Patent Assignment
Reel/Frame 020178/0312
Assignment of Assignor's Interest
Recorded: 2007-11-29
Pages: 7
Assignors
LIN, YAOJIAN
Executed: 2007-11-27
CAO, HAIJING
Executed: 2007-11-27
CHEN, KANG
Executed: 2007-11-27
ZHANG, QING
Executed: 2007-11-27
FANG, JIANMIN
Executed: 2007-11-27
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 6, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method for Forming Passive Circuit Elements with Through Silicon Vias to Backside Interconnect Structures
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0328 →
Release of Security Interest
Jun 15, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052935/0327 →
Correct Error in Assignment Name from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. (Reel: 038378 Frame: 0328
Aug 30, 2023
From: STATS CHIPPAC PTE. LTE.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 064838/0948 →
Corrective Assignment to Correct the Conveying Party Data from Stats Chippac Pte. Lte. to Stats Chippac Ltd. and Correct the Name of Receiving Party Data from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. Previously Recorded at Reel: 64838 Frame: 948. Assignor(S) Hereby Confirms the Assignment.
May 29, 2024
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 067534/0680 →