Integrated circuit package system with array of external interconnects
View Patent ↗An integrated circuit package system includes: forming an array of external interconnects with an intersecting region between the external interconnects; removing the intersecting region for forming an isolation hole between the external interconnects; mounting an integrated circuit die over the external interconnects; connecting an internal interconnect between the integrated circuit die and the external interconnects; and forming a package encapsulation over the integrated circuit die with the external interconnects partially exposed.
1. An integrated circuit package system comprising:
a conductive grid, comprising a die-attach paddle in a central area of the conductive grid, and an array of external interconnects having an intersecting region between the external interconnects with isolation holes between the external interconnects, wherein one of the isolation holes borders four of the external interconnects at the intersecting region;
an array encapsulation on and between the external interconnects;
an integrated circuit die over the die-attach paddle;
an internal interconnect between the integrated circuit die and the external interconnects; and
a package encapsulation over the integrated circuit die with the external interconnects partially exposed includes the package encapsulation extending into the isolation holes and being in contact with the array encapsulation.
2. The system as claimed in claim 1 wherein the isolation holes have a curved shaped opening.
3. The system as claimed in claim 1 wherein the package encapsulation is in contact with the external interconnects.
4. The system as claimed in claim 1 wherein the array of the external interconnects includes a narrow portion adjacent to each of the isolation holes.
5. The system as claimed in claim 1 wherein:
the array of the external interconnects includes:
a narrow portion adjacent to each of the isolation holes, and
the package encapsulation includes:
the package encapsulation under the narrow portion.
6. The system as claimed in claim 1 wherein:
the array of the external interconnects include an array of leads; and
the package encapsulation is in contact with the external interconnects.
7. The system as claimed in claim 6 wherein:
the package encapsulation is formed from the same material as the array encapsulation.
8. The system as claimed in claim 6 wherein at least one of the isolation holes is between the die-attach paddle and the leads.
9. The system as claimed in claim 6 wherein the array of the leads includes a nickel-palladium material.
10. The system as claimed in claim 6 wherein the internal interconnects are bond wires.