Integrated circuit package system with shielding
View Patent ↗An integrated circuit package system comprising: providing an elevated tiebar; forming a die paddle connected to the elevated tiebar; attaching an integrated circuit die over the die paddle adjacent the elevated tiebar; attaching a shield over the elevated tiebar and the integrated circuit die; and forming an encapsulant over a portion of the elevated tiebar, the die paddle, and the integrated circuit die.
1. An integrated circuit package system comprising:
providing an elevated tiebar;
forming a die paddle connected to the elevated tiebar;
attaching an integrated circuit die over the die paddle adjacent the elevated tiebar;
attaching a shield over the elevated tiebar and the integrated circuit die;
forming a shield opening for a portion of the elevated tiebar;
applying a shield mount layer over the integrated circuit die and the shield; and
forming an encapsulant over a portion of the elevated tiebar, the die paddle, and the integrated circuit die.
2. The system as claimed in claim 1 wherein attaching the shield includes forming a tiebar attach material in a shield opening having predetermined dimensions for an interference fit with a portion of the elevated tiebar.
3. The system as claimed in claim 1 wherein attaching the shield includes forming the shield having a shield opening with predetermined dimensions for an interference fit over a portion of the elevated tiebar.
4. The system as claimed in claim 1 wherein attaching the shield includes forming the shield having a shield cavity with predetermined dimensions for an interference fit over a portion of the elevated tiebar.
5. An integrated circuit package system comprising:
providing an elevated tiebar;
forming a die paddle connected to the elevated tiebar;
forming package connectors adjacent the die paddle and the elevated tiebar;
attaching an integrated circuit die over the die paddle adjacent the elevated tiebar;
attaching interconnects to the integrated circuit die, the package connectors, or the die paddle;
applying a tiebar attach layer to the elevated tiebar;
attaching a shield to the tiebar attach layer over the elevated tiebar and the integrated circuit die; and
forming an encapsulant over a portion of the elevated tiebar, the die paddle, and the integrated circuit die.
6. The system as claimed in claim 5 wherein attaching the shield includes applying a shield mount layer to the integrated circuit die and the shield.
7. The system as claimed in claim 5 further comprising applying a singulation process wherein the encapsulant includes a package side substantially orthogonal.
8. The system as claimed in claim 5 further comprising applying a punch process wherein a shield connector bar is near a package side.
9. An integrated circuit package system comprising:
an elevated tiebar;
a die paddle connected to the elevated tiebar;
an integrated circuit die over the die paddle adjacent the elevated tiebar;
a shield opening for a portion of the elevated tiebar;
a shield mount layer over the integrated circuit die and the shield;
a shield over the elevated tiebar and the integrated circuit die; and
an encapsulant over a portion of the elevated tiebar, the die paddle, and the integrated circuit die.
10. The system as claimed in claim 9 further comprising a tiebar attach material in a shield opening having predetermined dimensions for an interference fit with a portion of the elevated tiebar.
11. The system as claimed in claim 9 wherein the shield includes a shield opening with predetermined dimensions for an interference fit over a portion of the elevated tiebar.
12. The system as claimed in claim 9 wherein the shield includes a shield cavity with predetermined dimensions for an interference fit over a portion of the elevated tiebar.
13. The system as claimed in claim 9 wherein:
the shield is over the elevated tiebar and the integrated circuit die;
the encapsulant is over the portion of the elevated tiebar, the die paddle, and the integrated circuit die;
further comprising:
package connectors are adjacent the die paddle and the elevated tiebar; and
interconnects are attached to the integrated circuit die, the package connectors, or the die paddle.
14. The system as claimed in claim 13 further comprising a tiebar attach layer applied to the elevated tiebar and the shield.
15. The system as claimed in claim 13 further comprising a shield mount layer applied to the integrated circuit die and the shield.
16. The system as claimed in claim 13 wherein the encapsulant includes a package side substantially orthogonal from a singulation process.
17. The system as claimed in claim 13 further comprising a shield connector bar near a package side for a punch process.