IP Library Granted Patent US 7,689,897
Granted Patent B2
US 7,689,897 · App. 11/914,700 · Granted Mar 30, 2010

Method and device for high speed testing of an integrated circuit

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Quick Facts
Patent No.
US 7,689,897
App. No.
11/914,700
Granted
Mar 30, 2010
Kind
B2
Abstract

An integrated circuit and a method for testing an integrated circuit. The method includes providing a first high frequency clock signal sequence to a first group of components of an integrated circuit during a test sequence; characterized by receiving, by a first memory circuit within the integrated circuit, at a low reception rate, a first high frequency signal pattern information and a first low frequency signal pattern information; generating the first high frequency clock signal sequence in response to a first high frequency clock signal and in response to the first high frequency signal pattern information; wherein the first high frequency signal pattern information is being retrieved at a first high retrieval rate from the first memory circuit; and generating a first low frequency clock signal sequence in response a first low frequency clock signal and in response to the first low frequency signal pattern information; wherein the first high frequency signal pattern information is being retrieved at a low retrieval rate from the first memory circuit.

Claims (36)

1. A method for testing an integrated circuit, the method comprises:

providing a first high frequency clock signal by a first high frequency clock source of the integrated circuit;

receiving, by a first memory circuit within the integrated circuit, at a low reception rate, a first high frequency signal pattern information and a first low frequency signal pattern information;

generating the first high frequency clock signal sequence in response to a first high frequency clock signal and in response to the first high frequency signal pattern information, wherein the first high frequency signal pattern information is being retrieved at a first high retrieval rate from the first memory circuit;

providing the first high frequency clock signal sequence to a first group of components of an integrated circuit during a test sequence; and

generating a first low frequency clock signal sequence in response a first low frequency clock signal and in response to the first low frequency signal pattern information, wherein the first low frequency signal pattern information is being retrieved at a low retrieval rate from the first memory circuit.

2. The method according to claim 1 wherein the step of receiving, comprises sequentially receiving the first high frequency signal pattern information and the first low frequency pattern information.

3. The method according to claim 1 wherein the first high frequency signal pattern comprises a launch signal and a capture signal that are spaced apart from each other by a period that defines a high speed test period.

4. The method according to claim 3 and comprising generating a second high frequency clock sequence.

5. The method according to claim 4 wherein the second high frequency clock sequence is provided to a second group of components of the integrated circuit during a test sequence.

6. The method according to claim 4 wherein the second high frequency clock sequence is retrieved from a second memory unit of the integrated circuit at a second high retrieval rate, the first high frequency clock sequence is retrieved at the first high retrieval rate that differs from the second high retrieval rate, wherein the method further comprises providing the second high frequency clock signal sequence to a second group of components of the integrated circuit during a test sequence.

7. The method according to claim 1 wherein a first high frequency of the first high frequency clock signal sequence is at least double of a first low frequency of the first low frequency clock signal sequence.

8. The method according to claim 1 wherein the first group of components form at least one scan chain.

9. The method according to claim 1 wherein the receiving comprises receiving at least a portion of the first low frequency signal pattern information while retrieving at least a portion of the first high frequency signal pattern information.

10. The method according to claim 1 wherein generating the first high frequency clock signal sequence comprises applying at least one binary operation on the first high frequency clock signal and the retrieved first high frequency signal pattern information to provide the first high frequency clock signal sequence.

11. The method according to claim 1 comprising receiving a first high frequency clock signal, a first low frequency clock signal and selecting one out of these clock signal as a first retrieval triggering signal.

12. The method according to claim 1 wherein the first memory circuit is a first in first out memory circuit.

13. The method according to claim 1 wherein the first memory circuit is dual access memory circuit.

14. An integrated circuit that comprises:

a first group of components;

a first high frequency clock generator for generating a first high frequency clock signal;

a first memory circuit, adapted to receive at a low reception rate, a first high frequency signal pattern information and a first low frequency signal pattern information, wherein the first high frequency signal pattern information and the first low frequency signal pattern information are being provided from an external test device;

a first clock signal sequence circuit adapted to generate a first high frequency clock signal sequence in response to the first high frequency signal pattern information and in response to the first high frequency clock signal, wherein the first high frequency signal pattern information is being retrieved at a first high retrieval rate from the first memory circuit and provided to the first group of components; and

wherein the first clock signal sequence circuit is further adapted to generate a first low frequency signal sequence in response to the first low frequency signal pattern information and in response to a first low frequency clock signal; wherein the first low frequency signal pattern information is being retrieved at a low retrieval rate from the first memory circuit and provided to the first group of components.

15. The integrated circuit according to claim 14 adapted to sequentially receive the first high frequency signal pattern information and the first low frequency pattern information.

16. The integrated circuit according to claim 14 , wherein the first high frequency signal pattern comprises a launch signal and a capture signal that are spaced apart from each other by a period that defines a high speed test period.

17. The integrated circuit according to claim 14 , comprising a second clock signal sequence circuit and a second memory circuit, wherein the second memory circuit is adapted to receive at a retrieval rate, a second high frequency signal pattern information, wherein the second clock signal sequence circuit is adapted to generate a second high frequency clock signal sequence in response to the second high frequency signal pattern information, wherein the second high frequency signal pattern information is provided to the second group of components.

18. The integrated circuit according to claim 17 , wherein the second clock signal sequence circuit retrieves a second clock signal pattern information at a second retrieval rate that differs from the first high retrieval rate.

19. The integrated circuit according to claim 14 , wherein the integrated circuit comprises a second group of components 16 that receives a second clock signal sequence from a second clock signal sequence circuit.

20. The integrated circuit according to claim 14 , wherein a first high frequency of the first high frequency clock signal sequence is at least double of a first low frequency of the first low frequency clock signal sequence.

21. The integrated circuit according to claim 14 , wherein the first group of components form at least one scan chain that receive the first high frequency signal pattern information at a first high retrieval rate from the first memory circuit.

22. The integrated circuit according to claim 14 , wherein the first memory circuit is adapted to receive at least a portion of the first low frequency signal pattern information while retrieving at least a portion of the first high frequency signal pattern information.

23. The integrated circuit according to claim 14 , wherein the first clock signal sequence circuit is adapted to apply at least one binary operation on the first high frequency clock signal and the retrieved first high frequency signal pattern information to provide the first high frequency clock signal sequence.

24. The integrated circuit according to claim 14 , wherein the first clock signal sequence circuit is adapted to receive a first high frequency clock signal, a first low frequency clock signal and select one out of these clock signals as a first retrieval triggering signal that triggers the retrieval of the first high frequency signal pattern information.

25. The integrated circuit according to claim 14 , wherein the first memory circuit is a first in first out memory circuit.

26. The integrated circuit according to claim 14 , wherein the first memory circuit is a dual access memory circuit.

Assignments (41)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
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CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
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RELEASE OF SECURITY INTEREST Recorded May 29, 2017
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP USA, INC. F/K/A FREESCALE SEMICONDUCTOR, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 29, 2017
From: NXP USA, INC.
To: VLSI TECHNOLOGY LLC
Reel/Frame 042374/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
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CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE LISTED CHANGE OF NAME SHOULD BE MERGER AND CHANGE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0180. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 12, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
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CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
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RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
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RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
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PATENT RELEASE Recorded Dec 21, 2015
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To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
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To: FREESCALE SEMICONDUCTOR, INC.
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From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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SECURITY AGREEMENT Recorded Nov 6, 2013
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To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Sep 3, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Sep 3, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Sep 1, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Sep 1, 2010
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To: CITIBANK, N.A., AS COLLATERAL AGENT
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SECURITY AGREEMENT Recorded May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
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SECURITY AGREEMENT Recorded Mar 15, 2010
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To: CITIBANK, N.A.
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SECURITY AGREEMENT Recorded Jul 11, 2008
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To: CITIBANK, N.A.
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 16, 2007
From: PRIEL, MICHAEL; SOLOMON, EYAL; ZALTZMAN, AMIR
To: FREESCALE SEMICONDUCTOR, INC.
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