Integrated circuit package system with triple film spacer having embedded fillers and method of manufacture thereof
An integrated circuit package in package system includes: providing a substrate with a first wire-bonded die mounted thereover, and connected to the substrate with bond wires; mounting a triple film spacer above the first wire-bonded die, the triple film spacer having fillers in a first film and in a third film, and having a second film separating the first film and the third film, and the bond wires connecting the first wire-bonded die to the substrate are embedded in the first film; and encapsulating the first wire-bonded die, the bond wires, and the triple film spacer with an encapsulation.
1. A method for manufacturing an integrated circuit package in package system comprising:
providing a substrate with a first wire-bonded die mounted thereover, and connected to the substrate with bond wires;
mounting a triple film spacer above the first wire-bonded die, the triple film spacer having fillers in a first film and in a third film, and having a second film separating the first film and the third film, and the bond wires connecting the first wire-bonded die to the substrate are embedded only in the first film and underneath the second film; and
encapsulating the first wire-bonded die, the bond wires, and the triple film spacer with an encapsulation.
2. The method as claimed in claim 1 wherein:
mounting the triple film spacer includes mounting the triple film spacer with the first film having a lesser weight percentage of fillers than the weight percentage of fillers in the third film.
3. The method as claimed in claim 1 wherein:
mounting the triple film spacer includes mounting the triple film spacer with the third film having smaller sized fillers than the fillers of the first film.
4. The method as claimed in claim 1 wherein:
mounting the triple film spacer includes mounting the triple film spacer with the third film having a smaller thickness than the thickness of the first film.
5. The method as claimed in claim 1 wherein:
mounting the triple film spacer includes mounting the triple film spacer having the fillers size maintain a bond line thickness allowing the bond wires to penetrate the first film and not be deformed.
6. A method for manufacturing an integrated circuit package in package system comprising:
providing a substrate with a first wire-bonded die mounted thereover, and connected to the substrate with bond wires;
mounting a triple film spacer above the first wire-bonded die, the triple film spacer having fillers in a first film and in a third film, and having a second film separating the first film and the third film, and the bond wires connecting the first wire-bonded die to the substrate are embedded only in the first film and underneath the second film;
mounting a second wire-bonded die with an active side above the triple film spacer and connecting the active side of the second wire-bonded die to the substrate with the bond wires; and
encapsulating the first wire-bonded die, the bond wires, and the triple film spacer with an encapsulation.
7. The method as claimed in claim 6 wherein:
mounting the triple film spacer includes mounting the triple film spacer with the fillers comprised of glass or polymer.
8. The method as claimed in claim 6 wherein:
mounting the triple film spacer includes mounting the triple film spacer with the fillers being between 10-50 weight percentage of the first film or the third film.
9. The method as claimed in claim 6 wherein:
mounting the triple film spacer includes mounting the triple film spacer with the second film for compensating for any property mismatches that occur when the first film and the third film are of differing or incompatible materials.
10. The method as claimed in claim 6 wherein:
mounting the triple film spacer includes mounting the triple film spacer with the fillers being a maximum 20 μm wide.
11. An integrated circuit package in package system comprising:
a substrate with a first wire-bonded die mounted thereover, and connected to the substrate with bond wires;
a triple film spacer mounted above the first wire-bonded die, the triple film spacer having fillers in a first film and in a third film, and having a second film separating the first film and the third film, and the bond wires connecting the first wire-bonded die to the substrate are embedded only in the first film and underneath the second film; and
an encapsulation encapsulating the first wire-bonded die, the bond wires, and the triple film spacer.
12. The system as claimed in claim 11 wherein:
the first film has a lesser weight percentage of fillers than the weight percentage of fillers in the third film.
13. The system as claimed in claim 11 wherein:
the third film has smaller sized fillers than the fillers of the first film.
14. The system as claimed in claim 11 wherein:
the third film is smaller in thickness than the thickness of the first film.
15. The system as claimed in claim 11 wherein:
the fillers size maintains a bond line thickness allowing the bond wires to penetrate the first film and not be deformed.
16. The system as claimed in claim 11 further comprising:
mounting a second wire-bonded die with an active side above the triple film spacer and connecting the active side of the second wire-bonded die to the substrate with the bond wires.
17. The system as claimed in claim 16 wherein:
the fillers are glass or polymer.
18. The system as claimed in claim 16 wherein:
the fillers are between 10-50 weight percentage of the first film or the third film.
19. The system as claimed in claim 16 wherein:
the second film is used for compensating for any property mismatches that occur when the first film and the third film are of differing or incompatible materials.
20. The system as claimed in claim 16 wherein:
the fillers are a maximum 20 μm wide.