IP Library Granted Patent US 7,593,284
Granted Patent B2
US 7,593,284 · App. 11/975,275 · Granted Sep 22, 2009

Memory emulation using resistivity-sensitive memory

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Quick Facts
Patent No.
US 7,593,284
App. No.
11/975,275
Granted
Sep 22, 2009
Kind
B2
Abstract

Interface circuitry in communication with at least one non-volatile resistivity-sensitive memory is disclosed. The memory includes a plurality of non-volatile memory elements that may have two-terminals, are operative to store data as a plurality of conductivity profiles that can be determined by applying a read voltage across the memory element, and retain stored data in the absence of power. A plurality of the memory elements can be arranged in a cross-point array configuration. The interface circuitry electrically communicates with a system configured for memory types, such as DRAM, SRAM, and FLASH, for example, and is operative to communicate with the non-volatile resistivity-sensitive memory to emulate one or more of those memory types. The interface circuitry can be fabricated in a logic plane on a substrate with at least one non-volatile resistivity-sensitive memory vertically positioned over the logic plane. The non-volatile resistivity-sensitive memories may be vertically stacked upon one another.

Claims (33)

1. A SRAM emulating non-volatile memory, comprising:

a static random access memory (SRAM) interface circuitry positioned in a logic plane and operative to electrically communicate with a plurality of signals configured for SRAM data operations, the plurality of signals including an address signal and at least one data signal; and

a non-volatile memory array vertically positioned over the logic plane and in contact with the logic plane, the non-volatile memory array is electrically coupled with the SRAM interface circuitry, the non-volatile memory array including a plurality of memory elements,

each memory element including two terminals and operative to store data as a plurality of conductivity profiles that can be determined by applying a read voltage across the two terminals, the data is retained in the absence of power, the data is written by applying a write voltage across the two terminals, the write voltage is less than the read voltage, and

wherein the SRAM interface circuitry is operative to perform data operations on the non-volatile memory array in response to the plurality of signals and the data operations emulate SRAM data operations.

2. The SRAM emulating non-volatile memory of claim 1 , wherein the logic plane is fabricated in a substrate.

3. The SRAM emulating non-volatile memory of claim 1 , wherein the non-volatile memory array comprises a two-terminal cross-point memory array.

4. The SRAM emulating non-volatile memory of claim 1 , wherein the plurality of signals further comprises

a chip-select signal operative to select the non-volatile memory array for a data operation,

a read-write signal operative to configure the non-volatile memory array for a read operation or a write operation, and

an output enable signal operative output data from the non-volatile memory array during the read operation.

5. The SRAM emulating non-volatile memory of claim 1 , wherein the at least one data signal comprises a selected one of a split data interface where write data is received on a first signal and read data is transmitted on a second signal or a shared data interface where read data and write data are communicated using a single signal.

6. The SRAM emulating non-volatile memory of claim 1 , wherein the SRAM interface circuitry is operative to perform the data operations in a cycle that is approximately no longer in duration than a SRAM data operations cycle.

7. The SRAM emulating non-volatile memory of claim 1 and further comprising:

a plurality of the non-volatile memory arrays, at least one of the plurality of the non-volatile memory arrays is vertically stacked upon another of the plurality of the non-volatile memory arrays, at least one of the plurality of the non-volatile memory arrays is in contact with the logic plane, and the plurality of the non-volatile memory arrays are electrically coupled with the SRAM interface circuitry.

8. A DRAM emulating non-volatile memory, comprising:

a dynamic random access memory (DRAM) interface circuitry positioned in a logic plane and operative to electrically communicate with a plurality of signals configured for DRAM data operations,

the plurality of signals including an address signal, a RAS signal, a CAS signal, and at least one data signal, the address signal including a row address select (RAS) address and a column address select (CAS) address, the RAS signal operative to indicate transmission of the RAS address and the CAS signal operative to indicate transmission of the CAS; and

a non-volatile memory array vertically positioned over the logic plane and in contact with the logic plane, the non-volatile memory array is electrically coupled with the DRAM interface circuitry, the non-volatile memory array including a plurality of memory elements,

each memory element including two terminals and operative to store data as a plurality of conductivity profiles that can be determined by applying a read voltage across the two terminals, the data is retained in the absence of power, the data is written by applying a write voltage across the two terminals, the write voltage is less than the read voltage, and

wherein the DRAM interface circuitry is operative to perform data operations on the non-volatile memory array in response to the plurality of signals and the data operations emulate DRAM data operations.

9. The DRAM emulating non-volatile memory of claim 8 , wherein the logic plane is fabricated in a substrate.

10. The DRAM emulating non-volatile memory of claim 8 , wherein the non-volatile memory array comprises a two-terminal cross-point memory array.

11. The DRAM emulating non-volatile memory of claim 8 , wherein the plurality of signals further comprises

a chip-select signal operative to select the non-volatile memory array for a data operation,

a read-write signal operative to configure the non-volatile memory array for a read operation or a write operation,

an output enable signal operative to enable stored data to be output from the non-volatile memory array during the read operation,

a data clock signal configured to activate when the at least one data signal is transmitting data, and

a clock signal operative to emulate DRAM clock timing.

12. The DRAM emulating non-volatile memory of claim 8 , wherein the at least one data signal comprises a selected one of a split data interface where write data is received on a first signal and read data is transmitted on a second signal or a shared data interface where read data and write data are communicated using a single signal.

13. The DRAM emulating non-volatile memory of claim 8 , wherein the DRAM interface circuitry is operative to perform the data operations in a cycle that is approximately no longer in duration than a DRAM data operations cycle.

14. The DRAM emulating non-volatile memory of claim 8 and further comprising:

a plurality of the non-volatile memory arrays, at least one of the plurality of the non-volatile memory arrays is vertically stacked upon one other of the plurality of the non-volatile memory arrays, at least one of the plurality of the non-volatile memory arrays is in contact with the logic plane, and the plurality of the non-volatile memory arrays are electrically coupled with the DRAM interface circuitry.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2019
From: III HOLDINGS 3, LLC
To: SEAGATE TECHNOLOGY LLC
Reel/Frame 048167/0414 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 5, 2018
From: III HOLDINGS 1, LLC
To: III HOLDINGS 3, LLC
Reel/Frame 046274/0626 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2014
From: UNITY SEMICONDUCTOR CORPORATION
To: III HOLDINGS 1, LLC
Reel/Frame 032606/0079 →
CORRECTION TO THE RECORDATION COVER SHEET OF THE INTELLECTUAL PROPERTY SECURITY AGREEMENT RECORDED AT 23129/669 ON 4/13/2009 Recorded Dec 12, 2013
From: UNITY SEMICONDUCTOR CORPORATION
To: SILICON VALLEY BANK; GOLD HILL VENTURE LENDING 03, LP
Reel/Frame 031805/0573 →
RELEASE OF SECURITY INTEREST Recorded Dec 12, 2013
From: SILICON VALLEY BANK; GOLD HILL VENTURE LENDING 03, LP
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 031774/0280 →
RELEASE Recorded Apr 9, 2012
From: SILICON VALLEY BANK; GOLD HILL CAPITAL
To: UNITY SEMICONDUCTOR, INC.
Reel/Frame 028132/0675 →
SECURITY AGREEMENT Recorded Apr 13, 2009
From: UNITY SEMICONDUCTOR CORPORATION
To: GOLD HILL CAPITAL
Reel/Frame 023129/0669 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 31, 2007
From: NORMAN, ROBERT
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 020047/0422 →
Continuity (1)
Related Publication 20090106013A1 · Apr 23, 2009