Stacked integrated circuit package system and method of manufacture therefor

1. A method of manufacture of an integrated circuit package system comprising:

providing a base substrate;

attaching a base integrated circuit over the base substrate;

attaching a core substrate over the base integrated circuit, the core substrate and a core substrate connection having sides facing the base substrate partially exposed from an attachment layer on the core substrate and the base integrated circuit;

attaching a substrate electrical connector between the core substrate and the base substrate; and

applying an encapsulant directly on a perimeter portion of a side of the core substrate opposite the base substrate and having a center portion of the side of the core substrate substantially exposed over the base integrated circuit.

2. The method as claimed in claim 1 further comprising attaching a top integrated circuit on a mounting surface of the core substrate.

3. The method as claimed in claim 1 wherein attaching the base integrated circuit comprises attaching a solder ball or a bond wire between the base integrated circuit and the base substrate.

4. The method as claimed in claim 1 wherein attaching the base integrated circuit comprises attaching another integrated circuit adjacent the base integrated circuit.

5. The method as claimed in claim 1 wherein attaching the base integrated circuit comprises attaching a base electrical connector over the base integrated circuit and part of the base substrate.

6. A method of manufacture of an integrated circuit package system comprising:

forming a base substrate having a base connection pad;

connecting a base integrated circuit with a base electrical connector over the base substrate;

attaching a core substrate on an attachment layer on the base integrated circuit, the core substrate and a core substrate connection having sides facing the base substrate partially exposed from the attachment layer;

connecting a substrate electrical connector between the core substrate and the base substrate;

forming an encapsulant over a perimeter portion at an edge of the mounting surface of the core substrate having a core connection pad exposed in a center portion of the mounting surface over the base integrated circuit; and

connecting a top electrical connector between a top integrated circuit and the core connection pad.

7. The method as claimed in claim 6 wherein connecting the base integrated circuit comprises attaching a bond wire between another integrated circuit on the base integrated circuit and the base substrate.

8. The method as claimed in claim 6 wherein connecting the base integrated circuit comprises attaching a flipchip on the base integrated circuit.

9. The method as claimed in claim 6 wherein forming the encapsulant comprises forming a mounting surface on the core substrate for a top integrated circuit.

10. The method as claimed in claim 6 wherein attaching the core substrate comprises providing the core substrate with lower routing density than routing density of the base substrate.

11. An integrated circuit package system comprising:

a base substrate;

a base integrated circuit over the base substrate;

a core substrate having a core substrate connection over the base integrated circuit;

an attachment layer on the core substrate and the base integrated circuit, the core substrate and the core substrate connection having sides facing the base substrate partially exposed from the attachment layer;

a substrate electrical connector between the core substrate and the base substrate; and

an encapsulant directly on a perimeter portion of a side of the core substrate opposite the base substrate and having a portion of the side of the core substrate substantially exposed over the base integrated circuit.

12. The system as claimed in claim 11 further comprising a top integrated circuit on a mounting surface of the core substrate.

13. The system as claimed in claim 11 further comprising a solder ball or a bond wire between the base integrated circuit and the base substrate.

14. The system as claimed in claim 11 further comprising another integrated circuit adjacent the base integrated circuit.

15. The system as claimed in claim 11 further comprising a base electrical connector over the base integrated circuit and part of the base substrate.

16. The system as claimed in claim 11 wherein:

the base substrate having a base connection pad;

the base integrated circuit with a base electrical connector over the base substrate;

the core substrate on an attachment layer over the base integrated circuit;

the substrate electrical connector between the core substrate and the base substrate;

the encapsulant over the core substrate having a core connection pad exposed over the base integrated circuit; and

further comprising:

a top electrical connector between a top integrated circuit and the core connection pad.

17. The system as claimed in claim 16 further comprising a bond wire between another integrated circuit on the base integrated circuit and the base substrate.

18. The system as claimed in claim 16 further comprising a flipchip on the base integrated circuit.

19. The system as claimed in claim 16 wherein the encapsulant comprises a mounting surface on the core substrate for a top integrated circuit.

20. The system as claimed in claim 16 wherein the core substrate comprises lower routing density than routing density of the base substrate.