Method and apparatus for a package having multiple stacked die
View Patent ↗A method of manufacturing a semiconductor package involves providing a substrate having a window. The substrate may include a leadframe having half-etched leads. First and second semiconductor devices are mounted to a top surface of the substrate on either side of the window using an adhesive. A third semiconductor device is mounted to the first and second semiconductor devices using an adhesive. The third semiconductor device is disposed over the window of the substrate. A wirebond or other electrical interconnect is formed between the third semiconductor device and a contact pad formed over a bottom surface of the substrate opposite the top surface of the substrate. The wirebond or other electrical interconnect passes through the window of the substrate. An encapsulant is deposited over the first, second, and third semiconductor devices.
1. A method of making a semiconductor package, comprising:
providing a substrate including a window;
disposing first and second semiconductor devices on a first surface of the substrate on either side of the window using an adhesive;
disposing a third semiconductor device on the first and second semiconductor devices using an adhesive, the third semiconductor device being disposed over the window of the substrate;
forming a wirebond between the third semiconductor device and a contact pad formed over a second surface of the substrate opposite the first surface of the substrate, the wirebond passing through the window of the substrate; and
depositing an encapsulant over the first, second, and third semiconductor devices.
2. The method of claim 1 , wherein the encapsulant includes a coefficient of thermal expansion (CTE) substantially equal to a CTE of the first, second, or third semiconductor device.
3. The method of claim 1 , further including forming the wirebond between the third semiconductor device and the contact pad by supporting the semiconductor package in a boat.
4. The method of claim 1 , further including depositing the encapsulant over the first, second, and third semiconductor devices in a two-step molding process.
5. The method of claim 1 , further including disposing a heat spreader over the semiconductor package.
6. The method of claim 1 , further including depositing an interposer or semiconductor component over the first, second, or third semiconductor device, the interposer or semiconductor component including a plurality of contact pads formed over a first surface of the interposer or semiconductor component for connection of additional system components.
7. The method of claim 1 , further including providing the substrate as a leadframe comprising half-etched leads.
8. A method of making a semiconductor package, comprising:
providing a substrate including a window;
stacking a plurality of semiconductor devices over a first surface of the substrate proximate to the window; and
forming an electrical interconnect between one of the plurality of semiconductor devices and a contact pad formed over a second surface of the substrate opposite the first surface of the substrate, the electrical interconnect passing through the window of the substrate.
9. The method of claim 8 , wherein stacking the plurality of semiconductor devices over the substrate includes:
disposing first and second semiconductor devices on the substrate using an adhesive; and
disposing a third semiconductor device on the first and second semiconductor devices, the third semiconductor device being disposed over the window.
10. The method of claim 8 , further including depositing an encapsulant over the plurality of semiconductor devices, the encapsulant including a coefficient of thermal expansion (CTE) substantially equal to a CTE of one of the plurality of semiconductor devices.
11. The method of claim 10 , further including depositing the encapsulant over the plurality of semiconductor devices in a two-step molding process.
12. The method of claim 8 , further including disposing a heat spreader over the semiconductor package.
13. The method of claim 8 , further including disposing an interposer or semiconductor component over the plurality of semiconductor devices, the interposer or semiconductor component including a plurality of contact pads formed over a first surface of the interposer or semiconductor component for connection of additional system components.
14. A method of making a semiconductor package, comprising:
providing a substrate including a window, wherein the substrate includes a leadframe, the leadframe comprising half-etched leads;
stacking a plurality of semiconductor devices over a first surface of the substrate proximate to the window; and
forming an electrical interconnect between one of the plurality of semiconductor devices and a contact pad formed over a second surface of the substrate opposite the first surface of the substrate, the electrical interconnect passing through the window of the substrate.
15. The method of claim 14 , wherein stacking the plurality of semiconductor devices over the substrate includes:
disposing first and second semiconductor devices on the substrate using an adhesive; and
disposing a third semiconductor device on the first and second semiconductor devices, the third semiconductor device being disposed over the window.
16. The method of claim 14 , further including depositing an encapsulant over the plurality of semiconductor devices, the encapsulant including a coefficient of thermal expansion (CTE) substantially equal to a CTE of one of the plurality of semiconductor devices.
17. The method of claim 14 , further including depositing an encapsulant over the plurality of semiconductor devices in a two-step molding process.
18. The method of claim 14 , further including disposing a heat spreader over the semiconductor package.
19. The method of claim 14 , further including disposing an interposer or semiconductor component over the plurality of semiconductor devices, the interposer or semiconductor component including a plurality of contact pads formed over a first surface of the interposer or semiconductor component for connection of additional system components.
20. A method of making a semiconductor package, comprising:
providing a substrate including a window;
disposing a plurality of semiconductor devices over a first surface of the substrate proximate to the window of the substrate;
forming an electrical interconnect between one of the plurality of semiconductor devices and a contact pad formed over a surface of the substrate; and
depositing an encapsulant over the plurality of semiconductor devices using a two-step molding process.
21. The method of claim 20 , wherein disposing the plurality of semiconductor devices over the substrate includes:
disposing first and second semiconductor devices on the first surface of the substrate using an adhesive; and
disposing a third semiconductor device to the first and second semiconductor devices, the third semiconductor device being disposed over the window of the substrate.
22. The method of claim 20 , wherein the encapsulant includes a coefficient of thermal expansion (CTE) substantially equal to a CTE of one of the plurality of semiconductor devices.
23. The method of claim 20 , further including disposing a heat spreader over the semiconductor package.
24. The method of claim 20 , further including disposing an interposer or semiconductor component over the plurality of semiconductor devices, the interposer or semiconductor component including a plurality of contact pads formed over a first surface of the interposer or semiconductor component for connection of additional system components.
25. The method of claim 20 , further including providing the substrate as a leadframe including half-etched leads.
26. A method of making a semiconductor package, comprising:
providing a substrate including a window;
disposing first and second semiconductor devices over a first surface of the substrate proximate to the window of the substrate; and
disposing a third semiconductor device to the first and second semiconductor devices and over the window of the substrate.
27. The method of claim 26 , further including forming an electrical interconnect between one of the first, second, or third semiconductor devices and the substrate.
28. The method of claim 26 , further including depositing an encapsulant over the first, second, and third semiconductor devices, the encapsulant including a coefficient of thermal expansion (CTE) substantially equal to a CTE of one of the first, second, or third semiconductor devices.
29. The method of claim 26 , further including disposing a heat spreader over the semiconductor package.
30. The method of claim 26 , further including disposing an interposer or semiconductor component over the third semiconductor device, the interposer or semiconductor component including a plurality of contact pads formed over a first surface of the interposer or semiconductor component for connection of additional system components.