Patent Assignment
Reel/Frame 032606/0079
Assignment of Assignor's Interest
Recorded: 2014-04-03
Pages: 15
Assignor
UNITY SEMICONDUCTOR CORPORATION
Executed: 2014-03-17
Assignee
III HOLDINGS 1, LLC
2711 CENTERVILLE RD., SUITE 400, WILMINGTON, DELAWARE, 19808
Covered Properties
(52)
Conductive Memory Array Having Page Mode and Burst Mode Write Capability
Conductive Memory Array Having Page Mode and Burst Mode Read Capability
Storage Controller for Multiple Configurations of Vertical Memory
Serial Memory Interface
Memory Power Management
Two-Cycle Sensing in a Two-Terminal Memory Array Having Leakage Current
Fast Data Access Through Page Manipulation
Multiple-Type Memory
Memory Emulation in an Image Capture Device
Memory Emulation in an Electronic Organizer
Memory Emulation in a Cellular Telephone
Memory Emulation Using Resistivity-Sensitive Memory
Planar Third Dimensional Memory with Multi-Port Access
Integrated Circuits and Methods to Compensate for Defective Memory in Multiple Layers of Memory
Emulation of a Nand Memory System
Combined Memories in Integrated Circuits
Media Player with Non-Volatile Memory
Buffering Systems for Accessing Multiple Layers of Memory in Integrated Circuits
Buffering Systems Methods for Accessing Multiple Layers of Memory in Integrated Circuits
Non-Volatile Register Having a Memory Element and Register Logic Vertically Configured on a Substrate
Method for Two-Cycle Sensing in a Two-Terminal Memory Array Having Leakage Current
Solid State Drive with Non-Volatile Memory for a Media Device
Transient Storage Device Emulation Using Resistivity-Sensitive Memory
Serial Memory Interface
Memory Emulation Using Resistivity Sensitive Memory
Third Dimensional Memory with Compress Engine
Non-Volatile Dual Port Third Dimensional Memory
Columnar Replacement of Defective Memory Cells
Buffering Systems for Accessing Multiple Layers of Memory in Integrated Circuits
Three-Dimensional Non-Volatile Register with an Oxygen-Ion-Based Memory Element and a Vertically-Stacked Register Logic
Media Player with Non-Volatile Memory
Fast Data Access Through Page Manipulation
Integrated Circuits and Methods to Compensate for Defective Non-Volatile Embedded Memory in One or More Layers of Vertically Stacked Non-Volatile Embedded Memory
System Using Non-Volatile Resistivity-Sensitive Memory for Emulation of Embedded Flash Memory
Asic Including Vertically Stacked Embedded Non-Flash Re-Writable Non-Volatile Memory
Memory Device with Vertically Embedded Non-Flash Non-Volatile Memory for Emulation of Nand Flash Memory
Processor Including Vertically Stacked Third-Dimensional Embedded Re-Writeable Non-Volatile Memory and Registers
Patent:
7,961,529 →
Application:
12/927,795 →
Memory Emulation Using Resistivity-Sensitive Memory
Read Buffering Systems for Accessing Multiple Layers of Memory in Integrated Circuits
Method for Accessing Vertically Stacked Embedded Non-Flash Re-Writable Non-Volatile Memory
Integrated Circuits and Methods to Compensate for Defective Non-Volatile Embedded Memory in One or More Layers of Vertically Stacked Non-Volatile Embedded Memory
Memory Device with Vertically Embedded Non-Flash Non-Volatile Memory for Emulation of Nand Flash Memory
Method for Reading a Third-Dimensional Embedded Re-Writeable Non-Volatile Memory and Registers
Buffering Systems for Accessing Multiple Layers of Memory in Integrated Circuits
Write Buffering Systems for Accessing Multiple Layers of Memory in Integrated Circuits
Combined Memories in Integrated Circuits
Integrated Circuits Using Non Volatile Resistivity Sensitive Memory for Emulation of Embedded Flash Memory
System Including Vertically Stacked Embedded Non Flash Re Writable Non Volatile Memory
Memory Device with Vertically Embedded Non Flash Non Volatile Memory for Emulation of Nand Flash Memory
Combined Memories in Integrated Circuits
Buffering Systems for Accessing Multiple Layers of Memory in Integrated Circuits
Buffering Systems for Accessing Multiple Layers of Memory in Integrated Circuits
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 22, 2003
From: CHEVALLIER, CHRISTOPHE J.; RINERSON, DARRELL
To: UNITY SEMICONDUCTOR COPORATION
Reel/Frame 014854/0749 →
Assignment of Assignor's Interest
Dec 22, 2003
From: CHEVALLIER, CHRISTOPHE J.; RINERSON, DARRELL
To: UNITY SEMICONDUCTOR CORPRATION
Reel/Frame 014853/0511 →
Merger
Jul 28, 2005
From: UNITY SEMICONDUCTOR CORPORATION
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 016323/0107 →
Assignment of Assignor's Interest
Jul 19, 2006
From: NORMAN, ROBERT
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 017960/0176 →
Assignment of Assignor's Interest
Jul 19, 2006
From: NORMAN, ROBERT
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 017960/0194 →
Assignment of Assignor's Interest
Oct 13, 2006
From: NORMAN, ROBERT
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 018388/0440 →
Assignment of Assignor's Interest
Nov 15, 2006
From: RINERSON, DARRELL; CHEVALLIER, CHRISTOPHE; SIAU, CHANG HUA
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 018525/0040 →
Assignment of Assignor's Interest
Feb 19, 2007
From: UNITY SEMICONDUCTOR CORPORATION
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 018903/0458 →
Assignment of Assignor's Interest
Oct 2, 2007
From: NORMAN, ROBERT
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 019911/0032 →
Assignment of Assignor's Interest
Oct 2, 2007
From: NORMAN, ROBERT
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 019911/0050 →
Assignment of Assignor's Interest
Oct 2, 2007
From: NORMAN, ROBERT
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 019911/0045 →
Assignment of Assignor's Interest
Oct 31, 2007
From: NORMAN, ROBERT
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 020047/0422 →
Assignment of Assignor's Interest
Oct 31, 2007
From: NORMAN, ROBERT
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 020047/0139 →
Corrective Assignment to Correct the S/N 11897726 Is Incorrect and Should Be Removed and the Assignment Re-Recorded with Correct Serial Number of 11897909 Previously Recorded on Reel 019911 Frame 0050. Assignor(S) Hereby Confirms the Assignment.
Nov 15, 2007
From: NORMAN, ROBERT
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 020117/0317 →
Assignment of Assignor's Interest
Feb 6, 2008
From: NORMAN, ROBERT
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 020473/0465 →
Assignment of Assignor's Interest
Feb 6, 2008
From: NORMAN, ROBERT
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 020473/0493 →
Assignment of Assignor's Interest
Feb 6, 2008
From: NORMAN, ROBERT
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 020473/0495 →
Assignment of Assignor's Interest
Feb 6, 2008
From: NORMAN, ROBERT
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 020473/0472 →
Assignment of Assignor's Interest
Feb 6, 2008
From: NORMAN, ROBERT
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 020473/0491 →
Security Agreement
Apr 13, 2009
From: UNITY SEMICONDUCTOR CORPORATION
To: GOLD HILL CAPITAL
Reel/Frame 023129/0669 →
Release
Apr 9, 2012
From: SILICON VALLEY BANK; GOLD HILL CAPITAL
To: UNITY SEMICONDUCTOR, INC.
Reel/Frame 028132/0675 →
Corrective Assignment to Correct the Indication of Application Number on the Assignment Document Previously Recorded on Reel 020117 Frame 0317. Assignor(S) Hereby Confirms the Assignment.
Sep 27, 2013
From: NORMAN, ROBERT
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 031333/0670 →
Correction to the Recordation Cover Sheet of the Intellectual Property Security Agreement Recorded at 23129/669 on 4/13/2009
Dec 12, 2013
From: UNITY SEMICONDUCTOR CORPORATION
To: SILICON VALLEY BANK; GOLD HILL VENTURE LENDING 03, LP
Reel/Frame 031805/0573 →
Merger
Dec 12, 2013
From: UNITY SEMICONDUCTOR CORPORATION
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 031774/0701 →
Release of Security Interest
Dec 12, 2013
From: SILICON VALLEY BANK; GOLD HILL VENTURE LENDING 03, LP
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 031774/0280 →