IP Library Granted Patent US 7,936,244
Granted Patent B2
US 7,936,244 · App. 12/114,057 · Granted May 3, 2011

Highly coupled inductor

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Quick Facts
Patent No.
US 7,936,244
App. No.
12/114,057
Granted
May 3, 2011
Kind
B2
Abstract

A highly coupled inductor includes a first ferromagnetic plate, a second ferromagnetic plate, a film adhesive between the first ferromagnetic plate and the second ferromagnetic plate, a first conductor between the first plate and the second plate, and a second conductor between the first plate and the second plate. A conducting electromagnetic shield may be positioned proximate the first conductor for enhancing coupling and reducing leakage flux. A method of manufacturing a highly coupled inductor component includes providing a first ferromagnetic plate and a second ferromagnetic plate, placing conductors between the first ferromagnetic plate and the second ferromagnetic plate, and connecting the first ferromagnetic plate and the second ferromagnetic plate using a film adhesive.

Claims (27)

1. A highly coupled inductor, comprising:

a first ferromagnetic plate;

a second ferromagnetic plate;

a film adhesive between the first ferromagnetic plate and the second ferromagnetic plate;

a first conductor arranged between the first ferromagnetic plate and the second ferromagnetic plate;

a second conductor arranged at a distance from the first conductor between the first ferromagnetic plate and the second ferromagnetic plate; and

a single conducting electromagnetic shield sandwiched between one of the ferromagnetic plates and both of the first and second conductors, spanning the distance between the first and second conductors, for enhancing coupling and reducing leakage flux.

2. The highly coupled inductor of claim 1 further comprising a second conducting electromagnetic shield sandwiched between the other one of the ferromagnetic plates and both of the first and second conductors for reducing leakage flux.

3. The highly coupled inductor of claim 2 wherein the first conducting electromagnetic shield is above the first conductor and the second conductor and wherein the second conducting electromagnetic shield is below the first conductor and the second conductor.

4. The highly coupled inductor of claim 1 wherein the first conductor is parallel with the second conductor.

5. The highly coupled inductor of claim 1 wherein the first ferromagnetic plate is configured to provide four ferromagnetic posts with the first conductor between a first of the ferromagnetic posts and a second, a third, and a fourth of the ferromagnetic posts.

6. The highly coupled inductor of claim 5 wherein the second conductor is disposed between the second of the ferromagnetic posts and the first, third, and fourth of the ferromagnetic posts.

7. The highly coupled inductor of claim 6 further comprising a third conductor disposed between the third of the ferromagnetic posts and the first, second, and fourth of the ferromagnetic posts.

8. The highly coupled inductor of claim 7 further comprising a fourth conductor disposed between the fourth of the ferromagnetic posts and the first, second, and third of the ferromagnetic posts.

9. The highly coupled inductor of claim 8 wherein the electromagnetic shield is formed of an electrically conducting sheet disposed between at least two of the ferromagnetic posts to enhance coupling and reduce magnetic flux leakage.

10. The highly inductor of claim 8 wherein each of the conductors is L-shaped.

11. The highly coupled inductor of claim 10 wherein each conductor further comprises ends bent around the second ferromagnetic plate to provide terminals for connection.

12. A multi-phased coupled inductor with enhanced effecting coupling, comprising:

a first ferromagnetic plate having a plurality of posts;

a second ferromagnetic plate;

a plurality of conductors, each one of the plurality of conductors arranged between two or more of the plurality of posts of the first ferromagnetic plate;

wherein each of the plurality of conductors is positioned between the first ferromagnetic plate and the second ferromagnetic plate, and a single conducting electromagnetic shield is sandwiched between at least two of the plurality of posts and at least two adjacent ones of the plurality of conductors to enhance coupling and reduce magnetic flux leakage.

13. The multi-phased coupled inductor of claim 12 , wherein the conducting electromagnetic shield is formed as an electrically conducting sheet.

14. The multi-phased coupled inductor of claim 12 wherein the plurality of posts are configured in a 2×2 array.

15. The multi-phased coupled inductor of claim 12 wherein each conductor is substantially L-shaped.

16. The multi-phased coupled inductor of claim 15 wherein each conductor further comprises ends bent around one of the first and the second ferromagnetic plates to provide terminals for connection.

17. The multi-phased coupled inductor of claim 12 further comprising a film adhesive 10 between the first ferromagnetic plate and the second ferromagnetic plate.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.; VISHAY TECHNO COMPONENTS, LLC; VISHAY EFI, INC.; VISHAY VITRAMON, INC.; SPRAGUE ELECTRIC COMPANY
Reel/Frame 049826/0312 →
SECURITY AGREEMENT Recorded Jan 21, 2011
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 025675/0001 →
RELEASE OF SECURITY INTEREST Recorded Dec 14, 2010
From: COMERICA BANK, AS AGENT, A TEXAS BANKING ASSOCIATION (FORMERLY A MICHIGAN BANKING CORPORATION)
To: VISHAY SPRAGUE, INC., SUCCESSOR-IN-INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC, A DELAWARE CORPORATION; VISHAY DALE ELECTRONICS, INC., A DELAWARE CORPORATION; VISHAY INTERTECHNOLOGY, INC., A DELAWARE CORPORATION; SILICONIX INCORPORATED, A DELAWARE CORPORATION; VISHAY MEASUREMENTS GROUP, INC., A DELAWARE CORPORATION; VISHAY GENERAL SEMICONDUCTOR, LLC, F/K/A GENERAL SEMICONDUCTOR, INC., A DELAWARE LIMITED LIABILITY COMPANY; VISHAY VITRAMON, INCORPORATED, A DELAWARE CORPORATION; YOSEMITE INVESTMENT, INC., AN INDIANA CORPORATION
Reel/Frame 025489/0184 →
SECURITY AGREEMENT Recorded Mar 2, 2010
From: VISHAY SPRAGUE, INC., SUCCESSOR IN INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC; VISHAY DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY MEASUREMENTS GROUP, INC.
To: COMERICA BANK, AS AGENT
Reel/Frame 024006/0515 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 2, 2008
From: HANSEN, THOMAS T.
To: VISHAY DALE ELECTRONICS, INC.
Reel/Frame 020891/0517 →