Ball grid array package system
A ball grid array package system comprising: forming a package base including: fabricating a heat spreader having an access port, attaching an integrated circuit die to the heat spreader, mounting a substrate around the integrated circuit die, and coupling an electrical interconnect between the integrated circuit die and the substrate; and coupling a second integrated circuit package to the substrate through the access port.
1. A method of making a ball grid array package system comprising:
forming a package base including:
fabricating a heat spreader having an access port including an inner access port, an outer access port, a component access port, a package access port, or a combination thereof,
attaching an integrated circuit die to the heat spreader,
mounting a substrate around the integrated circuit die using an insulating adhesive between the substrate and the heat spreader, and
coupling an electrical interconnect between the integrated circuit die and the substrate; and
coupling a second integrated circuit package to the substrate through the access port.
2. The method as claimed in claim 1 further comprising forming a package stack on the package base.
3. The method as claimed in claim 1 further comprising providing a component access port for coupling a discrete component to the substrate.
4. The method as claimed in claim 1 further comprising:
applying a conductive adhesive on the package base;
mounting a second integrated circuit die on the conductive adhesive; and
coupling a chip interconnect between the second integrated circuit die and the substrate of the package base through the access port.
5. The method as claimed in claim 1 further comprising providing a standoff leg, on the heat spreader, for limiting a system interconnect collapse.
6. A method of making a ball grid array package system comprising:
forming a package base including:
fabricating a heat spreader having an access port including an inner access port, an outer access port, a component access port, a package access port, or a combination thereof,
attaching an integrated circuit die to the heat spreader wherein attaching the integrated circuit die including mounting the integrated circuit die under the heat spreader,
mounting a substrate around the integrated circuit die including applying an insulating adhesive between the substrate and the heat spreader, and
coupling an electrical interconnect between the integrated circuit die and the substrate including forming a molding cap on the integrated circuit die, the electrical interconnect, and the substrate; and
coupling a second integrated circuit package to the substrate through the access port including coupling a ball grid array package or a quad flat pack no-lead package.
7. The method as claimed in claim 6 further comprising forming a package stack on the package base including mounting a second package base, a third package base, the ball grid array package, the quad flat pack no-lead package, a discrete component, an external heat sink, or a combination thereof.
8. The method as claimed in claim 6 wherein providing the component access port for coupling a discrete component to the substrate including coupling a resistor, a capacitor, an inductor, a diode, or a voltage regulator through the component access port.
9. The method as claimed in claim 6 further comprising:
applying a conductive adhesive on the package base including applying a solder paste on the heat spreader;
mounting a second integrated circuit die on the conductive adhesive including mounting a wire bond die, or a flip chip die; and
coupling a chip interconnect between the second integrated circuit die and the substrate of the package base including coupling a bond wire, a solder ball, or a combination thereof through the access port.
10. The method as claimed in claim 6 further comprising providing a standoff leg, on the heat spreader, for limiting a system interconnect collapse including applying a conductive coupler between the standoff leg of the package base and the standoff leg of the second package base.
11. A ball grid array package system comprising:
a package base including:
a heat spreader with an access port includes an inner access port, an outer access port, a component access port, a package access port, or a combination thereof in the heat spreader,
an integrated circuit die attached to the heat spreader,
a substrate mounted around the integrated circuit die,
an insulating adhesive between the substrate and the spreader,
an electrical interconnect between the integrated circuit die and the substrate; and
a second integrated circuit package coupled to the substrate through the access port.
12. The system as claimed in claim 11 further comprising a package stack formed on the package base.
13. The system as claimed in claim 11 further comprising a component access port for coupling a discrete component to the substrate.
14. The system as claimed in claim 11 further comprising:
a conductive adhesive on the package base;
a second integrated circuit die on the conductive adhesive; and
a chip interconnect coupled, through the access port, between the second integrated circuit die and the substrate of the package base.
15. The system as claimed in claim 11 further comprising a standoff leg, on the heat spreader, for limiting a system interconnect collapse.
16. The system as claimed in claim 11 further comprising:
an insulating adhesive between the substrate and the heat spreader;
a molding cap on the integrated circuit die, the electrical interconnect, and the substrate; and
a ball grid array package or a quad flat pack no-lead package coupled through the access port.
17. The system as claimed in claim 16 further comprising a package stack formed on the package base includes a second package base, a third package base, the ball grid array package, the quad flat pack no-lead package, a discrete component, an external heat sink, or a combination thereof mounted over the package base.
18. The system as claimed in claim 16 wherein the component access port with a discrete component coupled to the substrate includes a resistor, a capacitor, an inductor, a diode, or a voltage regulator coupled through the component access port.
19. The system as claimed in claim 16 further comprising:
a conductive adhesive on the package base includes a solder paste on the heat spreader;
a second integrated circuit die on the conductive adhesive includes a wire bond die, or a flip chip die mounted thereon; and
a chip interconnect coupled, through the access port, between the second integrated circuit die and the substrate of the package base includes a bond wire, a solder ball, or a combination thereof coupled through the access port.
20. The system as claimed in claim 16 further comprising a standoff leg, on the heat spreader, for limiting a system interconnect collapse includes a conductive coupler between the standoff leg of the package base and the standoff leg of the second package base.