Stacked integrated circuit package system
View Patent ↗A stacked integrated circuit package system includes: providing a base integrated circuit package having a base encapsulation with a cavity therein and a base interposer exposed by the cavity; mounting an intermediate integrated circuit package over the base interposer, and mounting a top integrated circuit package over the intermediate integrated circuit package.
1. A method for manufacturing a stacked integrated package comprising:
providing a base integrated circuit package having a base encapsulation with a cavity therein and a base interposer exposed by the cavity;
mounting an intermediate integrated circuit package over the base interposer;
mounting a top integrated circuit package over the intermediate integrated circuit package; and
forming a base intra-stack interconnect between the base integrated circuit package and the intermediate integrated circuit package.
2. A method for manufacturing a stacked integrated package as claimed in claim 1 further comprising forming an external interconnect below the base interposer.
3. A method for manufacturing a stacked integrated package as claimed in claim 1 wherein forming the base intra-stack interconnect between the base integrated circuit package and the intermediate integrated circuit package includes forming the base intra-stack interconnect over the base interposer and in the cavity.
4. A method for manufacturing a stacked integrated package as claimed in claim 1 wherein forming the base intra-stack interconnect between the base integrated circuit package and the intermediate integrated circuit package includes coupling the base interposer to the intermediate integrated circuit package.
5. A method for manufacturing a stacked integrated package as claimed in claim 1 wherein:
providing a base integrated circuit package having a base encapsulation with a cavity therein and a base interposer exposed by the cavity includes providing a base package carrier; and
forming a base intra-stack interconnect between the base integrated circuit package and the intermediate integrated circuit package includes coupling the base package carrier to the intermediate integrated circuit package.