Wafer boat for semiconductor testing
View Patent ↗In accordance with one embodiment of the invention, a method and apparatus are provided for testing a wafer while the wafer is disposed in a wafer carrier. The test results can be utilized to adjust the manufacturing process and thereby increase processing yield.
1. A method of testing wafers, said method comprising:
providing a wafer carrier;
disposing a wafer in said wafer carrier;
moving said wafer carrier and said wafer between a first manufacturing location and a second manufacturing location; and
testing said wafer while said wafer is disposed in said wafer carrier and after completion of manufacturing operations at said first manufacturing location and before manufacturing operations at said second manufacturing location.
2. The method as claimed in claim 1 wherein said testing comprises:
testing said wafer while said wafer carrier is in transit from said first manufacturing location to said second manufacturing location.
3. The method as claimed in claim 1 wherein said testing comprises:
utilizing test circuitry disposed on said wafer carrier.
4. The method as claimed in claim 1 wherein said testing comprises:
utilizing a laser mounted on said wafer carrier to test said wafer.
5. The method as claimed in claim 1 wherein said testing comprises:
utilizing a wireless transmitter mounted on said wafer carrier to transmit a wireless test signal to said wafer.
6. The method as claimed in claim 1 wherein said testing comprises:
testing said wafer while in transit on a transportation vehicle.
7. The method as claimed in claim 6 wherein said testing comprises:
testing said wafer while in transit on an airplane.
8. The method as claimed in claim 1 wherein said method comprises:
transmitting a test signal from said wafer carrier to said wafer so as to initiate a test on a built-in-self-test circuit on said wafer.
9. The method as claimed in claim 1 and further comprising:
determining a test result and storing said test result at said wafer carrier.
10. The method as claimed in claim 1 and further comprising:
transmitting a test result determined for said wafer to a location remote from said wafer carrier.
11. The method as claimed in claim 1 and further comprising:
determining test data for said wafer; and
adjusting the manufacturing process based upon said test data.
12. The method as claimed in claim 11 wherein said adjusting the manufacturing comprises:
adjusting an upstream manufacturing process.
13. The method as claimed in claim 11 wherein said adjusting the manufacturing comprises:
adjusting downstream manufacturing processes.
14. The method as claimed in claim 11 wherein said adjusting the manufacturing comprises:
correcting a manufacturing defect of said wafer.
15. The method as claimed in claim 1 and further comprising:
downloading a first test routine to said wafer carrier; and
downloading a second test routine to said wafer carrier.
16. The method as claimed in claim 15 and further comprising:
utilizing said first test routine to test said wafer between said first and second manufacturing locations; and
utilizing said second test routine to test said wafer between said second manufacturing location and a third manufacturing location.
17. The method as claimed in claim 15 wherein said downloading of said second test routine is completed after completion of said first test routine.