Integrated circuit package system with external interconnects within a die platform
The present invention provides an integrated circuit package system comprising: attaching a die platform to an integrated circuit die; mounting the integrated circuit die over an external interconnect with a bottom side of the external interconnect partially within the die platform; connecting the integrated circuit die and the external interconnect; and forming an encapsulation over the integrated circuit die with the external interconnect partially exposed.
1. A method of manufacture of an integrated circuit package system comprising:
attaching a die platform to an integrated circuit die;
mounting the die platform through an external interconnect with a bottom side of the external interconnect partially within the die platform;
connecting the integrated circuit die and the external interconnect; and
forming an encapsulation over the integrated circuit die with the external interconnect partially exposed.
2. The method as claimed in claim 1 wherein forming the encapsulation over the integrated circuit die includes exposing the die platform.
3. The method as claimed in claim 1 wherein mounting the integrated circuit die includes adhering a tip of the external interconnect to the die platform.
4. The method as claimed in claim 1 wherein forming the encapsulation over the integrated circuit die includes exposing the die platform coplanar with the external interconnect.
5. The method as claimed in claim 1 further comprising forming a barrier layer between the integrated circuit die and the die platform.
6. A method of manufacture of an integrated circuit package system comprising:
attaching a die platform comprising a first non-conductive material to an integrated circuit die;
mounting the die platform through an external interconnect having a body and a tip, with a bottom side of the tip partially within the die platform;
connecting an internal interconnect between the integrated circuit die and the external interconnect; and
forming an encapsulation over the integrated circuit die with the external interconnect partially exposed.
7. The method as claimed in claim 6 wherein forming the encapsulation includes forming the encapsulation over the integrated circuit die with a bottom platform side of the die platform exposed.
8. The method as claimed in claim 6 wherein connecting the internal interconnect includes:
removing a lead frame tape from the external interconnects; and
mounting the integrated circuit with the die platform over a non-biased heater block.
9. The method as claimed in claim 6 wherein forming the encapsulation includes forming the encapsulation over the integrated circuit die partially exposing the body of the external interconnect.
10. The method as claimed in claim 6 wherein attaching the die platform includes attaching the die platform to a non-active side of the integrated circuit die facing the die platform.
11. An integrated circuit package system comprising:
a die platform attached with an integrated circuit die;
a lead frame including an external interconnect mounted to the integrated circuit die, with a bottom side of the external interconnect partially within the die platform;
an internal interconnect connected between the integrated circuit die and the external interconnect; and
an encapsulation formed over the integrated circuit die partially exposing the external interconnect.
12. The system as claimed in claim 11 wherein the encapsulation exposes the die platform.
13. The system as claimed in claim 11 wherein a tip of the external interconnect is adhered to the die platform.
14. The system as claimed in claim 11 wherein the encapsulation includes the die platform exposed coplanar with the external interconnect.
15. The system as claimed in claim 11 further comprising a barrier layer formed between the integrated circuit die and the die platform.
16. The system as claimed in claim 11 wherein:
the die platform comprises a first non-conductive material layer; and
the external interconnect includes a body and a tip, the bottom side of the tip partially within the die platform.
17. The system as claimed in claim 16 wherein the encapsulation includes exposing a bottom platform side of the die platform.
18. The system as claimed in claim 16 wherein a top side of the tip faces the integrated circuit die.
19. The system as claimed in claim 16 wherein the encapsulation partially exposes the body.
20. The system as claimed in claim 16 wherein a non-active side of the integrated circuit die faces the die platform.