Patent Assignment
Reel/Frame 067534/0680
Corrective Assignment to Correct the Conveying Party Data from Stats Chippac Pte. Lte. to Stats Chippac Ltd. and Correct the Name of Receiving Party Data from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. Previously Recorded at Reel: 64838 Frame: 948. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2024-05-29
Pages: 11
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, SINGAPORE
Covered Properties
(7)
Extended Redistribution Layers Bumped Wafer
Integrated Circuit Package System with Mold Lock Subassembly
Semiconductor Device and Method for Forming Passive Circuit Elements with Through Silicon Vias to Backside Interconnect Structures
Integrated Circuit Package System with Package Integration
Integrated Circuit Package System with Shielding
Integrated Circuit Package-on-Package System with Central Bond Wires
Semiconductor Device and Method of Forming Embedded Passive Circuit Elements Interconnected to Through Hole Vias
Related Assignments
(14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 4, 2007
From: DO, BYUNG TAI; KUAN, HEAP HOE
To: STATS CHIPPAC, LTD.
Reel/Frame 019252/0049 →
Assignment of Assignor's Interest
Sep 30, 2007
From: YOON, IN SANG; SONG, SUNGMIN
To: STATS CHIPPAC LTD.
Reel/Frame 019900/0019 →
Assignment of Assignor's Interest
Nov 29, 2007
From: LIN, YAOJIAN; CAO, HAIJING; CHEN, KANG; ZHANG, QING
To: STATS CHIPPAC, LTD.
Reel/Frame 020178/0312 →
Assignment of Assignor's Interest
Dec 18, 2007
From: KUAN, HEAP HOE; CHOW, SENG GUAN; CHUA, LINDA PEI EE; MERILO, DIOSCORO A.
To: STATS CHIPPAC LTD.
Reel/Frame 020264/0042 →
Assignment of Assignor's Interest
Dec 27, 2007
From: CAMACHO, ZIGMUND RAMIREZ; TAY, LIONEL CHIEN HUI; BATHAN, HENRY DESCALZO; BADAKERE GOVINDAIAH, GURUPRASAD
To: STATS CHIPPAC LTD.
Reel/Frame 020295/0650 →
Assignment of Assignor's Interest
Apr 12, 2008
From: YANG, DEOKKYUNG; CHUNG, JAE HAN; KIM, HYUN JOUNG
To: STATS CHIPPAC LTD.
Reel/Frame 020793/0032 →
Corrective Assignment to Correct the Date That the Third Assignor (Hyun Joung Kim) Executed the Assignment Previously Recorded on Reel 020793 Frame 0032. Assignor(S) Hereby Confirms the Date of Assignment Execution by Third Assignor (Hyun Joung Kim).
Apr 15, 2008
From: YANG, DEOKKYUNG; CHUNG, JAE HAN; KIM, HYUN JOUNG
To: STATS CHIPPAC LTD.
Reel/Frame 020915/0846 →
Corrective Assignment to Correct the Date That the Third Assignor (Hyun Joung Kim) Executed the Assignment Previously Recorded on Reel 020793 Frame 0032. Assignor(S) Hereby Confirms the Date of Assignment Execution by the Third Assignor (Hyun Joung Kim)
Apr 15, 2008
From: YANG, DEOKKYUNG; CHUNG, JAE HAN; KIM, HYUN JOUNG
To: STATS CHIPPAC LTD.
Reel/Frame 021017/0937 →
Assignment of Assignor's Interest
May 27, 2008
From: PAGAILA, REZA A.; DO, BYUNG TAI; LIN, YAOJIAN
To: STATS CHIPPAC, LTD.
Reel/Frame 021039/0485 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0328 →
Release of Security Interest
Jun 15, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052935/0327 →
Correct Error in Assignment Name from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. (Reel: 038378 Frame: 0328
Aug 30, 2023
From: STATS CHIPPAC PTE. LTE.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 064838/0948 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →