Low thermal mass semiconductor wafer support
View Patent ↗A support for a semiconductor wafer includes a plate having a support surface for supporting the wafer and a recessed surface spaced from the support surface and spaced from the wafer. A plurality of holes extends from the recessed surface, and the support surface is free of holes to inhibit contamination of the wafer.
1. A wafer boat including a support for a semiconductor wafer, the support comprising a plate including a support surface defining a substantially smooth, planar surface for supporting the wafer and a recessed surface spaced below the support surface and thereby spaced below the wafer, a plurality of arc-shaped holes extending from the recessed surface, and the support surface being free of holes to inhibit contamination of the wafer, wherein the plurality of arc-shaped holes inhibit slip in the semiconductor wafer during high temperature processing of the semiconductor wafer.
2. The wafer boat and support of claim 1 in combination with a semiconductor wafer.
3. The wafer boat and support of claim 1 wherein the plate is C shaped.
4. The wafer boat and support of claim 1 wherein the plate has a bottom surface and the arc-shaped holes extend from the recessed surface through to the bottom surface.
5. The wafer boat and support of claim 1 in combination with a semiconductor wafer, wherein the area of the plate is less than 50% of that of the wafer.
6. The wafer boat and support of claim 5 wherein the area of the plate is less than 40% of that of the wafer.
7. The wafer boat and support of claim 1 wherein the plate is made of one of silicon carbide, silicon nitride and silicon.
8. The wafer boat and support of claim 1 wherein the support surface includes two plateaus separated by the recessed surface.
9. The wafer boat and support of claim 8 wherein the recessed surface is defined by a groove.
10. A wafer boat including a support for a semiconductor wafer, the support comprising a plate including a support surface defining a substantially smooth, planar surface for supporting the wafer and a recessed surface spaced below the support surface and thereby spaced below the wafer, a plurality of holes extending from the recessed surface, and the support surface being free of holes to inhibit contamination of the wafer, wherein the area of the plate is less than 50% of that of the semiconductor wafer.
11. The wafer boat and support of claim 10 wherein the plurality of holes are arc-shaped.
12. The wafer boat and support of claim 10 wherein the plate has a bottom surface and the arc-shaped holes extend from the recessed surface through to the bottom surface.
13. The wafer boat and support of claim 10 wherein the support surface includes two plateaus separated by the recessed surface.
14. The wafer boat and support of claim 13 wherein the recessed surface is defined by a groove.
15. A wafer boat including a support for a semiconductor wafer, the support comprising a plate including a support surface defining a substantially smooth, planar surface for supporting the wafer and a recessed surface spaced below the support surface and thereby spaced below the wafer, a first plurality of holes and a second plurality of holes extending from the recessed surface, and the support surface being free of holes to inhibit contamination of the wafer, wherein the first plurality of holes are disposed a first distance from a center of the plate and the second plurality of holes are disposed a second distance from the center of the plate, the first distance greater than the second distance.
16. The wafer boat and support of claim 15 wherein the first plurality of holes are arc-shaped and the second plurality of holes are arc-shaped.
17. The wafer boat and support of claim 15 wherein the plate has a bottom surface and the first plurality of holes and the second plurality of holes extend from the recessed surface through to the bottom surface.
18. The wafer boat and support of claim 15 wherein the support surface includes two plateaus separated by the recessed surface.
19. The wafer boat and support of claim 18 wherein the recessed surface is defined by a groove.