formed from a second opposite outer metal strip, the three strips joined together to form the joined metal strip;

segmenting the resistive element into a plurality of resistive element segments between the first and second opposite terminations;

trimming one or more of the resistive element segments to provide a current path configured to assist in spreading heat throughout the power resistor.

13. The resistor of claim 12 wherein the resistive element is a thin film resistive element.

14. The resistor of claim 12 wherein the trimming pattern includes at least one slot with first and second opposite ends removed from edges of the resistive element.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.; VISHAY TECHNO COMPONENTS, LLC; VISHAY EFI, INC.; VISHAY VITRAMON, INC.; SPRAGUE ELECTRIC COMPANY
Reel/Frame 049826/0312 →
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE
Reel/Frame 049772/0898 →
SECURITY AGREEMENT Recorded Dec 10, 2015
From: VISHAY DALE ELECTRONICS, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037261/0616 →
SECURITY AGREEMENT Recorded Jan 21, 2011
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 025675/0001 →
RELEASE OF SECURITY INTEREST Recorded Dec 14, 2010
From: COMERICA BANK, AS AGENT, A TEXAS BANKING ASSOCIATION (FORMERLY A MICHIGAN BANKING CORPORATION)
To: VISHAY SPRAGUE, INC., SUCCESSOR-IN-INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC, A DELAWARE CORPORATION; VISHAY DALE ELECTRONICS, INC., A DELAWARE CORPORATION; VISHAY INTERTECHNOLOGY, INC., A DELAWARE CORPORATION; SILICONIX INCORPORATED, A DELAWARE CORPORATION; VISHAY MEASUREMENTS GROUP, INC., A DELAWARE CORPORATION; VISHAY GENERAL SEMICONDUCTOR, LLC, F/K/A GENERAL SEMICONDUCTOR, INC., A DELAWARE LIMITED LIABILITY COMPANY; VISHAY VITRAMON, INCORPORATED, A DELAWARE CORPORATION; YOSEMITE INVESTMENT, INC., AN INDIANA CORPORATION
Reel/Frame 025489/0184 →
SECURITY AGREEMENT Recorded Mar 2, 2010
From: VISHAY SPRAGUE, INC., SUCCESSOR IN INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC; VISHAY DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY MEASUREMENTS GROUP, INC.
To: COMERICA BANK, AS AGENT
Reel/Frame 024006/0515 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 27, 2007
From: ZANDMAN, FELIX; SMITH, CLARK L.; WYATT, TODD L.; VEIK, THOMAS L.; BERTSCH, THOMAS L.
To: VISHAY DALE ELECTRONICS, INC.
Reel/Frame 019890/0058 →