Granted Patent B2

US 7,582,949 · App. 11/870,567 · Granted Sep 1, 2009

Abstract

Claims (11)

1. A design structure embodied in a machine readable medium used in a design process, the design structure comprising:

a first sub-collector formed in an upper portion of a substrate and a lower portion of a first epitaxial layer;

a second sub-collector formed in an upper portion of the first epitaxial layer and a lower portion of a second epitaxial layer;

a reach-through structure connecting the first and second sub-collectors;

an N-well formed in a portion of the second epitaxial layer and in contact with the second sub-collector and the reach-through structure;

N+ diffusion regions in contact with the N-well;

a P+ diffusion region within the N-well; and

shallow trench isolation structures between the N+ and P+ diffusion regions.

2. The design structure of claim 1 , wherein the design structure comprises a netlist, which describes the circuit.

3. The design structure of claim 1 , wherein the design structure resides on storage medium as a data format used for the exchange of layout data of integrated circuits.

4. The design structure of claim 1 , wherein the design structure includes at least one of test data files, characterization data, verification data, or design specifications.

Assignments (6)