IP Library Assignment 067535/0364
Patent Assignment
Reel/Frame 067535/0364

Corrective Assignment to Correct the Conveying Party Data from Stats Chippac Pte. Lte. to Stats Chippac Ltd. and Correct the Name of Receiving Party Data from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. Previously Recorded at Reel: 64838 Frame: 948. Assignor(S) Hereby Confirms the Change of Name.

Recorded: 2024-05-29 Pages: 11
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, SINGAPORE
Covered Properties (6)
Integrated Circuit Package-in-Package System with Carrier Interposer
Patent: 7,659,609 →
Application: 11/849,127 →
Publication: US 2009/0057862
Integrated Circuit Package System with Package Substrate Having Corner Contacts
Patent: 7,646,105 →
Application: 11/941,409 →
Publication: US 2009/0127719
Integrated Circuit Package System with Isolated Leads
Patent: 7,732,901 →
Application: 12/050,428 →
Publication: US 2009/0236704
Integrated Circuit Package System with Stacking Module
Patent: 7,741,154 →
Application: 12/055,962 →
Publication: US 2009/0243071
Stacked Integrated Circuit Package System
Patent: 7,750,454 →
Application: 12/056,418 →
Publication: US 2009/0243073
Semiconductor Device and Method of Forming Recessed Conductive Vias in Saw Streets
Patent: 7,704,796 →
Application: 12/133,177 →
Publication: US 2009/0302478
Related Assignments (11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 31, 2007
From: HA, JONG-WOO; HONG, BUMJOON; LEE, SANG-HO; PARK, SOO-SAN
To: STATS CHIPPAC LTD.
Reel/Frame 019775/0710 →
Assignment of Assignor's Interest Nov 16, 2007
From: CHOW, SENG GUAN; JANG, TAE HOAN
To: STATS CHIPPAC LTD.
Reel/Frame 020128/0576 →
Assignment of Assignor's Interest Mar 27, 2008
From: CARSON, FLYNN; HA, JONG-WOO; HONG, BUMJOON; LEE, SEONGMIN
To: STATS CHIPPAC LTD.
Reel/Frame 020711/0487 →
Assignment of Assignor's Interest Mar 28, 2008
From: CAMACHO, ZIGMUND RAMIREZ; BATHAN, HENRY DESCALZO; ADVINCULA, ABELARDO JR. HADAP; TAY, LIONEL CHIEN HUI
To: STATS CHIPPAC LTD.
Reel/Frame 020718/0891 →
Assignment of Assignor's Interest Apr 14, 2008
From: HA, JONG-WOO; CARSON, FLYNN; HONG, BUMJOON; LEE, SEONGMIN
To: STATS CHIPPAC LTD.
Reel/Frame 020801/0508 →
Assignment of Assignor's Interest Jun 4, 2008
From: PAGAILA, REZA A.; DO, BYUNG TAI; KUAN, HEAP HOE
To: STATS CHIPPAC, LTD.
Reel/Frame 021046/0191 →
Security Interest Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0328 →
Release of Security Interest Jun 15, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052935/0327 →
Correct Error in Assignment Name from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. (Reel: 038378 Frame: 0328 Aug 30, 2023
From: STATS CHIPPAC PTE. LTE.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 064838/0948 →
Assignment of Assignor's Interest Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →