Integrated circuit package system with integral inner lead and paddle
An integrated circuit package system includes: fabricating a lead frame including: providing inner leads having an inner lead pitch of progressive length, forming a lead shoulder, on the inner leads, having a shoulder height of a progressive height, and forming outer leads coupled to the lead shoulder and the inner leads; mounting an integrated circuit die on the lead frame; and molding a package body on the lead frame and the integrated circuit die.
1. An integrated circuit package system comprising:
fabricating a lead frame includes:
providing inner leads having progressively increasing inner lead pitches between the inner leads which are adjacent to each other,
forming a lead shoulder of the inner leads, the lead shoulder having a progressively increasing shoulder extent measured along an edge of the inner leads defined by a line between a corner of the lead shoulders and an end of a curved edge of the inner leads, and
forming outer leads coupled to the lead shoulder and the inner leads;
mounting an integrated circuit die on the lead frame; and
molding a package body on the lead frame and the integrated circuit die.
2. The system as claimed in claim 1 further comprising forming a radial portion of the inner leads between the outer leads and the lead shoulder for preventing cracks in the outer leads.
3. The system as claimed in claim 1 further comprising providing an interface pad on the integrated circuit die.
4. The system as claimed in claim 1 further comprising coupling an electrical interconnect between the integrated circuit die and the inner leads.
5. The system as claimed in claim 1 further comprising forming a tie bar on the lead frame for supporting a die attach paddle.
6. An integrated circuit package system comprising:
fabricating a lead frame includes:
providing inner leads having progressively increasing inner lead pitches between the inner leads which are adjacent to each other including providing an inner lead width of progressive width,
forming a lead shoulder of the inner leads, the lead shoulder having a progressively increasing shoulder extent measured along an edge of the inner leads defined by a line between a corner of the lead shoulders and an end of a curved edge of the inner leads, and
forming outer leads coupled to the lead shoulder and the inner leads, and
forming a die attach paddle surrounded by the inner leads;
mounting an integrated circuit die on the lead frame including applying an adhesive between the integrated circuit die and the die attach paddle; and
molding a package body on the lead frame and the integrated circuit die including encasing the die attach paddle.
7. The system as claimed in claim 6 further comprising forming the radial portion of the inner leads between the outer leads and the lead shoulder for preventing cracks in the outer leads by distributing a force from the outer leads through the lead shoulder having the shoulder extent.
8. The system as claimed in claim 6 further comprising providing an interface pad on the integrated circuit die for coupling an electrical interconnect between the interface contact and the inner leads.
9. The system as claimed in claim 6 wherein fabricating the lead frame includes etching or punching a sheet of conductive material including aluminum (Al), iron (Fe), tin (Sn), nickel (Ni), copper (Cu), or an alloy thereof.
10. The system as claimed in claim 6 wherein forming the die attach paddle on the lead frame includes coupling a tie bar between the die attach paddle and the lead frame.
11. An integrated circuit package system comprising:
a lead frame includes:
inner leads having progressively increasing inner lead pitches between the inner leads which are adjacent to each other,
a lead shoulder of the inner leads, the lead shoulder having a progressively increasing shoulder extent measured along an edge of the inner leads defined by a line between a corner of the lead shoulders and an end of a curved edge of the inner leads, and
outer leads coupled to the lead shoulder and the inner leads;
an integrated circuit die mounted on the lead frame; and
a package body molded on the lead frame and the integrated circuit die.
12. The system as claimed in claim 11 further comprising a radial portion of the lead frame between the outer leads and the lead shoulder for preventing cracks in the outer leads.
13. The system as claimed in claim 11 further comprising an interface pad on the integrated circuit die.
14. The system as claimed in claim 11 further comprising an electrical interconnect between the integrated circuit die and the inner leads.
15. The system as claimed in claim 11 further comprising a tie bar on the lead frame coupled to a die attach paddle.
16. The system as claimed in claim 11 further comprising:
the lead frame includes:
an inner lead width of a progressive width, and
a die attach paddle surrounded by the inner leads; and
an adhesive between the integrated circuit die and the die attach paddle includes the die attach paddle encased by the package body.
17. The system as claimed in claim 16 further comprising a radial portion of the lead frame between the outer leads and the lead shoulder for preventing cracks in the outer leads by a force distributed from the outer leads through the lead shoulder having the shoulder extent.
18. The system as claimed in claim 16 further comprising an interface pad on the integrated circuit die includes an electrical interconnect between the interface contact and the inner leads.
19. The system as claimed in claim 16 wherein fabricating the lead frame from a sheet of conductive material includes aluminum (Al), iron (Fe), tin (Sn), nickel (Ni), copper (Cu), or an alloy thereof etched or punched.
20. The system as claimed in claim 16 wherein the die attach paddle on the lead frame includes a tie bar between the die attach paddle and the lead frame.