Integrated circuit package system with concave terminal
View Patent ↗An integrated circuit package system includes: connecting a concave terminal and an integrated circuit; and forming an encapsulation, having a bottom side, over the integrated circuit and the concave terminal with the concave terminal within the encapsulation.
1. A method of forming an integrated circuit package system comprising:
connecting a concave terminal and an integrated circuit, the concave terminal having a curved inner surface and a curved outer surface; and
forming an encapsulation, having a bottom side, over the integrated circuit and the concave terminal with the concave terminal within the encapsulation.
2. The method as claimed in claim 1 further comprising:
forming a paddle;
mounting the integrated circuit over the paddle; and
wherein forming the encapsulation includes:
filling the paddle with the encapsulation.
3. The method as claimed in claim 1 wherein forming the encapsulation with the concave terminal within the encapsulation includes surrounding the concave terminal arched within the encapsulation.
4. The method as claimed in claim 1 wherein forming the encapsulation with the concave terminal within the encapsulation and non-planar with the bottom side includes forming the encapsulation with the concave terminal non-planar with the bottom side.
5. The method as claimed in claim 1 further comprising forming an external interconnect partially within the concave terminal.
6. A method of forming an integrated circuit package system comprising:
connecting a concave terminal and an integrated circuit, the concave terminal having a curved inner surface and a curved outer surface; and
forming an encapsulation, having a bottom side, over the integrated circuit and the concave terminal with the concave terminal arched within the encapsulation and non-planar with the bottom side without extending beyond the bottom side.
7. The method as claimed in claim 6 further comprising:
forming a paddle and the concave terminal with the paddle extended beyond the bottom side; and
mounting the integrated circuit over the paddle.
8. The method as claimed in claim 6 further comprising:
applying an adhesive; and
mounting the integrated circuit over the adhesive.
9. The method as claimed in claim 6 further comprising:
applying an adhesive;
mounting the integrated circuit over the adhesive; and
wherein forming the encapsulation includes:
exposing the adhesive.
10. The method as claimed in claim 6 further comprising forming a paddle extended from the bottom side.
11. An integrated circuit package system comprising:
a concave terminal having a curved inner surface and a curved outer surface;
an integrated circuit connected with the concave terminal; and
an encapsulation, having a bottom side, over the integrated circuit and the concave terminal with the concave terminal within the encapsulation.
12. The system as claimed in claim 11 further comprising a paddle with the integrated circuit thereover and the paddle filled with the encapsulation.
13. The system as claimed in claim 11 wherein the concave terminal arched within the encapsulation.
14. The system as claimed in claim 11 wherein the concave terminal non-planar with the bottom side of the encapsulation.
15. The system as claimed in claim 11 further comprising an external interconnect partially within the concave terminal.
16. The system as claimed in claim 11 wherein the concave terminal arched within the encapsulation and not extended beyond the bottom side.
17. The system as claimed in claim 16 further comprising a paddle extended from the bottom side with the integrated circuit over the paddle.
18. The system as claimed in claim 16 further comprising an adhesive with the integrated circuit over the adhesive.
19. The system as claimed in claim 16 further comprising an adhesive with the integrated circuit over the adhesive and the adhesive exposed by the encapsulation.
20. The system as claimed in claim 16 further comprising a paddle extended from the bottom side and not above the bottom side.