IP Library Granted Patent US 7,822,913
Granted Patent B2
US 7,822,913 · App. 12/004,192 · Granted Oct 26, 2010

Emulation of a NAND memory system

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Quick Facts
Patent No.
US 7,822,913
App. No.
12/004,192
Granted
Oct 26, 2010
Kind
B2
Abstract

A system and a method for emulating a NAND memory system are disclosed. In the method, a command associated with a NAND memory is received. After receipt of the command, a vertically configured non-volatile memory array is accessed based on the command. In the system, a vertically configured non-volatile memory array is connected with an input/output controller and a memory controller. The memory controller is also connected with the input/output controller. The memory controller is operative to interface with a command associated with a NAND memory and based on the command, to access the vertically configured non-volatile memory array for a data operation, such as a read operation or write operation. An erase operation on the vertically configured non-volatile memory array is not required prior to the write operation. The vertically configured non-volatile memory array can be partitioned into planes, blocks, and sub-planes, for example.

Claims (53)

1. A memory system, comprising:

a vertically configured non-volatile memory array including at least one memory plane in contact with a substrate and positioned above circuitry fabricated in a logic plane of the substrate;

an input/output controller connected with the vertically configured non-volatile memory array; and

a memory controller connected with the vertically configured non-volatile memory array and the input/output controller, the memory controller being configured to interface with a command associated with a NAND memory and being configured to access the vertically configured non-volatile memory array based on the command.

2. The memory system of claim 1 , wherein the memory controller includes logic configured to,

receive a block erase command to erase a memory block,

assert a busy signal for a time period, and

release the busy signal after the time period,

wherein an erase operation is not performed during the time period.

3. The memory system of claim 1 , wherein the memory controller includes logic configured to,

receive a block erase command to erase a memory block,

assert a busy signal,

write a plurality of zeros to the memory block, and

release the busy signal after writing the plurality of zeros to the memory block.

4. The memory system of claim 3 , wherein the logic configured to write the plurality of zeros to the memory block includes logic configured to write the plurality of zeros to an overhead section and a data section associated with the memory block.

5. The memory system of claim 3 , wherein the logic configured to write the plurality of zeros to the memory block includes logic configured to write the plurality of zeros to a data section associated with the memory block.

6. The memory system of claim 3 , wherein the logic configured to write the plurality of zeros to the memory block includes logic configured to write the plurality of zeros to an overhead section associated with the memory block.

7. The memory system of claim 3 , wherein the input/output controller includes logic configured to receive a plurality of data and a memory address associated with the plurality of data,

wherein the memory controller includes logic configured to receive a write command, to write the plurality of data to the memory address based on the write command, and to write the plurality of data to the vertically configured non-volatile memory array at the memory address,

wherein the plurality of data is written to the vertically configured non-volatile memory array without performing an erase operation before writing the plurality of data to the vertically configured non-volatile memory array.

8. The memory system of claim 1 , wherein the vertically configured non-volatile memory array is divided into a plurality of memory blocks.

9. The memory system of claim 8 , wherein each of the plurality of memory blocks is divided into a plurality of pages.

10. The memory system of claim 1 , wherein the vertically configured non-volatile memory array includes a plurality of two-terminal memory cells.

11. The memory system of claim 1 , wherein the vertically configured non-volatile memory array is configured as a cross-point array.

12. A memory system, comprising:

an input/output controller; and

a memory controller connected with the input/output controller, the memory controller being configured to

receive a block erase command associated with a NAND memory,

assert a busy signal for a time period, and

release the busy signal after the time period,

wherein an erase operation is not performed during the time period.

13. The memory system of claim 12 , wherein the memory controller is further configured to write a plurality of zeros to a memory block during the time period.

14. The memory system of claim 13 , wherein the plurality of zeros is written to an overhead section and a data section associated with the memory block.

15. The memory system of claim 13 , wherein the plurality of zeros is written to a data section associated with the memory block without writing the plurality of zeros to an overhead section associated with the memory block.

16. The memory system of claim 12 and further comprising:

a vertically configured non-volatile memory array connected with the input/output controller and the memory controller.

17. The memory system of claim 16 , wherein the vertically configured non-volatile memory is divided into a sector, the sector including an overhead section and a data section.

18. The memory system of claim 16 , wherein the vertically configured non-volatile memory array includes a plurality of two-terminal memory cells.

19. The memory system of claim 16 , wherein the vertically configured non-volatile memory array is configured as a cross-point array.

20. A method for emulating a NAND memory system, comprising:

receiving a command associated with a NAND memory; and

accessing a vertically configured non-volatile memory array based on the command associated with the NAND memory, the vertically configured non-volatile memory array including at least one memory plane in contact with a substrate and positioned above circuitry fabricated in a logic plane of the substrate.

21. The method of claim 20 , wherein the command associated with the NAND memory is a block erase command to erase a memory block and wherein the accessing the vertically configured non-volatile memory array comprises,

asserting a busy signal for a time period, and

releasing the busy signal after the time period,

wherein an erase operation is not performed during the time period.

22. The method of claim 20 , wherein the command associated with the NAND memory is a block erase command to erase a memory block and wherein the accessing the vertically configured non-volatile memory array comprises,

asserting a busy signal,

writing a plurality of zeros to the memory block, and

releasing the busy signal after the writing of the plurality of zeros to the memory block.

23. The method of claim 20 , wherein the command associated with the NAND memory is a write command to write a plurality of data and wherein the accessing the vertically configured non-volatile memory array comprises writing the plurality of data to the vertically configured non-volatile memory array without performing an erase operation before the writing of the plurality of data.

24. The method of claim 20 , wherein the vertically configured non-volatile memory array is divided into a plurality of memory blocks, each of the plurality of memory blocks being divided into a plurality of pages.

25. The method of claim 20 , wherein the vertically configured non-volatile memory array includes a plurality of two-terminal memory cells.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2014
From: UNITY SEMICONDUCTOR CORPORATION
To: III HOLDINGS 1, LLC
Reel/Frame 032606/0079 →
RELEASE OF SECURITY INTEREST Recorded Dec 12, 2013
From: SILICON VALLEY BANK; GOLD HILL VENTURE LENDING 03, LP
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 031774/0280 →
CORRECTION TO THE RECORDATION COVER SHEET OF THE INTELLECTUAL PROPERTY SECURITY AGREEMENT RECORDED AT 23129/669 ON 4/13/2009 Recorded Dec 12, 2013
From: UNITY SEMICONDUCTOR CORPORATION
To: SILICON VALLEY BANK; GOLD HILL VENTURE LENDING 03, LP
Reel/Frame 031805/0573 →
RELEASE Recorded Apr 9, 2012
From: SILICON VALLEY BANK; GOLD HILL CAPITAL
To: UNITY SEMICONDUCTOR, INC.
Reel/Frame 028132/0675 →
SECURITY AGREEMENT Recorded Apr 13, 2009
From: UNITY SEMICONDUCTOR CORPORATION
To: GOLD HILL CAPITAL
Reel/Frame 023129/0669 →