Slurryless mechanical planarization for substrate reclamation

1. A method of removing material from a patterned semiconductor substrate, said method comprising removing a patterned portion of a patterned semiconductor substrate employing an abrasive mechanical planarization without employing slurry, wherein an abrasive pad including a matrix embedding abrasive particles is employed during said abrasive mechanical planarization, and said matrix comprises a material having less hardness and greater flexibility than a material of said abrasive particles.

2. The method of claim 1 , wherein a remaining portion of said patterned semiconductor substrate after said abrasive mechanical planarization does not contain any patterned structure.

3. The method of claim 1 , wherein said patterned semiconductor substrate includes a bulk semiconductor substrate, a semiconductor-on-insulator (SOI) substrate, or a hybrid semiconductor substrate comprising a bulk portion and a semiconductor-on-insulator (SOI) portion.

4. The method of claim 1 , wherein said patterned portion includes at least one semiconductor device located in a semiconductor layer.

5. The method of claim 1 , wherein said patterned portion includes at least one metal interconnect structure comprising at least one conductive structure and at least one dielectric structure.

6. The method of claim 5 , wherein said patterned semiconductor substrate includes a silicon layer located underneath said patterned portion.

7. The method of claim 6 , wherein a first removal rate of material of said at least one metal interconnect structure is greater than a second removal rate of material of said silicon layer.

8. The method of claim 6 , wherein removal of said at least one metal interconnect structure is non-selective between metallic materials and dielectric materials.

9. The method of claim 8 , wherein said at least one metal interconnect structure is removed selective to silicon.

10. The method of claim 6 , further comprising removing a top portion of said silicon layer by about 1 μm to about 10 μm during said abrasive mechanical planarization.

11. The method of claim 1 , wherein a surface of a remaining portion of said patterned semiconductor substrate contains no pattern, and contains structural damages having a depth from about 5 μm to about 10 μm.

12. The method of claim 1 , wherein said abrasive particles have a hardness greater than 8 Mohs.

13. A method of removing material from a patterned semiconductor substrate, said method comprising removing a patterned portion of a patterned semiconductor substrate employing an abrasive mechanical planarization without employing slurry, wherein an abrasive pad containing abrasive particles is employed during said abrasive mechanical planarization, and wherein said abrasive particles are embedded in a plastic erodible matrix.

14. The method of claim 13 , wherein said plastic erodible matrix comprises polycarbonate or polyurethane.

15. The method of claim 1 , wherein said abrasive particles comprise impregnated diamond particles.

16. The method of claim 15 , wherein said impregnated diamond particles have a diameter from about 3 μm to about 9 μm.

17. The method of claim 16 , wherein water is added to a surface at which removal of material occurs during said abrasive mechanical planarization.

18. The method of claim 1 , wherein water is added to a surface at which removal of material occurs during said abrasive mechanical planarization.

19. The method of claim 18 , wherein said water is deionized water.

20. The method of claim 18 , wherein water is added at a flow rate from about 10 milliliter per minute to about 300 milliliter per minute.

21. The method of claim 1 , wherein said abrasive mechanical planarization is performed by pressing said patterned semiconductor substrate in rotation against an abrasive pad affixed to a platen in rotation.

22. The method of claim 21 , wherein said patterned semiconductor substrate is held by a chuck which rotates with said patterned semiconductor substrate with a same angular velocity.

23. The method of claim 22 , wherein said angular velocity is from about 10 rpm to about 150 rpm, and wherein said rotating platen rotates with another angular velocity from about 10 rpm to about 150 rpm.

24. The method of claim 21 , wherein pressure from 0 psi to about 9.5 psi is applied to a backside of said patterned semiconductor substrate.

25. The method of claim 21 , wherein down force on a surface of said patterned semiconductor substrate contacting said platen is from about 1 psi to 10 psi.

26. The method of claim 21 , wherein said abrasive mechanical planarization has a polish time from about 15 seconds to about 120 seconds.

27. A method of removing material from a patterned semiconductor substrate, said method comprising removing a patterned portion of a patterned semiconductor substrate employing an abrasive mechanical planarization without employing slurry, wherein a remaining portion of said patterned semiconductor substrate after said abrasive mechanical planarization does not contain any patterned structure, wherein said patterned portion includes at least one semiconductor device located in a semiconductor layer, wherein said patterned portion includes at least one metal interconnect structure comprising at least one conductive structure and at least one dielectric structure, wherein an abrasive pad including a matrix embedding abrasive particles is employed during said abrasive mechanical planarization, and said matrix comprises a material having less hardness and greater flexibility than a material of said abrasive particles, wherein water is added to a surface at which removal of material occurs during said abrasive mechanical planarization, and wherein said abrasive mechanical planarization is performed by pressing said patterned semiconductor substrate in rotation against a rotating platen.

28. The method of claim 1 , wherein said matrix is a plastic erodible matrix.