Exposed interconnect for a package on package system
View Patent ↗An integrated circuit package system includes: providing a substrate; mounting an integrated circuit above the substrate; connecting an interposer to the integrated circuit with a wire-in-film adhesive; connecting an exposed interconnect having an upper surface to the substrate; and encapsulating the integrated circuit with an encapsulation.
1. An integrated circuit package system comprising:
a substrate;
an integrated circuit mounted above the substrate;
an interposer connected to the integrated circuit with a wire-in-film adhesive;
an exposed interconnect connected to the substrate; and
an encapsulation encapsulating the integrated circuit and a portion of the exposed interconnect, the exposed interconnect exposed from the encapsulation; and
a passive component mounted to the exposed interconnect.
2. The system as claimed in claim 1 further comprising:
an upper surface of the exposed interconnect exposed from the encapsulation.
3. The system as claimed in claim 1 further comprising:
a bare side on the exposed interconnect exposed from the encapsulation.
4. The system as claimed in claim 1 further comprising:
a bare top on the upper surface of the exposed interconnect exposed from the encapsulation.
5. The system as claimed in claim 1 further comprising:
a package mounted above the interposer.
6. The system as claimed in claim 5 wherein:
the exposed interconnect has a stacked structure.
7. The system as claimed in claim 5 wherein:
the package is electrically connected to the interposer or to the exposed interconnect.
8. The system as claimed in claim 5 wherein:
the package is mounted on the encapsulation and over the interposer.
9. The system as claimed in claim 5 further comprising:
an inner package mounted to the interposer.
10. A method for manufacturing an integrated circuit package system comprising:
providing a substrate;
mounting an integrated circuit above the substrate;
connecting an interposer to the integrated circuit with a wire-in-film adhesive;
connecting an exposed interconnect having an upper surface to the substrate;
encapsulating the integrated circuit and a portion of the exposed interconnect with an encapsulation, the exposed interconnect exposed from the encapsulation; and
mounting a passive component to the exposed interconnect.
11. The method as claimed in claim 1 wherein:
encapsulating includes encapsulating the exposed interconnect having the upper surface of the exposed interconnect exposed.
12. The method as claimed in claim 1 wherein:
encapsulating includes encapsulating the exposed interconnect having the upper surface of the exposed interconnect exposed; and
further comprising:
forming a bare side on the exposed interconnect.
13. The method as claimed in claim 1 wherein:
encapsulating includes encapsulating the exposed interconnect; and
further comprising:
forming a bare top on the upper surface of the exposed interconnect.
14. A method for manufacturing an integrated circuit package system comprising:
providing a substrate;
mounting an integrated circuit above the substrate;
connecting an interposer to the integrated circuit with a wire-in-film adhesive;
connecting an exposed interconnect having an upper surface to the substrate;
encapsulating the integrated circuit and a portion of the exposed interconnect with an encapsulation having a mold riser above the interposer, the exposed interconnect exposed from the encapsulation; and
mounting a passive component to the exposed interconnect.
15. The method as claimed in claim 14 wherein:
connecting the exposed interconnect includes forming the exposed interconnect having a stacked structure.
16. The method as claimed in claim 14 further comprising:
connecting a second package electrically to the interposer or to the exposed interconnect.
17. The method as claimed in claim 14 further comprising:
mounting a package on the encapsulation and over the interposer.
18. The method as claimed in claim 14 further comprising:
connecting an inner package to the interposer.