Integrated circuit package system with package integration

1. A method for manufacturing an integrated circuit package system comprising:

providing a substrate having a cavity;

sealing a package with a seal, the package having connectors over the cavity of the substrate; and

applying an encapsulant over the package with the encapsulant outside a periphery of the seal having the connectors exposed from the encapsulant and partially in the cavity.

2. The method as claimed in claim 1 wherein sealing the package over the cavity of the substrate includes applying a seal material.

3. The method as claimed in claim 1 wherein sealing the package over the cavity of the substrate includes forming the seal with the package and the substrate without the need for a seal material.

4. The method as claimed in claim 1 wherein sealing the package over the cavity of the substrate includes applying a package interconnect between the package and the substrate.

5. The method as claimed in claim 1 further comprising attaching a device partially in the cavity of the substrate.

6. A method for manufacturing an integrated circuit package system comprising;

providing a package substrate having a package substrate cavity;

sealing a base package with a seal, the base package having connectors over the package substrate cavity; and

applying a package encapsulant over the base package with the package encapsulant outside a periphery of the seal having the connectors exposed from the package encapsulant and partially in the package substrate cavity.

7. The method as claimed in claim 6 further comprising mounting an electronic device partially in the package substrate cavity.

8. The method as claimed in claim 6 further comprising surface mounting an electronic device partially in the package substrate cavity.

9. The method as claimed in claim 6 further comprising attaching a quad flat no-lead package partially in the package substrate cavity.

10. The method as claimed in claim 6 further comprising attaching a quad flat package or a thin shrink small outline package partially in the package substrate cavity.

11. An integrated circuit package system comprising:

a substrate having a cavity;

a package having connectors sealed with a seal to the substrate over the cavity; and

an encapsulant over the package with the encapsulant outside a periphery of the seal having the connectors exposed from the encapsulant and partially in the cavity.

12. The system as claimed in claim 11 wherein the package over the cavity of the substrate includes a seal material.

13. The system as claimed in claim 11 wherein the package over the cavity of the substrate includes the package sealed to the substrate without the need for a seal material.

14. The system as claimed in claim 11 wherein the package over the cavity of the substrate includes a package interconnect between the package and the substrate.

15. The system as claimed in claim 11 further comprising a device partially in the cavity of the substrate.

16. The system as claimed in claim 11 wherein:

the substrate is a package substrate having a package substrate cavity;

the package is a base package sealed to the package substrate over the package substrate cavity; and

the encapsulant is a package encapsulant over the base package and a portion of the package substrate having substantially none of the package encapsulant in the package substrate cavity.

17. The system as claimed in claim 16 further comprising an electronic device mounted partially in the package substrate cavity.

18. The system as claimed in claim 16 further comprising an electronic device surface mounted partially in the package substrate cavity.

19. The system as claimed in claim 16 further comprising a quad flat no-lead package partially in the package substrate cavity.

20. The system as claimed in claim 16 further comprising a quad flat package or a thin shrink small outline package partially in the package substrate cavity.