Semiconductor device and process for manufacturing the same
View Patent ↗The present invention relates to a semiconductor device in which electrodes formed on a semiconductor chip and electrodes formed on a wiring board are electrically connected via projecting elastic electrodes, and further relates to a mounting method of reducing a pressure applied to electrodes formed on a substrate or underlying wirings when a semiconductor chip and a wiring board are bonded.
1. A process for manufacturing a semiconductor device in which a first substrate on which one or more electrodes are formed and a second substrate on which one or more electrodes are formed are electrically connected via elastic bumps having a spring constant of 1000 N/m or lower, which comprises:
preparing a first substrate on which one or more electrodes are formed, and a second substrate on which one or more electrodes are formed and elastic bumps having a spring constant of 1000 N/m or lower are further formed on the one or more electrodes;
flattening a surface of the electrode formed on the first substrate so that the root mean square roughness becomes 10 nm or lower when the root mean square roughness of the surface of the electrode is higher than 10 nm, and flattening a surface of the elastic bump formed on the electrode on the second substrate so that the root mean square roughness becomes 10 nm or lower when the root mean square roughness of the surface of the elastic bump is higher than 10 nm;
activating the surface of the electrode formed on the first substrate and the surface of the elastic bump formed on the one or more electrodes on the second substrate; and
bonding the activated surface of the electrode and the activated surface of the elastic bump.
2. The process for manufacturing a semiconductor device according to claim 1 , wherein the surface of the electrode formed on the first substrate and the surface of the elastic bump formed on the one or more electrodes on the second substrate are activated by a surface activation process.