Integrated circuit package system with package substrate having corner contacts

1. An integrated circuit package system comprising:

forming a package substrate with a top substrate side and a bottom substrate side;

forming a corner contact in a first corner of the bottom substrate side, the corner contact extending to a substrate edge of the package substrate;

forming a first identification contact in a second corner of the package substrate and a second identification contact in a third corner of the package substrate, adjacent to the second corner;

mounting an integrated circuit device over the top substrate side;

connecting an electrical interconnect between the integrated circuit device and the top substrate side; and

forming a package encapsulation over the top substrate side, the integrated circuit device, and the electrical interconnect.

2. The system as claimed in claim 1 further comprising forming an identification contact in a second corner of the bottom substrate side, the identification contact and the corner contact having different geometric configurations.

3. The system as claimed in claim 1 further comprising forming an identification contact in a second corner of the bottom substrate side, the identification contact and the corner contact having an equivalent geometric area.

4. The system as claimed in claim 1 further comprising:

providing a board substrate having a board corner contact; and

mounting the package substrate over the board substrate with the corner contact over the board corner contact.

5. An integrated circuit package system comprising:

forming a package substrate with a top substrate side and a bottom substrate side, the bottom substrate side having a first corner and a second corner;

forming a corner contact in the first corner and an identification contact in the second corner, the corner contact and the identification contact each extending to a substrate edge of the package substrate;

mounting an integrated circuit device over the top substrate side;

connecting an electrical interconnect between the integrated circuit device and the top substrate side; and

forming a package encapsulation over the top substrate side, the integrated circuit device, and the electrical interconnect.

6. The system as claimed in claim 5 further comprising forming a corner solder ball under the corner contact.

7. The system as claimed in claim 5 further comprising:

forming a corner solder ball under the corner contact; and

mounting to a board substrate, the board substrate having a board corner contact with the corner solder ball connecting between the corner contact and the board corner contact.

8. The system as claimed in claim 5 wherein:

forming the corner contact and the identification contact includes:

forming the identification contact and the corner contact having different geometric configurations; and

further comprising:

forming a board substrate having a board corner contact; and

mounting the corner contact over the board corner contact.

9. The system as claimed in claim 5 wherein:

forming the corner contact and the identification contact includes:

forming the identification contact and the corner contact having an equivalent geometric area; and

further comprising:

forming a board substrate having a board corner contact; and

mounting the corner contact over the board corner contact.

10. An integrated circuit package system comprising:

a package substrate with a top substrate side and a bottom substrate side;

a corner contact in a first corner of the bottom substrate side, the corner contact extending to a substrate edge of the package substrate;

a first identification contact in a second corner of the package substrate and a second identification contact in a third corner of the package substrate, adjacent to the second corner;

an integrated circuit device over the top substrate side;

an electrical interconnect between the integrated circuit device and the top substrate side; and

a package encapsulation over the top substrate side, the integrated circuit device, and the electrical interconnect.

11. The system as claimed in claim 10 further comprising an identification contact in a second corner of the bottom substrate side, the identification contact and the corner contact having different geometric configurations.

12. The system as claimed in claim 10 further comprising an identification contact in a second corner of the bottom substrate side, the identification and the corner contact having an equivalent geometric area.

13. The system as claimed in claim 10 further comprising a board substrate having a board corner contact with the corner contact mounted over the board corner contact.

14. The system as claimed in claim 10 further comprising an identification contact in a second corner of the bottom substrate side, the identification contact extending to the substrate edge of the package substrate.

15. The system as claimed in claim 14 further comprising a corner solder ball between the bottom substrate side and the board substrate.

16. The system as claimed in claim 14 further comprising:

a corner solder ball formed under the corner contact; and

a board substrate, the board substrate having a board corner contact with the corner solder ball connecting between the corner contact and the board corner contact.

17. The system as claimed in claim 14 wherein:

the corner contact and the identification contact includes:

the identification contact and the corner contact having different geometric configurations; and

further comprising:

a board substrate having a board corner contact with the corner contact mounted over the board corner contact.

18. The system as claimed in claim 14 wherein:

the corner contact and the identification contact includes:

the identification contact and the corner contact having an equivalent geometric area; and

further comprising:

a board substrate having a board corner contact with the corner contact mounted over the board corner contact.

19. An integrated circuit package system comprising:

forming a package substrate with a top substrate side and a bottom substrate side;

forming a corner contact in a first corner of the bottom substrate side, the corner contact extending to a substrate edge of the package substrate;

forming an identification contact in a second corner of the bottom substrate side, the identification contact and the corner contact having different geometric configurations;

mounting an integrated circuit device over the top substrate side;

connecting an electrical interconnect between the integrated circuit device and the top substrate side; and

forming a package encapsulation over the top substrate side, the integrated circuit device, and the electrical interconnect.

20. The system as claimed in claim 19 further comprising forming a first identification contact in a second corner of the package substrate and a second identification contact in a third corner of the package substrate, adjacent to the second corner.

21. An integrated circuit package system comprising:

forming a package substrate with a top substrate side and a bottom substrate side;

forming a corner contact in a first corner of the bottom substrate side, the corner contact extending to a substrate edge of the package substrate;

forming an identification contact in a second corner of the bottom substrate side, the identification contact and the corner contact having an equivalent geometric area;

mounting an integrated circuit device over the top substrate side;

connecting an electrical interconnect between the integrated circuit device and the top substrate side; and

forming a package encapsulation over the top substrate side, the integrated circuit device, and the electrical interconnect.

22. The system as claimed in claim 21 further comprising forming a first identification contact in a second corner of the package substrate and a second identification contact in a third corner of the package substrate, adjacent to the second corner.

23. An integrated circuit package system comprising:

a package substrate with a top substrate side and a bottom substrate side;

a corner contact in a first corner of the bottom substrate side, the corner contact extending to a substrate edge of the package substrate;

an identification contact in a second corner of the bottom substrate side, the identification contact and the corner contact having different geometric configurations;

an integrated circuit device over the top substrate side;

an electrical interconnect between the integrated circuit device and the top substrate side; and

a package encapsulation over the top substrate side, the integrated circuit device, and the electrical interconnect.

24. The system as claimed in claim 23 further comprising a first identification contact in a second corner of the package substrate and a second identification contact in a third corner of the package substrate, adjacent to the second corner.

25. An integrated circuit package system comprising:

package substrate with a top substrate side and a bottom substrate side;

a corner contact in a first corner of the bottom substrate side, the corner contact extending to a substrate edge of the package substrate;

an identification contact in a second corner of the bottom substrate side, the identification and the corner contact having an equivalent geometric area;

an integrated circuit device over the top substrate side;

an electrical interconnect between the integrated circuit device and the top substrate side; and

a package encapsulation over the top substrate side, the integrated circuit device, and the electrical interconnect.

26. The system as claimed in claim 25 further comprising a first identification contact in a second corner of the package substrate and a second identification contact in a third corner of the package substrate, adjacent to the second corner.