Integrated circuit package system with interposer
View Patent ↗An integrated circuit package system includes: providing a mountable integrated circuit system having an encapsulation with a cavity therein and a first interposer exposed by the cavity; mounting a second interposer over the first interposer for only stacking a discrete device thereover, and with the second interposer over the encapsulation and the cavity; and mounting an electrical component over the second interposer.
1. A method of manufacture of an integrated circuit package system comprising:
providing a mountable integrated circuit system having an encapsulation with a cavity, a passive device, and a first interposer therein, the first interposer exposed by the cavity, the cavity having a cavity width;
mounting a second interposer over the first interposer and the encapsulation, the second interposer having a side facing the cavity and an opposite side having an electrical attachment area directly over the cavity, the second interposer having an interposer width greater than the cavity width;
mounting an electrical component over the second interposer via electrical connectors, the electrical component completely exposed from the encapsulation, the electrical component having an electrical component width greater than the cavity width,
wherein the electrical component and the electrical connectors are capable of being readily detachable from the second interposer for functional testing; and
mounting a further passive device directly on the second interposer.
2. The method as claimed in claim 1 further comprising attaching the second interposer over the encapsulation and the cavity with an adhesive.
3. The method as claimed in claim 1 wherein mounting the second interposer includes mounting the second interposer having a hole over the cavity.
4. The method as claimed in claim 1 further comprising applying an underfill through a hole of the second interposer.
5. The method as claimed in claim 1 wherein mounting the second interposer over the first interposer includes connecting the second interposer with the first interposer.
6. A method of manufacture of an integrated circuit package system comprising:
providing a mountable integrated circuit system having an encapsulation with a cavity, a passive device, and a first interposer therein, the first interposer exposed by the cavity, the cavity having a cavity width;
mounting a second interposer over the first interposer and the encapsulation, the second interposer having a side facing the cavity and an opposite side having an electrical attachment area directly over the cavity, the second interposer having an interposer width greater than the cavity width;
connecting the second interposer and the first interposer;
mounting an electrical component over the second interposer via electrical connectors, the electrical component completely exposed from the encapsulation, the electrical component having an electrical component width greater than the cavity width,
wherein the electrical component and the electrical connectors are capable of being readily detachable from the second interposer for functional testing; and
mounting a further passive device directly on the second interposer.
7. The method as claimed in claim 6 wherein mounting the second interposer includes mounting the second interposer having a hole over a sidewall of the cavity.
8. The method as claimed in claim 6 further comprising forming an underfill between the first interposer and the second interposer.
9. The method as claimed in claim 6 further comprising forming an underfill between the electrical component and the second interposer.
10. The method as claimed in claim 6 wherein mounting the second interposer includes mounting the second interposer partially over the encapsulation.