Methods for access to a plurality of unsingulated integrated circuits of a wafer using single-sided edge-extended wafer translator
View Patent ↗An apparatus for providing electrical pathways between one or more unsingulated integrated circuits and one or more test circuits external to the integrated circuits, includes a flexible substrate having a first major surface and a second major surface, a plurality of first contact structures disposed in a central portion of the first surface of the flexible substrate, a plurality of second contact structures disposed in a peripheral annular region of the first surface of the flexible substrate, and a plurality of first electrically conductive pathways, each of the plurality of first electrically conductive pathways coupled to a respective first and second contact structure, wherein the second surface is free from first contact structures, second contact structures, and first electrically conductive pathways.
1. A method of providing access to a plurality of unsingulated integrated circuits on a wafer, comprising:
providing a first support structure, the first support structure having a first major surface and a second major surface; the first major surface thereof adapted to receive a wafer, and the second major surface thereof adapted to electrically couple to tester pin electronics external to the integrated circuits;
disposing a wafer, the wafer having a plurality of unsingulated integrated circuits thereon, on the first major surface of the first support structure;
disposing a central portion of a removably attachable, single-sided edge-extended wafer translator over the wafer, and a peripheral portion of the removably attachable, single-sided edge-extended wafer translator on the first surface of the first support structure; and
evacuating one or more gases from between the central portion of the removably attachable, single-sided edge-extended wafer translator and the wafer
wherein the step of evacuating results in the wafer and the central portion of the removably attachable single-sided edge-extended wafer translator being removably attached to each other.
2. The method of claim 1 , further comprising evacuating one or more gases from between the peripheral portion of the removably attachable, single-sided edge-extended wafer translator and the first surface of the first support structure.
3. The method of claim 2 , wherein first contact structures disposed in a wafer-side central portion of removably attachable, single-sided edge-extended wafer translator are in electrical contact with corresponding pads on the wafer; and second contact structures disposed in the wafer-side peripheral region of removably attachable, single-sided edge-extended wafer translator are in electrical contact with corresponding contact terminals disposed on the first surface of the first support structure.
4. The method of claim 3 , wherein the first major surface of the first support structure is planar; wherein the wafer has a backside, wherein the backside of the wafer is disposed on the first major surface of the first support structure; and wherein the backside of the wafer and the second contact structures are substantially coplanar with each other.
5. The method of claim 2 , wherein the one or more gases are evacuated through one or more evacuation pathways in the removably attachable, single-sided edge-extended wafer translator.
6. The method of claim 1 , wherein the first support structure is a tester main board.
7. The method of claim 1 , wherein disposing the wafer of the first support structure comprises disposing backside of the wafer on the first support structure.
8. The method of claim 1 , further comprising communicating signals from a plurality of pin electronics through the first support structure to the peripheral portion of the single-sided edge-extended wafer translator.
9. The method of claim 1 , wherein the single-sided edge-extended wafer translator is flexible.