IP Library Granted Patent US 7,813,210
Granted Patent B2
US 7,813,210 · App. 11/893,644 · Granted Oct 12, 2010

Multiple-type memory

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Quick Facts
Patent No.
US 7,813,210
App. No.
11/893,644
Granted
Oct 12, 2010
Kind
B2
Abstract

A multiple-type memory is disclosed. The multiple-type memory includes memory blocks in communication with control logic blocks. The memory blocks and the control logic blocks are configured to emulate a plurality of memory types. The memory blocks can be configured into a plurality of memory planes that are vertically stacked upon one another. The vertically stacked memory planes may be used to increase data storage density and/or the number of memory types that can be emulated by the multiple-type memory. Each memory plane can emulate one or more memory types. The control logic blocks can be formed in a substrate (e.g., a silicon substrate including CMOS circuitry) and the memory blocks or the plurality of memory planes can be positioned over the substrate and in communication with the control logic blocks. The multiple-type memory may be non-volatile so that stored data is retained in the absence of power.

Claims (28)

1. A memory, comprising:

a plurality of memory blocks vertically configured across a plurality of memory planes; and

a plurality of control logic blocks in communication with the plurality of memory blocks, the plurality of memory blocks and the plurality of control logic blocks being configured to emulate a plurality of memory types, and

wherein the plurality of control logic blocks are positioned in a logic plane with the plurality of memory planes positioned over the logic plane.

2. The memory of claim 1 , wherein the plurality of control logic blocks are configured to emulate a plurality of interfaces of the plurality of memory types.

3. The memory of claim 1 , wherein each of the plurality of memory blocks corresponds to an associated control logic block, the associated control logic block being included in the plurality of control logic blocks.

4. The memory of claim 3 , wherein each of the plurality of memory blocks and the associated control logic block are configured to function as one of the plurality of memory types.

5. The memory of claim 1 , wherein logic plane is positioned in a substrate.

6. The memory of claim 1 , wherein a memory size of each of the plurality of memory types is configured to be adjustable.

7. The memory of claim 1 , wherein one or more of the plurality of memory blocks are configured to be dynamically allocated to one of the plurality of memory types.

8. A computing system, comprising:

a processor; and

a vertically configured multiple-type memory in communication with the processor, the vertically configured multiple-type memory being configured to emulate a plurality of memory types, the vertically configured multiple-type memory including

a plurality of memory blocks positioned in a plurality of memory planes, and

a plurality of control logic blocks positioned in a logic plane, the plurality of control logic blocks are in communication with the plurality of memory blocks, and the plurality of control logic blocks being configured to emulate a plurality of interfaces to the plurality of memory types,

wherein the plurality of memory planes are positioned above the logic plane and the logic plane is positioned in a substrate.

9. The computing system of claim 8 , wherein a memory size of each of the plurality of memory types is configured to be adjustable.

10. The computing system of claim 8 , wherein each of the plurality of memory types is selected from the group consisting of a dynamic random access memory (DRAM), a static random access memory (SRAM), a FLASH memory, and an electrically-erasable programmable read-only memory (EEPROM).

11. The computing system of claim 8 , wherein each of the plurality of control logic blocks is in communication with only one of the plurality of memory blocks.

12. A memory, comprising:

a plurality of memory blocks vertically configured into a plurality of memory planes; and

a plurality of control logic blocks in communication with the plurality of memory blocks, the plurality of control logic blocks being configured to emulate a plurality of interfaces to a plurality of memory types, and

wherein the plurality of control logic blocks are positioned in a logic plane and the plurality of memory planes are positioned over the logic plane.

13. The memory of claim 12 , wherein the plurality of memory blocks and the plurality of control logic blocks are configured to emulate the plurality of memory types.

14. The memory of claim 12 , wherein one or more of the plurality of memory blocks are configured to be dynamically allocated to one of the plurality of memory types.

15. The memory of claim 12 , wherein each of the plurality of memory blocks corresponds to an associated control logic block, the associated control logic block being included in the plurality of control logic blocks.

16. The memory of claim 15 , wherein each of the plurality of memory blocks and the associated control logic block are configured to function as one of the plurality of memory types.

17. The memory of claim 12 , wherein the logic plane is positioned in a substrate.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2014
From: UNITY SEMICONDUCTOR CORPORATION
To: III HOLDINGS 1, LLC
Reel/Frame 032606/0079 →
RELEASE OF SECURITY INTEREST Recorded Dec 12, 2013
From: SILICON VALLEY BANK; GOLD HILL VENTURE LENDING 03, LP
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 031774/0280 →
CORRECTION TO THE RECORDATION COVER SHEET OF THE INTELLECTUAL PROPERTY SECURITY AGREEMENT RECORDED AT 23129/669 ON 4/13/2009 Recorded Dec 12, 2013
From: UNITY SEMICONDUCTOR CORPORATION
To: SILICON VALLEY BANK; GOLD HILL VENTURE LENDING 03, LP
Reel/Frame 031805/0573 →
RELEASE Recorded Apr 9, 2012
From: SILICON VALLEY BANK; GOLD HILL CAPITAL
To: UNITY SEMICONDUCTOR, INC.
Reel/Frame 028132/0675 →
SECURITY AGREEMENT Recorded Apr 13, 2009
From: UNITY SEMICONDUCTOR CORPORATION
To: GOLD HILL CAPITAL
Reel/Frame 023129/0669 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 2, 2007
From: NORMAN, ROBERT
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 019911/0032 →