Integrated circuit package-on-package system with central bond wires
An integrated circuit package-on-package system includes: providing a base substrate having a central opening; attaching a bottom die below the base substrate partially covering the central opening, the bottom die connected through the central opening to a top surface of the base substrate; attaching a top die above the base substrate partially covering the central opening; attaching external conductive interconnections to a base bottom surface of the base substrate; and molding an encapsulant leaving the external conductive interconnections partially exposed.
1. An integrated circuit package-on-package system comprising:
providing a base substrate having a central opening;
attaching a bottom die below the base substrate partially covering the central opening, the bottom die connected through the central opening to a top surface of the base substrate;
attaching a top die above the base substrate partially covering the central opening with a first wire-in-film adhesive;
attaching external conductive interconnections to a base bottom surface of the base substrate; and
molding an encapsulant leaving the external conductive interconnections partially exposed.
2. The system as claimed in claim 1 wherein attaching the bottom die to the base substrate comprises attaching the bottom die to the base substrate using a first attachment material.
3. The system as claimed in claim 1 wherein the base substrate provides a central opening having a trench therein.
4. The system as claimed in claim 1 wherein molding the encapsulant comprises:
forming the encapsulant having channels; and
placing the external conductive interconnections into the channels.
5. An integrated circuit package-on-package system comprising:
providing a base substrate having a central opening;
attaching a bottom die below the base substrate using a first attachment material;
connecting the bottom die through the central opening to a top surface of the base substrate using bottom die electrical interconnections;
attaching a top die above the base substrate using a first wire-in-film adhesive;
mounting external conductive interconnections on a base bottom surface of the base substrate;
connecting the top die to the base substrate using top die electrical interconnections; and
molding an encapsulant over the bottom die and the top die.
6. The system as claimed in claim 5 wherein connecting the bottom die to the base substrate comprises:
connecting the bottom die to the base substrate using bottom die electrical interconnections; and
maintaining a clearance between the bottom die electrical interconnections and a top die non-active side of the top die.
7. The system as claimed in claim 5 wherein attaching the top die to the base substrate comprises attaching the top die using the first wire-in-film adhesive having the bottom die electrical interconnections partially embedded in the first wire-in-film adhesive.
8. The system as claimed in claim 5 wherein attaching the top die to the base substrate includes attaching the top die to the base substrate using a second wire-in-film adhesive with the bottom die electrical interconnections fully embedded in the second wire-in-film adhesive.
9. The system as claimed in claim 5 wherein molding the encapsulant includes forming the encapsulant to about a base top surface surrounding the top die, the top die electrical interconnections, leaving the bottom die and the external conductive interconnections fully exposed.
10. An integrated circuit package-on-package system comprising:
a base substrate with a central opening;
a bottom die attached below the base substrate partially covers the central opening, the bottom die connected through the central opening to a top surface of the base substrate;
a top die above the base substrate partially covers the central opening;
a first wire-in-film adhesive attaches the top die to the base substrate;
external conductive interconnections attached to a base bottom surface of the base substrate; and
an encapsulant molded around the top die and the bottom die leaves the external conductive interconnections partially exposed.
11. The system as claimed in claim 10 wherein the bottom die is attached to the base substrate.
12. The system as claimed in claim 10 wherein the base substrate provides a central opening having a trench therein entered on the central opening.
13. The system as claimed in claim 10 wherein:
the encapsulant includes protrusions and channels; and
the external conductive interconnections are in the channels.
14. The system as claimed in claim 10 wherein:
the bottom die is attached to the base substrate using a first attachment material and electrically connected to the top surface of the base substrate using bottom die electrical interconnections; and
the top die is attached to the base substrate using a first wire-in-film adhesive and electrically connected to the base top surface of the base substrate using top die electrical interconnections.
15. The system as claimed in claim 14 wherein the bottom die electrical interconnections maintain a clearance with a top die non-active side of the top die.
16. The system as claimed in claim 14 wherein the top die attaches to the base substrate using the first wire-in-film adhesive with the bottom die electrical interconnections partially embedded in the first wire-in-film adhesive.
17. The system as claimed in claim 14 wherein the top die attaches to the base substrate using a second wire-in-film adhesive with the bottom die electrical interconnections fully embedded in the second wire-in-film adhesive.
18. The system as claimed in claim 14 wherein the encapsulant leaves the external conductive interconnections partially exposed.
19. The system as claimed in claim 10 wherein the top die is attached to the base substrate with a first wire-in-film adhesive.
20. An integrated circuit package-on-package system comprising:
providing a base substrate having a central opening;
attaching a bottom die below the base substrate partially covering the central opening, the bottom die connected through the central opening to a top surface of the base substrate;
attaching a top die above the base substrate partially covering the central opening;
attaching external conductive interconnections to a base bottom surface of the base substrate; and
molding an encapsulant around the top die and external conductive interconnections by flowing through the central opening but leaving the external conductive interconnections partially exposed.
21. The system as claimed in claim 20 wherein attaching the top die to the base substrate includes attaching the top die to the base substrate using a first wire-in-film adhesive.
22. An integrated circuit package-on-package system comprising:
a base substrate with a central opening;
a bottom die attached below the base substrate partially covers the central opening, the bottom die connected through the central opening to a top surface of the base substrate;
a top die above the base substrate partially covers the central opening;
external conductive interconnections attached to a base bottom surface of the base substrate; and
an encapsulant molded around the top die and the bottom die and through the central opening and leaves the external conductive interconnections partially exposed.