Integrated circuit package system with relief

1. A method for manufacturing an integrated circuit package system comprising:

providing a die pad with a top and a bottom, the bottom having a wall, a center pad, and a relief having a flat surface, the relief physically defining an inner sidewall of the wall and a pad sidewall of the center pad with the inner sidewall directly facing the pad sidewall, the wall includes an outer sidewall on a side of the wall facing opposite to the inner sidewall;

mounting a barrier under the bottom of the die pad;

mounting an integrated circuit die on the top of the die pad, with a die sidewall of the integrated circuit die between the inner sidewall and the pad sidewall;

encapsulating the integrated circuit die and the die pad with an encapsulation, the encapsulating entirely covering the outer sidewall and wherein the bottom, the inner sidewall, the flat surface of the relief and the center pad are entirely exposed from the encapsulation;

detaching the barrier; and

mounting an external interconnect on the center pad.

2. The method as claimed in claim 1 wherein:

providing the die pad with the center pad includes providing a quadrilateral center pad.

3. The method as claimed in claim 1 wherein:

providing the die pad with the center pad includes providing a circular center pad.

4. The method as claimed in claim 1 wherein:

providing the die pad includes providing quadrilateral multiple center pads.

5. The method as claimed in claim 1 wherein:

providing the die pad includes a pre-plated finish material of gold, palladium, and nickel.

6. A method for manufacturing an integrated circuit package system comprising:

providing a die pad with a top and a bottom, the bottom having a wall, multiple center pads, and a relief with a flat surface, the relief physically defining an inner sidewall of the wall and a pad sidewall of a pad of the multiple center pads with the inner sidewall directly facing the pad sidewall, the wall includes an outer sidewall on a side of the wall facing opposite to the inner sidewall;

mounting a barrier under the bottom of the die pad;

mounting an integrated circuit die on the top of the die pad, with a die sidewall of the integrated circuit die between the inner sidewall and the pad sidewall;

encapsulating the integrated circuit die and the die pad with an encapsulation, the encapsulation entirely covering the outer sidewall and wherein the bottom, the inner sidewall, the flat surface of the relief and the multiple center pads are entirely exposed from the encapsulation;

detaching the barrier; and

mounting a solder bump on each of the multiple center pads.

7. The method as claimed in claim 6 wherein:

providing the die pad with the multiple center pads includes providing quadrilateral multiple center pads, circular multiple center pads, or quadrilateral multiple center pads.

8. The method as claimed in claim 6 wherein:

mounting the integrated circuit die on the die pad includes mounting a wire-bonded die with an active side and attached with a die attach adhesive.

9. The method as claimed in claim 6 further comprising:

providing half-etched bond fingers; and wherein:

mounting the solder bump includes mounting the solder bump below the half-etched bond fingers; and

connecting the integrated circuit die includes connecting the integrated circuit die with bond wires to the half-etched bond fingers.

10. The method as claimed in claim 6 wherein:

mounting the solder bump includes the pad sidewall exposed from the solder bump.

11. An integrated circuit package system comprising:

a die pad with a top and a bottom, the bottom having a wall, a center pad, and a relief having a flat surface, the relief physically defining an inner sidewall of the wall and a pad sidewall of the center pad with the inner sidewall directly facing the pad sidewall, the wall includes an outer sidewall on a side of the wall facing opposite to the inner sidewall;

an integrated circuit die mounted on the top of the die pad, with a die sidewall of the integrated circuit die between the inner sidewall and the pad sidewall;

an encapsulation formed on the integrated circuit die and the die pad, the encapsulation entirely covering the outer sidewall and wherein the bottom, the inner sidewall, the flat surface of the relief and the center pads are entirely exposed from the encapsulation; and

an external interconnect mounted on the center pad.

12. The system as claimed in claim 11 wherein:

the center pad is a quadrilateral center pad.

13. The system as claimed in claim 11 wherein:

the center pad is a circular center pad.

14. The system as claimed in claim 11 wherein:

the die pad includes quadrilateral multiple center pads.

15. The system as claimed in claim 11 wherein:

the die pad includes a pre-plated finish material of gold, palladium, and nickel.

16. The system as claimed in claim 11 wherein:

the die pad includes multiple center pads; and

the external interconnect is a solder bump.

17. The system as claimed in claim 16 wherein:

the multiple center pads are quadrilateral multiple center pads, circular multiple center pads, or quadrilateral multiple center pads.

18. The system as claimed in claim 16 wherein:

the integrated circuit die mounted on the top of the die pad is a wire-bonded die with an active side and attached with a die attach adhesive.

19. The system as claimed in claim 16 further comprising:

a bond finger;

a bond wire between the integrated circuit die and the bond finger; and wherein:

the solder bump is mounted below the bond finger.

20. The system as claimed in claim 16 wherein:

the solder bump is mounted to each of the multiple center pads and the pad sidewall is exposed from the solder bump.