IP Library Granted Patent US 8,322,220
Granted Patent B2
US 8,322,220 · App. 12/119,382 · Granted Dec 4, 2012

Non-destructive wafer-scale sub-surface ultrasonic microscopy employing near field AFM detection

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Quick Facts
Patent No.
US 8,322,220
App. No.
12/119,382
Granted
Dec 4, 2012
Kind
B2
Abstract

A method, and corresponding apparatus, of imaging sub-surface features at a plurality of locations on a sample includes coupling an ultrasonic wave into a sample at a first lateral position. The method then measures the amplitude and phase of ultrasonic energy near the sample with a tip of an atomic force microscope. Next, the method couples an ultrasonic wave into a sample at a second lateral position and the measuring step is repeated for the second lateral position. Overall, the present system and methods achieve high resolution sub-surface mapping of a wide range of samples, including silicon wafers. It is notable that when imaging wafers, backside contamination is minimized.

Claims (57)

1. A method of imaging sub-surface features of a sample, the method comprising the steps of:

providing a scanning probe microscope (SPM), the SPM including a probe having a cantilever bearing a tip;

providing an ultrasonic source that directs ultrasonic energy into the sample;

coupling the ultrasonic energy from the ultrasonic source into a section of the sample at a first position;

using the probe to detect an interaction between the incident ultrasonic energy and a sub-surface feature of the sample;

successively moving at least one of the sample and the ultrasonic source with a translation stage to generate relative motion between the ultrasonic source and the sample so as to couple ultrasonic energy into different sections of the sample; and

further including providing a second ultrasonic source coupled to the probe that produces an ultrasonic drive wave so as to create a beat signal having a beat frequency, thereby down converting the detected interaction.

2. The method of claim 1 , further including coupling an ultrasonic wave into the sample at a second position and repeating the measuring step for the second position.

3. The method of claim 2 , wherein coupling an ultrasonic wave into the sample is nondestructive to the sample.

4. The method of claim 1 , further including controlling tip-sample interaction so as to elicit a nonlinear probe response.

5. The method of claim 4 , wherein controlling tip-sample interaction includes tuning the non-linear probe response using feedback.

6. The method of claim 1 , wherein providing a second ultrasonic source coupled to the probe includes integrating a piezoelectric transducer operating at GHz frequencies with the probe.

7. The method of claim 1 , wherein providing an ultrasonic source includes providing a ultrasonic transducer focusing generated ultrasonic waves into the section of the sample at the first position.

8. The method of claim 7 , wherein focusing generated ultrasonic waves includes using a Fresnel lens coupled to the ultrasonic transducer to focus the waves.

9. The method of claim 7 , wherein the ultrasonic source is driven to excite plural harmonics.

10. The method of claim 1 , wherein coupling an ultrasonic wave into a section of the sample includes providing a liquid coupling of the ultrasonic source to the sample.

11. The method of claim 1 , wherein coupling an ultrasonic wave into a section of the sample includes continuous wave laser acoustic excitation.

12. The method of claim 1 , further comprising the step of reconstructing a sub-surface structure of the sample based on the detected interaction, and wherein the resolution of the reconstruction step is better than 100 nm.

13. The method of claim 1 , wherein said using step includes measuring at least one of amplitude and phase of cantilever motion.

14. The method of claim 1 , wherein measuring the amplitude and phase of ultrasonic energy includes using at least one of a group including an expected composition and an expected structure for the sample to guide the measurement.

15. The instrument of claim 1 , wherein the moving step provides translation between at least first and second sections of the sample in less than 5 minutes.

16. The instrument of claim 1 , wherein the moving step provides translation between at least first and second sections of the sample in less than 10 seconds.

17. The method of claim 1 , wherein the beat frequency is tuned to a frequency corresponding to a resonant frequency of the probe.

18. The method of claim 17 , wherein the ultrasonic energy has a corresponding frequency, f 1 , and the ultrasonic drive wave has a frequency, f 2 , and wherein the relationship nf 2 −f 1 is substantially equal to a resonant frequency of the probe, wherein n is an integer multiple corresponding to a harmonic of f 2 .

19. A probe-based instrument for detecting sub-surface features of a sample, the instrument comprising:

a scanning probe microscope (SPM), the SPM including a probe having a cantilever bearing a tip;

an ultrasonic source configured to provide an ultrasonic wave into a section of the sample at a first position;

a translation stage that provides relative movement between the sample relative to both the probe and the ultrasonic source;

a beat signal detector, the detector measuring an interaction between the incident ultrasonic energy and a sub-surface feature of the sample;

a second ultrasonic source coupled to the probe that produces an ultrasonic drive wave so as to create a beat signal having a beat frequency, and thereby down converting the detected interaction.

20. The probe-based instrument of claim 19 , further including an actuator controlling tip-sample separation using a feedback loop until a non-linear response of the probe is optimized.

21. The probe-based instrument of claim 19 , wherein the sample is a semiconductor wafer of at least 200 mm in diameter.

22. The probe-based instrument of claim 19 , wherein the ultrasonic coupling is non-destructive to the sample.

23. The probe-based instrument of claim 22 , wherein fewer than 1000 particles are added to the backside of the wafer by the coupling and measurement steps.

24. The probe-based instrument of claim 19 , wherein the ultrasonic source is coupled to the sample via a liquid.

25. The probe-based instrument of claim 19 , wherein the interaction causes cantilever motion, and wherein the detector measures at least one of amplitude and phase of the cantilever motion.

26. The instrument of claim 19 , wherein the ultrasonic wave has a corresponding frequency, f 1 , and the ultrasonic drive wave has a frequency, f 2 , and wherein the relationship nf 2 −f 1 is substantially equal to a resonant frequency of the probe, wherein n is an integer multiple corresponding to a harmonic of f 2 .

27. A method of imaging sub-surface features locations of a sample, the method comprising the steps of:

providing a probe having a cantilever and a probe tip;

providing first and second ultrasonic sources generating first and second ultrasonic waves that are successively coupled into different locations on the sample;

providing at least one translation stage configured to provide relative motion between the sample and the first and second ultrasonic sources;

coupling an ultrasonic wave from the first ultrasonic source into a section of the sample;

driving the probe with ultrasonic energy from the second ultrasonic source;

measuring ultrasonic energy substantially at the sample surface caused by an interaction of the ultrasonic energy from the first and second ultrasonic sources;

moving at least one of the sample, the first ultrasonic source, and the second ultrasonic source to generate relative motion and to allow measurement at a second section of the sample; and

wherein the measurement of the ultrasonic energy includes detection of a beat signal generated by coupling of at least one of the harmonics of the first ultrasonic source and the second ultrasonic source, the beat signal representing a down conversion of the detected interaction.

28. The method of claim 27 , wherein providing a second ultrasonic source coupled to the probe includes integrating a piezoelectric transducer operating at GHz frequencies into the tip of the probe.

29. The method of claim 28 , wherein the tuning step includes a feedback loop.

30. The method of claim 27 , further including tuning a non-linear response of the probe to probe sample interaction so as to create a beat signal having a frequency substantially corresponding to one of the probe resonances.

31. The method of claim 27 , wherein coupling the ultrasonic wave from the first ultrasonic source into a section of the sample includes providing a liquid coupling of the ultrasonic source to the sample.

32. The method of claim 27 , further comprising the step of reconstructing a sub-surface structure of the sample based on the measurement and wherein the resolution of the reconstruction step is better than 100 nm.

33. A method of imaging sub-surface features at a plurality of locations on a sample, the method comprising the steps of:

releasably coupling an ultrasonic wave to a sample;

exciting a probe of a scanning probe microscope with an ultrasonic signal having a frequency greater than 1 GHz;

positioning the probe relative to the sample to optimize a non-linear reaction between the probe and the sample; and

detecting a beat signal to detect subsurface features of the sample to a resolution greater than 20 nm.

34. The method of claim 33 , wherein the releasably coupling step includes providing a source that generates the ultrasonic wave in an internal cavity of a sample holder, and wherein the ultrasonic wave is coupled to the sample via a liquid interface.

Assignments (3)
CHANGE OF NAME Recorded Oct 24, 2011
From: VEECO METROLOGY INC.
To: BRUKER NANO, INC.
Reel/Frame 027111/0461 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2010
From: VEECO INSTRUMENTS INC.
To: VEECO METROLOGY INC.
Reel/Frame 025051/0290 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2008
From: SU, CHANMIN; PRATER, CRAIG
To: VEECO INSTRUMENTS INC.
Reel/Frame 020938/0473 →